Heat sink assembly for densely packed transistors

• US 4,872,089 A
• Filed: 12/19/1988
• Issued: 10/03/1989
• Est. Priority Date: 12/19/1988
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Kowieski, Raymond J., Charlier, Michael L., Ocken, Alfred G.
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/286,001
• Time in Patent Office: 288 Days
• Field of Search: 361/417-420, 361/400, 361/403, 361/405, 361/386, 361/387, 361/388, 357/81, 165/80.2, 165/80.3, 165/185, 174/16.3
• US Class Current: 361/710
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/12 Resilient or clamping means for holding component to structure

Abstract

A heat sink assembly for a plurality of transistors includes specially-formed spring clips and a specially-formed heat sink to hold the transistors firmly on the heat sink, and a lead protector that mates with the heat sink to receive and protect the leads of the transistors during handling. The lead protector and the heat sink include integrally-formed fastener/alignment pins for aligning the lead protector with the heat sink, and for aligning the completed heat sink assembly with a circuit board and for holding the assembly securely fastened to the circuit board. A particular feature of the lead protector permits it to mate with heat sink in a first discrete position in which it receives and protects the transistor leads, and to more closely mate with the heat sink in a second discrete position in which the transistor leads pass through the lead protector and into target holes in the circuit board.

Claims

1. A heat sink assembly for a plurality of transistors, comprising;

a metal heat sink having a top, a bottom, and side walls, at least one of the side walls being adapted to receive a plurality of transistors, each transistor being situated at a predetermined transistor site on the side wall;

a plurality of spaced-apart ramp surfaces carried by the heat sink and situated near the top thereof, each ramp surface extending downwardly and outwardly from the top of the heat sink, the space between adjacent ramp surfaces defining a clip space, and each clip space being located above a transistor site;

a resilient spring clip for each clip space, each spring clip being substantially U-shaped and comprising a horizontal member joined to a pair of downwardly extending legs, at least one leg of each spring clip having a relatively narrow portion close to its horizontal member and a relatively wider portion at its opposite end, the dimensions of the legs being selected such that, as a clip is inserted into a clip space, the wider portion of its one leg bears on a pair of adjacent ramp surfaces, and the same leg is spread outwardly by the ramp surfaces as the spring clip is urged downwardly until the relatively wider portion of said leg disengages from the previously engaged ramp surfaces, whereupon the leg snaps back to hold a transistor in place against a side wall.

2. A heat sink assembly as set forth in claim 1 further including a lead protector that has a base member with lead holes therein to receive leads from the transistors, the lead protector also having means for attachment to the heat sink such that, when the lead protector is attached to the heat sink, the transistor leads are received by the lead holes in the base member.

3. A heat sink assembly as set forth in claim 2 for attachment to a circuit board having at least one hole therein, wherein the base member carries a downwardly extending, expandable foot that is at least partially hollow and that mates with the hole in the circuit board to attach the base member to the circuit board, and wherein the heat sink includes a pin extending from the bottom thereof such that, when the lead protector is attached to the heat sink, the pin extends into the foot and expands it to more securely attach it to the circuit board.

4. A heat sink assembly as set forth in claim 2 wherein said means for attachment includes a pair of arms extending upwardly from opposite ends of the base member, each arm carrying a protrusion that extends toward the other arm, and the heat sink having end walls that carry means for receiving said protrusions.

5. A heat sink assembly as set forth in claim 4 wherein the arms of the lead protector are flexible, and wherein the receiving means carried by each end wall of the heat sink comprises:

a ramp portion on which a protrusion bears as the lead protector is mated with the heat sink, the ramp portion urging the protrusion outwardly away from the heat sink as the lead protector'"'"'s base member is urged upwardly toward the bottom of the heat sink, the ramp portion terminating in a first ledge so that the protrusion seats on the ledge when it reaches the end of the ramp, thereby releasably holding the lead protector to the heat sink in a first position relative to the heat sink.

6. A heat sink assembly as set forth in claim 5 wherein each side wall of the heat sink also includes a second ledge situated above the first ledge, so that further upward movement of the lead protector moves the protrusions upwardly to seat on the second ledge, thereby positioning the lead protector at a second position relative to the heat sink.

7. A heat sink assembly as set forth in claim 6 wherein the bottom of the heat sink includes at least one downwardly extending pin, wherein the lead protector'"'"'s base member includes an aperture to receive said pin, and wherein the aperture is at least partially blocked by a membrane such that the pin only partly penetrates the aperture and rests on the membrane when the lead protector is in the first position relative to the heat sink, and whereby pressure causing the pin to penetrate the membrane permits the lead protector to move to the second position relative to the heat sink.

8. A heat sink assembly as set forth in claim 2 wherein the lead protector'"'"'s attachment means and the heat sink are adapted to:

(1) hold the lead protector'"'"'s base member at a first position relative to the bottom of the heat sink, in which first position the transistor leads do not pass through the apertures in the base member, and (2) permit movement of the base member to a second position closer to the bottom of the heat sink, in which second position the transistor leads pass through the apertures.

9. A heat sink assembly as set forth in claim 8 wherein the lead protector includes means for inhibiting the base member from inadvertently moving from said first position to said second position.

10. A heat sink assembly for transistors that have bendable leads, comprising:

a heat sink having a top, a bottom, and side walls, at least one of the side walls being adapted to receive a plurality of transistors such that the transistors'"'"' leads extend toward and beyond the bottom of the heat sink;

a lead protector that has a base member with lead holes therein to receive leads from the transistors, the lead protector also having resilient detent means movably the heat sink such that, the base member is releasably held at a first predetermined position relative to the bottom of the heat sink, in which first position the transistor leads are received by the lead holes in the base member, thereby to protect the leads from inadvertent bending, and such that the base member is movable to a second predetermined position that is closer to the bottom of the heat sink in response to the base member being urged toward the heat sink.

11. A heat sink assembly as set forth in claim 10 wherein the base member includes means for inhibiting its inadvertent moving from the first position to the second position.

12. A heat sink assembly as set forth in claim 11 wherein the bottom of the heat sink carries a downwardly extending pin, wherein the base member has at least one hole therein to receive the pin, and wherein said inhibiting means includes a membrane positioned within the hole to stop the pin when the base member is in the first position.

13. A heat sink assembly as set forth in claim 12 for attachment to a circuit board having at least one hole therein, wherein the base member carries a downwardly extending, expandable foot that is at least partially hollow and that mates with the hole in the circuit board to attach the base member to the circuit board, and wherein the heat sink includes a pin extending from the bottom thereof such that the pin extends into the foot and expands it.

14. A heat sink assembly as set forth in claim 10 wherein the transistor leads are received by the lead holes in the base member but do not extend through and beyond the lead holes when the base member is in the first position, and wherein the transistor leads extend through and beyond the lead holes when the base member is in the second position.

15. A heat sink assembly as set forth in claim 10 including a spring clip for each transistor, each spring clip having a pair of legs for holding the transistors against a side wall of the heat sink, wherein the heat sink includes a pair of spaced-apart ramp surfaces situated immediately above each transistor to receive and spread apart the legs of each spring clip as each spring clip is being mated with the heat sink.

16. A heat sink assembly as set forth in claim 15 wherein each spring clip has a leg which has a relatively wide portion and a relatively narrow portion, the width of the legs being selected such that the relatively wide portion bears on the spaced-apart ramp surfaces to permit the legs to be spread apart, and the relatively narrow portion slips between the ramp surfaces to cause the legs to snap back from their spread-apart condition.

17. A heat sink assembly as set forth in claim 16 wherein the base member includes at least one alignment hole, wherein the bottom of the heat sink has at least one downwardly extending pin to be received by the alignment hole, and wherein a membrane is included within the alignment hole and positioned therein such that the pin bears on the membrane when the base member is in the first position, the base member being moveable to the second position when the pin penetrates the membrane.

18. A heat sink assembly for holding a plurality of transistors that have bendable leads, comprising:

a heat sink having a top, a bottom, side walls and a pair of end walls, both side walls being adapted to receive a plurality of transistors mounted thereon at a plurality of transistor sites such hat the transistors'"'"' leads extend toward and beyond the bottom of the heat sink;

the heat sink having a plurality of pairs of spaced-apart ramp surfaces located on the side walls, a pair of ramp surfaces being located immediately above each transistor site;

a plurality of spring clips, one for each transistor, each spring clip having a pair of legs for holding a transistor against a side wall of the heat sink, at least one of the legs of each spring clip having a relatively wide portion that bears on a pair of ramp surfaces that spread apart the legs of the spring clip as the spring clip is being mated with the heat sink, and a relatively narrower portion that slips between the spaced-apart ramp surfaces to permit the spread-apart legs to snap back and hold a transistor against the heat sink;

a lead protector having a base member with lead holes therein, the lead protector having a pair of upwardly extending arms that engage the end walls of the heat sink to position the base member closely adjacent the bottom of the heat sink, the arms being moveable between a first discrete position in which the transistor leads are received by the lead holes so as to protect the leads from inadvertent bending, and a second discrete position in which the transistor leads extend through the lead holes.