Method of making a multilayer electrical coil

• US 4,873,757 A
• Filed: 06/27/1988
• Issued: 10/17/1989
• Est. Priority Date: 07/08/1987
• Status: Expired due to Term

• Current Assignee: Invensys Systems Incorporated (Invensys PLC)
• Original Assignee: The Foxboro Company (Schneider Electric SE)
• Inventors: Williams, K. Barry A.
• Primary Examiner(s): Eley, Timothy V.
• Application Number:
  US07/212,143
• Time in Patent Office: 477 Days
• Field of Search: 29/601.1, 29/846, 29/852, 29/855
• US Class Current: 29/602.1
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2027/2819 Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A monolithic multilayer electrical coil uses advanced printed wiring board technology to create a monolithic component having plural parallel multi turn planar coils interconnected by solid vias of plated metal on a single substrate preferably designed as a surface mounted device.

Claims

1. A thin film additive method of fabricating a multi-planar-coil winding for an inductive component, comprising the steps of

patterning a first insulating film layer with a continuous spiral planar channel, and a plurality of outer apertures outside said spiral, the inner end of said spiral channel terminating at a first one of a predetermined plurality of inner locations distributed about a central section of said layer, the outer end of said spiral channel terminating at a first one of said outer apertures,

plating the channel and apertures of said first layer full of conductive metal to form a first coil,

bonding a second thin film insulating layer over said first layer,

forming in said second insulating layer, a plurality of outer apertures in registration with the outer apertures of the first insulating layer, and a single inner aperture at said first location in registration with the inner end of the conductive spiral defined in said first insulating layer,

plating the apertures in said second layer full of conductive metal,

bonding a third thin film insulating layer over said second layer,

patterning said third insulating layer with a second planar spiral channel having an inner end terminating in registration with said inner aperture in said second insulating layer and a plurality of out apertures in registration with the outer apertures in said first and second insulating layers, the outer end of said spiral channel terminating at a second one of said outer apertures, and

plating said apertures and channel in said third layer full of conductive metal to form a second coil,

whereby, a monolithic thin film multi-planar-coil winding is formed with the outer ends of each planar coil being connected to solid metal plated posts extending through the layers.

2. The method of claim 1, further comprising

defining a central hole through the multilayer structure for receiving a magnetic core member.

3. The method of claim 1, wherein the step of bonding each of the odd-numbered ones of said thin film insulating layers is preceded by and includes preparing and applying a patterned thin-film composite according to the following steps

applying a conductive metal foil to a thin film insulating material to form a composite,

patterning the metal foil on the composite, and

applying the composite on top of the preceding even-numbered thin film insulating layer to form the respective odd-numbered insulating layer so that the patterned metal foil on the composite is adjacent to the underlying even-numbered thin film layer to provide conductive metal sites for plating up through the respective odd-numbered insulating layer.

4. A thin film additive method of fabricating a multi-planar-coil winding for an inductive component, comprising the steps of

patterning a first insulating film layer with a continuous spiral planar channel, and a plurality of outer apertures outside said spiral, the inner end of said spiral channel terminating at a first one of a predetermined plurality of inner locations distributed about a central section of said layer, the outer end of said spiral channel terminating at a first one of said outer apertures,

plating the channel and apertures of said first layer full of conductive metal to form a first coil,

bonding a second thin film insulating layer over said first layer,

forming in said second insulating layer, a plurality of outer apertures in registration with the outer apertures of the first insulating layer, and a single inner aperture at said first location in registration with the inner end of the conductive spiral defined in said first insulating layer,

plating the apertures in said second layer full of conductive metal,

bonding a third thin film insulating layer over said second layer,

patterning said third insulating layer with a second planar spiral channel having an inner end terminating in registration with said inner aperture in said second insulating layer and a plurality of out apertures in registration with the outer apertures in said first and second insulating layers, the outer end of said spiral channel terminating at a second one of said outer apertures,

plating said apertures and channel in said third layer full of conductive metal to form a second coil,

bonding a fourth insulating layer over said third layer,

patterning said fourth insulating layer with a plurality of outer apertures in registration with the outer apertures of the underlying layers,

plating the apertures in said fourth layer full of conductive metal,

bonding a fifth thin film insulating layer over said fourth insulating layer,

patterning said fifth insulating layer with a plurality of outer apertures in registration with the outer apertures of the underlying layers and a spiral channel having an outer end terminating at said second location of said outer apertures and an inner end terminating at a second one of said predetermined inner locations about the corresponding central section,

plating the channel and apertures of said fifth layer to form a third coil,

bonding a sixth thin film insulating layer over the fifth insulating layer,

patterning said sixth insulating layer with a plurality of outer apertures in registration with the outer apertures of the underlying layers and an inner aperture at said second location,

plating the apertures of said sixth layer with solid conductive metal,

bonding a seventh thin film insulating layer on top of said sixth thin film insulating layer,

patterning said seventh thin film insulating layer with a plurality of outer apertures in registration with the outer apertures of the underlying layers, a spiral channel having an outer end terminating at a third location of one of said outer apertures and an inner end terminating at said second location,

plating the channel and apertures of said seventh layer full of conductive metal to form a fourth coil,

whereby, a monolithic thin film multi-planar-coil winding is formed with the outer ends of each planar coil being connected to solid metal plated posts extending through the layers.

5. The method of claim 4, further comprising

defining a central hole through the multilayer structure for receiving a magnetic core member.

6. The method of claim 4, wherein the step of bonding each of the odd-numbered ones of said thin film insulating layers is preceded by and includes preparing and applying a patterned thin-film composite according to the following steps

applying a conductive metal foil to a thin film insulating material to form a composite,

patterning the metal foil on the composite, and

applying the composite on top of the preceding even-numbered thin film insulating layer to form the respective odd-numbered insulting layer so that the patterned metal foil on the composite is adjacent to the underlying even-numbered thin film layer to provide conductive metal sites for plating up through the respective odd-numbered insulating layer.