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Lead inspection system for surface-mounted circuit packages

  • US 4,875,779 A
  • Filed: 02/08/1988
  • Issued: 10/24/1989
  • Est. Priority Date: 02/08/1988
  • Status: Expired due to Fees
First Claim
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1. A process for inspecting leads on circuit packages of the surface-mounted type, comprising the steps of:

  • positioning a circuit package for inspection on a generally horizontal reference surface having a reference edge that parallels the surface;

    providing illumination of the package leads to produce sharp-contrast at the edges and contact ends of the leads;

    moving a vertically-arranged linear array of photosensitive elements parallel to the reference edge;

    operating the array of photosensitive elements to provide a series of one-dimensional optical samples vertically along the leads; and

    analyzing signal information obtained from the optical samples to detect and measure selected geometrical properties of the inspected leads.

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