Processing apparatus

• US 4,872,938 A
• Filed: 04/25/1988
• Issued: 10/10/1989
• Est. Priority Date: 07/16/1987
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Loewenstein, Lee M., Simpson, Bruce, Davis, Cecil J., Matthews, Robert T., Hildenbrand, Randall C., Abernathy, Joseph V., Jones, John I., Bohlman, James G.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/188,128
• Time in Patent Office: 533 Days
• Field of Search: 156/643, 156/646, 156/653, 156/656, 156/657, 156/659.1, 156/662, 156/345, 118/50.1, 118/620, 118/728, 118/729, 427/38, 427/39, 427/41, 427/54.1, 252/79.1, 204/192.1, 204/192.12, 204/192.23, 204/192.25, 204/192.32, 204/192.35, 204/192.36, 204/192.37, 204/298, 437/228, 437/234, 437/235, 437/338, 437/241, 437/245, 414/217, 414/222, 414/225, 414/226, 414/774 R, 414/744 A, 414/744 B, 414/744 C, 414/411, 414/416, 414/422
• US Class Current: 156/345.54
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/67751 vertical transfer of a single workpiece
• CPC Class Codes: H01L 21/67796 with angular orientation of workpieces H01L21/67787 and H01L21/67793 take precedence

Abstract

A process module which is compatible with a system using vacuum wafer transport in which wafers are generally transported and processed in a face down position under vacuum, and which also includes an additional wafer movement, wherein, after a wafer has been emplaced face down, in a position where it can be clamped against the susceptor, the susceptor is rotated from its approximately horizontal position up to a more nearly vertical position. In the more nearly vertical position, the wafer can be processed by a top process module, which may be, e.g., a sputter system, an implanter, or an inspection module. Another process module is included in the bottom part of the chamber, so that the wafer can be processed by the lower process module while in its substantially horizontal position and processed by the upper process module when it is in its more nearly vertical position. This is especially advantageous when the lower process module is a plasma cleanup module and the top module is a deposition module.

Claims

1. An apparatus for processing of wafers, comprising:

(a) a vacuum processing chamber;

(b) a wafer support within said process chamber, said wafer support being capable of supporting a wafer in a substantially face down position with substantially no damage to structures on the face of said wafer;

(c) a wafer transfer mechanism positioned to controllably transfer wafers through an openable port into said process chamber, said wafer transfer mechanism being capable of operation under high vacuum;

(d) said wafer support being movable to rotate said wafer from said substantially face down position into a more nearly vertical position.

2. An apparatus for processing of a wafer comprising:

(a) a process chamber;

(b) a support adapted to engage said wafer within said process chamber in a first position and pivoting to a second position; and

(c) a wafer transfer mechanism positioned to transfer wafers through a port movable between open and closed positions.

3. The apparatus as set forth in claim 2 including a sputter at said second position.

4. The apparatus as set forth in claim 2 wherein a first process can be performed at the first position and a second process can be performed at the second position.