Conductor composition and method of manufacturing a ceramic multilayer structure using the same

• US 4,877,555 A
• Filed: 04/13/1988
• Issued: 10/31/1989
• Est. Priority Date: 04/13/1987
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nishimura, Tutomu, Nakatani, Seiichi, Yuhaku, Satoru
• Primary Examiner(s): Barr, Josephine
• Application Number:
  US07/180,899
• Time in Patent Office: 566 Days
• Field of Search: 252/512, 252/518, 106/1.05, 106/1.12, 106/1.13, 106/1.26, 106/1.18, 106/1.22, 106/1.23, 156/89
• US Class Current: 252/512
• CPC Class Codes: H01G 4/0085 Fried electrodes
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks

Abstract

Disclosed is a conductor paste effective to manufacture a ceramic multilayer structure. The conductor paste comprises an inorganic component containing CuO as a main component and at least one of Cu and Cu₂ O. A multilayer body of the conductor paste and a dielectric paste is subjected to a binder removing process in air, a reduction process in a mixed gas of hydrogen and nitrogen, and a firing process in nitrogen, thereby to obtain a ceramic multilayer structure.

Claims

1. A conductor composition comprising an inorganic component and a vehicle, wherein said inorganic component comprises 85 to 95 wt. % of CuO and 15 to 5 wt. % of Cu.

2. A conductor composition comprising an inorganic component and a vehicle, wherein said inorganic component comprises 75 to 95 wt. % of CuO and 25 to 5 wt. % of Cu₂ O.

3. A conductor composition comprising an inorganic component and a vehicle, wherein said inorganic component comprises 80 to 95 wt. % of CuO, 2 to 10 wt. % of Cu, and 3 to 15 wt. % of Cu₂ O.