Method of fabricating thermal ink jet printheads

• US 4,878,992 A
• Filed: 11/25/1988
• Issued: 11/07/1989
• Est. Priority Date: 11/25/1988
• Status: Expired due to Fees

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Campanelli, Michael R.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/276,845
• Time in Patent Office: 347 Days
• Field of Search: 156/629, 156/630, 156/633, 156/634, 156/645, 156/647, 156/657, 156/659.1, 156/662, 156/250, 156/264, 156/268, 156/510, 156/526, 125/13 R, 125/15, 83/33, 83/39, 83/43, 83/663, 437/226, 346/1.1, 346/140 R
• US Class Current: 216/27
• CPC Class Codes: B23D 61/10 clamped between hubs; Clamping or aligning devices therefor
• CPC Class Codes: B41J 2/1604 of the edge shooter type
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: H01L 21/3043 Making grooves, e.g. cutting
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 156/12 Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing

Abstract

An ink jet printhead fabrication process wherein a plurality of printheads are produced from two mated substrates by two dicing operations. One dicing operation produces the nozzle face for each of a plurality of printheads and optionally produces the nozzles. This dicing blade, together with specific operating parameters, prevent the nozzles from chipping and the nozzle faces from scratches and abrasions. A second dicing operation with a standard dicing blade severs the mated substrates into separate printheads. The dicing operation which produces the nozzle face is preferably conducted in a two-step operation. A first cut makes the nozzle face, but does not sever the two mated substrates. A second dicing cut severs the two substrates, but does so in a manner that prevents contact by the dicing blade with the nozzle face.

Claims

1. A method of fabricating a plurality of ink jet printheads from at least two substrates having confronting surfaces aligned and bonded together, wherein the confronting surface of one substrate contains a plurality of sets of equally spaced, linear arrays of heating elements and addressing electrodes having terminals for enabling the individual addressing of each heating element with current pulses, and wherein the confronting surface of the other substrate contains a plurality of sets of equally spaced, parallel grooves and a recess, one end of each set of grooves communicate with an ink supply means, the fabricating method comprising the steps of:

(a) removing the substrate material above the electrode terminals on the other substrate and thus producing a plurality of separate portions in which each contain one set of grooves and interconnected recesses;

(b) dicing the end portions from each separate substrate portion containing the ends of the set of grooves opposite the ends communicating with the ink supply means to form a nozzle face containing open groove ends, the open groove ends to serve subsequently as droplet emitting nozzles, the dicing being accomplished by a first circular, resin-bonded blade having a predetermined diamond particle size and density, the blade having a predetermined diameter and thickness, and operated at a speed of greater than 32,000 inches per second with a predetermined depth of cut, so that the entire region containing grooves are cut; and

(c) dicing in a direction perpendicular to the nozzle faces to separate the rows of printheads into individual printheads.

2. The method of claim 1 wherein the dicing by the first blade cuts through the entire thickness of the substrate portions containing the grooves in a first dicing cut to form the nozzle face, but the predetermined depth of cut prevents cutting through the other substrate, so that only a notch is formed therein, and wherein step (b) further comprises the step of:

dicing along the notch in said other substrate with a second dicing cut to separate the bonded substitutes into a plurality of attached rows of printheads, the second dicing cut being done in a manner not to contact the nozzle face produced by the first dicing cut.

3. The method of claim 2, wherein the second dicing cut is made by a second circular dicing blade.

4. The method of claim 3, wherein the second dicing blade is thinner than said first dicing blade.

5. The method of claim 1, wherein the predetermined depth of cut by said first blade has a ratio with the first blade thickness within the range of 6:

1 to 9;

1.

6. The method of claim 5, wherein the first blade exposure less the predetermined depth of cut is within the range of 6 to 12 mils or 0.15 to 0.3 mm.

7. The method of claim 6 wherein the first blade has a feed speed from 0.011 inches per second to about 0.16 inches per second.

8. The method of claim 6, wherein the predetermined diamond particle size is within the diamond size range of 2 to 6 micrometers, and wherein the predetermined diamond density is a diamond concentration of 60% to 90% with a density reference based on 72 carats per cubic inch.