Metal-insulator-semiconductor control of guided optical waves in semiconductor waveguides

• US 4,877,299 A
• Filed: 03/15/1989
• Issued: 10/31/1989
• Est. Priority Date: 03/15/1989
• Status: Expired due to Fees

• Current Assignee: United States Of America As Represented By The Secretary Of The Air Force
• Original Assignee: United States Of America As Represented By The Secretary Of The Air Force
• Inventors: Soref, Richard A., Lorenzo, Joseph P.
• Primary Examiner(s): Sikes, William L.
• Assistant Examiner(s): Ullah, Akm E.
• Application Number:
  US07/323,736
• Time in Patent Office: 230 Days
• Field of Search: 350/96.12, 350/96.13, 350/96.14, 357/17, 357/23.2, 357/27 R, 357/41
• US Class Current: 385/3
• CPC Class Codes: G02F 1/0152 using free carrier effects, e.g. plasma effect
• CPC Class Codes: G02F 1/025 in an optical waveguide structure G02F1/017, G02F1/2257 take precedence
• CPC Class Codes: G02F 1/3138 the optical waveguides being made of semiconducting materials

Abstract

This invention describes an infrared lightwave modulation and switching aratus for very rapidly changing the refractive index of a light-transmitting, doped, semiconductor waveguide. Electrical control is exerted by a MIS diode or MISFET. The apparatus includes a transparent crystalline silicon waveguide, an electrically insulating dielectric layer overlaying a portion of that waveguide, and an elongated, conductive gate electrode in contact with the insulator. A gate voltage applied between the semiconductor and gate serves to deplete free charge carriers from the region of the waveguide under the gate. Elongated source and drain electrodes may be added to enhance electro-optic control.

Claims

1. Apparatus for changing the refractive index of a light transmitting semiconductor waveguide comprising:

(a) a light transmitting doped semiconductor waveguide;

(b) an electrically insulating dielectric member in contact with and overlaying at least a portion of said waveguide;

(c) electrically conductive gate electrode means in contact with and overlaying at least a portion of said dielectric member; and

(d) voltage supply means coupled to said gate electrode means and to said waveguide for inducing depletion of mobile charge carriers within said light transmitting semiconductor waveguide.

2. The apparatus of claim 1 wherein said voltage supply means is coupled between said gate electrode means and said semiconductor waveguide.

3. The apparatus of claim 1 wherein said electrically insulating dielectric member is selected from the group consisting of SiO₂, Si₃ N₄, Al₂ O₃ and CaF₂.

4. The apparatus of claim 2 wherein said electrically insulating dielectric member is selected from the group consisting of SiO₂, Si₃ N₄, Al₂ O₃ and CaF₂.

5. The apparatus of claim 1 wherein said light transmitting doped semiconductor waveguide is selected from the group consisting of crystalline Si, Ge, InP, GaAs, AlAs, InAs, and alloys thereof.

6. The apparatus of claim 2 wherein said light transmitting doped semiconductor waveguide is selected from the group consisting of crystalline Si, Ge, InP, GaAs, AlAs, InAs, and alloys thereof.

7. The apparatus of claim 3 wherein said light transmitting doped semiconductor waveguide is selected from the group consisting of crystalline Si, Ge, InP, GaAs, AlAs, InAs, and alloys thereof.

8. The apparatus of claim 4 wherein said light transmitting doped semiconductor waveguide is selected from the group consisting of crystalline Si, Ge, InP, GaAs, AlAs, InAs, and alloys thereof.

9. The apparatus of claim 1 wherein said light transmitting semiconductor waveguide is uniformly doped and has 1-5×

10¹⁷ impurity atoms per cm³.

10. The apparatus of claim 3 wherein said light transmitting semiconductor waveguide is uniformly doped and has 1-5×

10¹⁷ impurity atoms per cm³.

11. The apparatus of claim 5 wherein said light transmitting semiconductor waveguide is uniformly doped and has 1-5×

10¹⁷ impurity atoms per cm³.

12. The apparatus of claim 7 wherein said light transmitting semiconductor waveguide is uniformly doped and has 1-5×

10¹⁷ impurity atoms per cm³.

13. The apparatus of claim 8 wherein said semiconductor waveguide has a height of 1500-3000 angstroms, and a rib width of 4000-8000 angstroms.

14. The apparatus of claim 9 wherein said semiconductor waveguide has a height of 1500-3000 angstroms, and a rib width of 4000-8000 angstroms.

15. The apparatus of claim 10 wherein said semiconductor waveguide has a height of 1500-3000 angstroms, and a rib width of 4000-8000 angstroms.

16. The apparatus of claim 11 wherein said semiconductor waveguide has a height of 1500-3000 angstroms, and a rib width of 4000-8000 angstroms.

17. The apparatus of claim 12 wherein said semiconductor waveguide has a height of 1500-3000 angstroms, and a rib width of 4000-8000 angstroms.

18. The apparatus of claim 1 wherein said light transmitting semiconductor waveguide has about 1-5×

10¹⁵ impurity atoms per cm³ and includes a sub-micron centrally positioned buried layer having about 1-10×

10¹⁷ impurity atoms per cm³.

19. The apparatus of claim 3 wherein said light transmitting semiconductor waveguide has about 1-5×

10¹⁵ impurity atoms per cm³ and includes a sub-micron centrally positioned buried layer having about 1-10×

10¹⁷ impurity atoms per cm³.

20. The apparatus of claim 5 wherein said light transmitting semiconductor waveguide has about 1-5×

10¹⁵ impurity atoms per cm³ and includes a sub-micron centrally positioned buried layer having about 1-10×

10¹⁷ impurity atoms per cm³.

21. The apparatus of claim 7 wherein said light transmitting semiconductor waveguide has about 1-5×

10¹⁵ impurity atoms per cm³ and includes a sub-micron centrally positioned buried layer having about 1-10×

10¹⁷ impurity atoms per cubic cm³.

22. The apparatus of claim 18 wherein said light transmitting semiconductor waveguide has a thickness of 4000-100,000 angstroms and said buried layer has a thickness of about 1500 angstroms.

23. The apparatus of claim 19 wherein said light transmitting semiconductor waveguide has a thickness of about 4000-100,000 angstroms and said buried layer has a thickness of about 1500 angstroms.

24. The apparatus of claim 20 wherein said light transmitting semiconductor waveguide has a thickness of about 4000-100,000 angstroms and said buried layer has a thickness of about 1500 angstroms.

25. The apparatus of claim 21 wherein said light transmitting semiconductor waveguide has a thickness of about 4000-100,000 angstroms and said buried layer has a thickness of about 1500 angstroms.

26. The apparatus of claim 1 wherein said gate electrode means is elongated and is positioned along a top portion of said waveguide and further including an elongated source electrode positioned upon a first side portion of said semiconductor waveguide and a elongated drain electrode positioned along a second side portion of said waveguide opposite said first side portion and further including a second voltage supply means for forward biasing said drain electrode with respect to said source electrode.

27. The apparatus of claim 26 wherein said gate electrode, said source electrode and said drain electrode are parallel to each other.

28. The apparatus of claim 27 wherein said source electrode and said drain electrode are separated from each other by a distance of 0.5-1 micron.

34. The apparatus of claim 7 wherein said light transmitting semiconductor has 1-5×

10¹⁷ impurity atoms per cm³.

29. Apparatus for changing the refractive index of a light transmitting doped semiconductor waveguide comprising:

(a) a multimode light transmitting doped semiconductor waveguide having first and second side portions contacting first and second electrically insulating dielectric layers in turn contacting first and second electrically conductive gate electrodes; and

(b) voltage supply means for enabling selective application of voltages to said first and second gate electrodes for inducing depletion of mobile charge carriers within said light transmitting semiconductor waveguide near said gates and for selectively altering the phase of one mode with respect to another mode supported by said light transmitting waveguide.

30. The apparatus of claim 29 wherein said voltage supply means is coupled between said gate electrode means and said semiconductor waveguide.

31. The apparatus of claim 30 wherein said electrically insulating dielectric member is selected from the group consisting of SiO₂, Si₃ N₄, Al₂ O₃ and CaF₂.

32. The apparatus of claim 30 wherein said light transmitting semiconductor waveguide is selected from the group consisting of Si, Ge, InP, GaAs, AlAs, InAs, and alloys thereof.

33. The apparatus of claim 31 wherein said light transmitting semiconductor waveguide is selected from the group consisting of Si, Ge, InP, GaAs, AlAs, InAs, and alloys thereof.

35. The apparatus of claim 31 wherein said light transmitting semiconductor has 1-5×

10¹⁷ impurity atoms per cm³.

36. The apparatus of claim 32 wherein said light transmitting semiconductor has 1-5×

10¹⁷ impurity atoms per cm³.

37. The apparatus of claim 33 wherein said light transmitting semiconductor has 1-5×

10¹⁷ impurity atoms per cm³.