Lead inspection system for surface-mounted circuit packages
First Claim
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1. A process for inspecting leads on circuit packages of the surface-mounted type, comprising the steps of:
- positioning a circuit package for inspection on a generally horizontal reference surface having at least one horizontal reference edge;
illuminating the package to produce sharp optical contrast at the edges and contact ends of the leads;
moving a horizontally-arranged linear array of photosensitive elements in a direction substantially perpendicular to the reference edge;
operating the horizontally-arranged linear array of photosensitive elements to provide a series of one-dimensional scans horizontally across the leads; and
analyzing signal information obtained from the horizontal scans to detect and measure selected geometrical properties of the inspected leads.
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Abstract
An electro-optical system for detecting selected geometrical properties of leads of circuit packages of the surface-mounted type. The system employs a horizontally-arranged linear array of photosensitive elements which is moved in a direction perpendicular to a reference surface and operated to provide a series of one-dimensional horizontal scans along the leads.
21 Citations
24 Claims
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1. A process for inspecting leads on circuit packages of the surface-mounted type, comprising the steps of:
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positioning a circuit package for inspection on a generally horizontal reference surface having at least one horizontal reference edge; illuminating the package to produce sharp optical contrast at the edges and contact ends of the leads; moving a horizontally-arranged linear array of photosensitive elements in a direction substantially perpendicular to the reference edge; operating the horizontally-arranged linear array of photosensitive elements to provide a series of one-dimensional scans horizontally across the leads; and analyzing signal information obtained from the horizontal scans to detect and measure selected geometrical properties of the inspected leads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A process for inspecting leads on circuit packages of the surface-mounted type comprising the steps of:
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positioning a circuit package for inspection on a generally horizontal reference surface having a horizontal edge; moving a horizontally-arranged linear array of photosensitive elements in a direction which is perpendicular to the reference surface; operating the photosensitive elements of the linear array to provide a series of one-dimensional scans along the leads in the horizontal direction; analyzing signal information provided by the scans to measure selected geometrical properties of the inspected leads. - View Dependent Claims (12, 13, 14, 15)
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16. A process for inspecting leads on circuit packages of the surface-mounted type, comprising the steps of:
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positioning a circuit package for inspection on a generally horizontal reference surface having a horizontal reference edge; providing illumination to silhouette the package leads; moving a horizontally-extending linear array of photosensitive elements in a direction perpendicular to the reference surface, and detecting the position of the moving array relative to the reference edge; operating the array of photosensitive elements to provide a series of horizontally scans; and analyzing the signal information obtained from the horizontal scans to measure geometrical properties of the inspected leads.
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17. A system for inspecting leads on circuit packages of the surface-mounted type comprising:
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support means for providing a horizontal reference surface for supporting a circuit package for inspection; illumination means for silhouetting the package leads; a linear array of photosensitive elements mounted to extend horizontally and operative to provide one-dimensional scans of the leads of the package under inspection; means for moving the linear array vertically relative to the support means; and means for analyzing signal information provided by the photosensitive elements of the linear array during a series of scans to provide information as to geometrical properties of the inspected leads. - View Dependent Claims (18, 19, 20)
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21. A system for inspecting leads on circuit packages of the surface-mounted type comprising:
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support means for providing a reference surface for supporting a circuit package for inspection; a linear array of photosensitive elements mounted to extend horizontally to scan the leads of the circuit package; means for moving the linear array in a direction perpendicular to the reference surface; and means for analyzing signal information provided by the linear array to detect selected geometrical properties of the leads. - View Dependent Claims (22, 23, 24)
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Specification