×

Method for fabricating an isolation region in a semiconductor substrate

  • US 4,876,214 A
  • Filed: 06/02/1988
  • Issued: 10/24/1989
  • Est. Priority Date: 06/02/1988
  • Status: Expired due to Term
First Claim
Patent Images

1. A method for fabricating an isolation region in a semiconductor substrate comprising the steps of:

  • forming antiinsulating layer on said substrate;

    forming a mask layer on said insulating layer;

    forming a trench in said mask layer, said insulating layer and said substrate;

    oxidizing an inner surface of said trench to extend said insulating layer into said trench;

    filling a portion of said trench with semiconductor material;

    initially oxidizing an upper surface of said semiconductor material to extend said insulating layer over said trench;

    removing portions of said mask layer to expose portions of said insulating layer adjacent said trench; and

    further oxidizing said upper surface of said semiconductor material and portions of said substrate adjacent said trench.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×