Lead inspection system for surface-mounted circuit packages

• US 4,875,779 A
• Filed: 02/08/1988
• Issued: 10/24/1989
• Est. Priority Date: 02/08/1988
• Status: Expired due to Fees

• Current Assignee: Edward J. Roberts, Richard J. Luebbe
• Original Assignee: Edward J. Roberts, Richard J. Luebbe
• Inventors: Luebbe, Richard J., Hopkins, H. Kenneth
• Primary Examiner(s): EVANS, FANNIE L
• Application Number:
  US07/153,764
• Time in Patent Office: 624 Days
• Field of Search: 356/372, 356/237, 356/387, 356/394, 356/375, 358/101, 358/106, 358/107, 250/561, 250/562
• US Class Current: 356/394
• CPC Class Codes: G01B 11/024 by means of diode-array scanning
• CPC Class Codes: H05K 13/0813 Controlling of single components prior to mounting, e.g. orientation, component geometry H05K13/0812 takes precedence

Abstract

An electro-optical system for detecting selected geometrical properties of leads on circuit packages of the surface-mounted type. The system employs a vertically-arranged linear array of photosensitive elements which is carried horizontally parallel to a reference surface and operated to provide a series of one-dimensional scans vertically along the leads.

Claims

1. A process for inspecting leads on circuit packages of the surface-mounted type, comprising the steps of:

positioning a circuit package for inspection on a generally horizontal reference surface having a reference edge that parallels the surface;

providing illumination of the package leads to produce sharp-contrast at the edges and contact ends of the leads;

moving a vertically-arranged linear array of photosensitive elements parallel to the reference edge;

operating the array of photosensitive elements to provide a series of one-dimensional optical samples vertically along the leads; and

analyzing signal information obtained from the optical samples to detect and measure selected geometrical properties of the inspected leads.

2. A process according to claim 1 wherein the signal information is analyzed to measure the vertical distance between the reference edge and the contact end of each lead.

3. A process according to claim 2 wherein vertical samples are taken for leads on all sides of the package, and the signal information is analyzed to measure the extent to which the contact ends of the leads of the package are coplanar within preselected limits.

4. A process according to claim 1 wherein silhouettes of the package leads are produced by casting light onto the backs of the leads.

5. A process according to claim 1 including the step of focusing images of the contact ends of leads onto the vertically-arranged array.

6. A process according to claim 1 including the steps of detecting horizontal movement of the vertical array along the referenced edge, providing position identifying signals that represent the location of the moving array, and employing the position-identifying signal information to provide selected measures of the geometry of the inspected contact ends of the leads.

8. A process according to claim 1 wherein the signal information is analyzed to measure center-to-center distances between leads.

9. A process according to claim 1 wherein the signal information is analyzed to measure edge-to-edge spacings between leads.

10. A process according to claim 1 wherein the signal information is analyzed to measure stand-off of the circuit package relative to the reference surface.

7. A process according to claim I wherein the signal information is analyzed to measure the extent to which, within preselected limits, the contact ends of the leads deviate from the plane of the reference surface.

11. A process for inspecting leads on circuit packages of the surface-mounted type comprising the steps of:

positioning a circuit package for inspection on a generally horizontal reference surface having a reference edge that parallels the surface;

moving a vertically-arranged linear array of photosensitive elements parallel to the reference edge;

operating the photosensitive elements of the linear array to provide a series of one-dimensional optical samples vertically along the leads;

analyzing signal information provided by the vertical samples to measure selected geometrical properties of the inspected leads.

12. A process according to claim 11 including the steps of detecting horizontal movement of the vertical array along the reference edge, providing position-identifying signals that represent the location of the moving array, and employing the position-identifying signal information to measure geometrical properties of the contract ends of the leads.

13. A process according to claim 11 wherein silhouettes of the package leads are produced by casting light onto the backs of the leads and the photosensitive elements are operated to detect outlines provided by the silhouettes.

14. A process according to claim 12 wherein the position-identifying signal information is analyzed to measure the vertical distance between the reference edge and the contact end of each lead.

15. A process according to claim 14 wherein the position-identifying signal information is analyzed to determine the spacing between leads.

16. A process for inspecting leads on circuit packages of the surface-mounted type, comprising the steps of:

positioning a circuit package for inspection on a generally horizontal surface having a reference edge that parallels the surface;

providing illumination to silhouette the package leads so as to produce high-contrast at the edges and contact ends of the leads;

moving a vertically-arranged linear array of photosensitive elements parallel to the reference edge, and detecting the position of the moving array;

operating the array of photosensitive elements to provide a series of one-dimensional sample scans vertically along the inspected leads; and

analyzing the signal information obtained from the vertical sample scans and the information as to the detected position of the array to measure selected geometrical properties of the inspected leads.

17. A system for inspecting leads on circuit packages of the surface-mounted type comprising:

support means for providing a surface for supporting a circuit package for inspection;

reference means for providing a generally horizontal reference edge parallel to the surface;

illumination means for silhouetting contact ends of the package leads;

a linear array of photosensitive elements mounted to extend vertically and positioned to provide one-dimensional vertical scans of the leads of the package under inspection;

carrying means for moving the linear array horizontally relative to the support means; and

means for analyzing the signal information provided by the photosensitive elements of the linear array during a series of the one-dimensional scans to provide selected information as to geometrical properties of the inspected leads.

18. A system according to claim 17 wherein the linear array is positioned to measure the vertical distances between the reference edge and the contact ends of inspected leads.

19. A system according to claim 17 wherein the carrying means carries both the illumination means and the linear array parallel to the reference edge.

20. A system according to claim 19 further including focusing means for optically focusing silhouetted images of the inspected leads onto the linear array.

21. A system according to claim 20 wherein the focusing means is mounted to travel with the carrying means.

22. A system according to claim 17 further including location detecting means for detecting the location of the moving array along the reference edge.

23. A system according to claim 22 wherein the means for analyzing information employs signals from the location detecting means and from the photosensitive elements to measure the distance between the contact end of each lead and the reference edge.

24. A system for inspecting leads on circuit packages of the surface-mounted type comprising:

support means for providing a reference surface for supporting a circuit package for inspection;

reference means for providing a generally horizontal reference edge parallel to the reference surface;

a linear array of photosensitive elements mounted to extend vertically and connected to provide first signal information indicating a one-dimensional scan of a lead relative to the reference edge;

carrying means for moving the linear array parallel to the reference edge while providing second signal information relating to the position of the array of photosensitive elements horizontally along the reference edge; and

means for analyzing the first signal information provided by the linear array and the second signal information provided by the carrying means to provide output signals which indicate selected geometrical properties of the leads. means to detect selected geometrical properties of the leads.

25. A system according to claim 24 further including illumination means for providing silhouettes of the contact ends of the package leads.

26. A system according to claim 25 wherein the illumination means includes a reflector mounted to the support means to reflect light onto the back surfaces of the package leads.

27. A system according to claim 26 wherein the support means has an aperture formed therein to receive light which is reflected by the reflector means.

28. A system according to claim 25 wherein the carrying means is connected to carry both the illumination means and the linear array of photosensitive elements parallel to the reference edge.

29. A system according to claim 24 wherein the means for analyzing information employs signals from the carrying means and from the photosensitive elements to measure the distances, if any, between the contact ends of inspected leads and the reference edge.