D.C. to A.C. inverter having improved structure providing improved thermal dissipation

• US 4,872,102 A
• Filed: 04/28/1986
• Issued: 10/03/1989
• Est. Priority Date: 04/28/1986
• Status: Expired due to Term

• Current Assignee: Airpax Dimensions, Inc.
• Original Assignee: Dimensions Unlimited, Inc.
• Inventors: Getter, Dennis L.
• Primary Examiner(s): BEHA JR, WILLIAM
• Application Number:
  US06/856,506
• Time in Patent Office: 1,254 Days
• Field of Search: 363/13, 363/123, 363/131, 363/132, 363/141, 363/144, 361/379, 361/383, 361/388, 361/386, 361/399, 361/381, 361/384, 361/389, 336/61, 307/150, 307/151
• US Class Current: 363/141
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A DC to AC power inverter has an improved construction providing for substantially improved thermal disipation, reliability, and efficiency; the inverter has a unitary combination frame and heat diffuser with a pair of opposed U-shaped sections at right angles to each other and with a common base, a cover, a transformer, a primary internal heat sink inside of and on the frame, a plurality of power switches fastened on the internal heat sink, a printed circuit board fastened to and spaced from the heat sink with leads from the switches connected to the board, the transformer is fastened onto the frame in heat exchange relationship and part of the coil extends through the frame into an air passageway. All of the wiring access is on a field wiring end and the opposite end is a control end with the switches and circuit board; an improved arrangement of components and leads provides discrete separation of the high and low voltage components and leads. The inverter is extremely effective at heat disipation and has been UL tested and approved.

Claims

1. An electrical DC to AC inverter having improved structure for providing improved thermal dissipation, comprising:

(a) a combination structural frame and primary heat diffuser of thermally conductive material, said frame having first and second opposed generally U-shaped cross-sections, said cross-sections being generally at right angles to each other and having a common base;

(b) a cover over the said second U-shaped section, said cover being fastened to the frame and jointly defining with the frame an internal and enclosed electrical component compartment;

(c) converting means mounted to the frame and within the component compartment for converting DC to AC, said converting means including a transformer mounted in direct heat exchange relationship to said common base;

(d) means on the outside of the inverter frame for field wiring the inverter; and

(e) secondary dissipation means mounted on an exterior surface of the frame for secondarily dissipating heat from the frame, said dissipation means being spaced from said field wiring means and being on a different side of the inverter.

2. The inverter of claim 1, in which the second U-shaped section has inwardly turned top flanges on each distal end of the U-shape, said cover being an open ended U-shaped metal thermally conductive cover fastened firstly to said top flanges and secondly to legs of the first U-shaped section.

3. The inverter of claim 2, including co-planar base mounting flanges extending outward from each leg of the first U-shaped section, said cover being abutted against said mounting flanges.

4. The inverter of claim 1, in which said transformer has laminations mounted directly against the common base, and in which said converting means further includes solid state power switches mounted in thermally conductive relationship to said frame.

5. The inverter of claim 1, in which said secondary dissipation means and said field wiring means are mounted to and are on opposite legs of the second U-shaped section, said secondary means and said field wiring means projecting outwardly from the frame in opposite direction to each other.

6. The inverter of claim 1, including a cooling air pathway through the exterior of the first U-shaped section, a central aperture in the common base, and in which the transformer is mounted to the base over the aperture with one side of the transformer coil projecting through the base and aperture into the cooling air passageway.

7. An electrical DC to AC inverter having improved structure for providing improved thermal dissipation, comprising:

(a) a combination structural frame and primary heat diffuser of thermally conductive metal having an elongate U-shaped section which has a base and a pair of spaced apart legs with there being a concave side of the frame in between said legs, said concave side of said section facing outward from the base with each leg of the section having a means for mounting of the inverter, there being an open ended cooling air passageway between the legs and the mounting means;

(b) a cover over a convex side of the section, said convex side being on the opposite side of the base from the concave side, said cover and said frame jointly forming an internal electrical component compartment; and

(c) converting means inside of the compartment for converting DC to AC;

said converting means having

(1) a transformer having its metal laminations mounted tightly against and in direct heat exchange relationship with the convex side of the base, said base having an aperture of lesser size then the laminations with one side of the transformer coil projecting through the base into the cooling air passageway within the convex side of the U-section,

(2) said converting means including solid state power switches in conductive thermal communication with an upstanding first end leg on a first end of the base,

(3) said transformer being adjacent a second and opposed upstanding second end on a second end of the base, said transformer being spaced from said power switches, and

(4) a PCB having a control circuit thereon, said PCB being mounted to and spaced off of said base and being spaced from and being in between both the transformer and the power switches, said control circuit being electrically connected to both the transformer and the power switches.

8. The inverter of claim 7, including a thermally conductive metal transformer coil cover over and enclosing the said one side of the transformer coil, said coil cover being in direct thermal communication with the convex side of the frame base and being recessed between the distal ends of the section legs and said base, so that a cooling air flow through the passageway will pass over all of the coil cover.

9. An electrical DC to AC inverter having improved structure for providing improved thermal dissipation, comprising:

(a) a thermally conductive frame;

(b) a cover on said frame, said cover and frame jointly defining an enclosed electrical component compartment;

(c) converting means in said compartment for converting D.C. to A.C.;

(d) an internal heat sink mounted within the compartment and directly upon and in direct thermal exchange relationship with the frame;

(e) said converting means including a printed circuit board (PCB) mounted to and spaced from said frame, said PCB having circuit means thereon for controlling the functioning of the inverter;

(f) said converting means further including a plurality of transistorized power switches having their bodies mounted directly upon and in direct thermal exchange relationship the internal heat sink, said switches having leads from the bodies to the PCB, said leads being permanently secured to said PCB with the bodies being spaced from the PCB; and

(g) fasteners fixedly mounting said PCB to said internal heat sink and spacers spacing the PCB from said internal sink, so that most heat from the switches is absorbed directly and conductively by the heat sink discretely away from the PCB, and so that the switch leads to the PCB are not subject to flexure, cracking and connection breakage during motion of the entire inverter.

10. The inverter of claim 9, in which a first end of the frame has means mounted on the outside of the frame for field wiring of the inverter, and in which the internal heat sink is mounted upon the inside of a second end of the frame, said first and second frame ends being opposite to each other.

11. The inverter of claim 10 in which said converting means includes a transformer mounted to and in direct thermal exchange relationship with said frame, said transformer being positioned in between said first end and said internal heat sink.

12. The inverter of claim 9, wherein said PCB is mounted to and is spaced below the bottom of the internal heat sink.

13. The inverter of claim 9, in which fasteners and spacers secure an edge of the PCB to a lower edge of the internal heat sink, said PCB and internal heat sink being at a generally right angle to each other with substantially all of the electrical circuit means on the PCB other than the power switches being longitudinally spaced from said internal heat sink.

14. The inverter of claim 9, in which said internal heat sink and said PCB substantially span the width of the inverter, with the switches being in a row across the width of the inverter.

15. The inverter of claim 9, in which the internal heat sink and switches are mounted upon and to an end of the frame, said frame end comprising an outer surface of the invention.

16. The inverter of claim 9, in which said internal heat sink comprises an elongate length of metal bar, said PCB being secured to and spaced from an edge of the bar and said switches being mounted on a first face of the bar, the bar having a second face secured directly against the frame.

17. The inverter of claim 9, in which said internal heat sink comprises an elongate length of metal bar, said PCB being secured to and spaced from an edge of the bar and said switches being mounted on a first face of the bar, the bar having a second face secured directly against the frame.

18. The inverter of claim 9, including a second such PCB, a second such discrete plurality of transistorized switches, and a second such internal heat sink, said such second components being mounted above said first said component with both of said internal heat sinks being in direct thermal exchange relationship with a single said frame.

19. An electrical DC to AC inverter having improved structure for providing improved thermal disipation, comprising:

(a) a thermally conductive and structurally self sufficient frame;

(b) a cover on said frame, said cover and frame jointly defining an enclosed electrical component compartment;

(c) converting means within said compartment for converting DC to AC;

(d) an internal primary heat sink mounted directly upon and in direct thermal exchange relationship with an internal surfaces of the frame;

(e) a secondary heat sink mounted directly upon and in direct thermal exchange relationship with an external surface of the frame, said primary and secondary heat sinks being opposite to each other and substantially overlapping each other;

(f) said converting means including semi-conductor power switches in the component enclosure, said switches being mounted directly upon and in direct thermal exchange relationship with the primary heat sink; and

including

(g) a printed circuit board mounted to and spaced from said primary heat sink, said power switches having leads extending to and secured to said PCB.

20. The inverter of claim 19, in which said primary heat sink is an elongate bar having an edge secured to the PCB, a face in direct thermally conductive contact with the frame, and in which the switches are on an opposite face.

21. The inverter of claim 19, in which an edge of the PCB is mounted to an edge of the primary heat sink, said PCB and said primary heat sink being at a generally right angle to each other.

22. The inverter of claim 21, in which said converting means includes discrete electrical inverter control componentry on said PCB, said componentry being longitudinally spaced from and being lower than said primary heat sink and switches.

23. The inverter of claim 19, including field wiring structure on said inverter on the outside of an opposite end of the inverter from the primary and secondary heat sink, and in which the converting means includes a transformer mounted to the frame in between the primary heat sink and the field wiring structure.

24. The inverter of claim 19, including a second and discrete such internal primary heat sink, and semiconductor power switches, both of said primary heat sinks being overlapped upon and being in conductive thermal relationship to a singular said secondary heat sink.

25. An electrical DC to AC inverter having improved structure for providing improved thermal disipation, comprising:

(a) a unitary combination frame and heat diffuser of thermally conductive metal;

(b) a cover on said frame, said cover and frame jointly defining an enclosed electrical component compartment;

(c) converting means in said compartment for converting DC to AC, said converting means including

(1) a transformer in said compartment, the laminations of said transformer being mounted directly upon and in direct heat exchange relationship with said frame, and

(2) semi conductor power switches in the component enclosure and in conductive thermal exchange relationship with said frame;

(d) a field wiring compartment mounted to an outside surface of said frame; and

(e) a thermal barrier between the interior of said wiring compartment and said frame, said barrier comprising a non-metallic floor in the wiring compartment for keeping the field wiring compartment temperature below the frame temperature while still fastening the field wiring compartment directly to the frame;

(f) a heat sink inside of the compartment for conducting waste heat from the switches to the frame; and

(g) in which said power switches and heat sink are on an opposite end of the frame from the field wiring compartment.