Method of manufacturing heat sink apparatus

• US 4,879,891 A
• Filed: 06/05/1989
• Issued: 11/14/1989
• Est. Priority Date: 04/27/1987
• Status: Expired due to Term

• Current Assignee: Aavid Thermalloy LLC (LTI Flexible Products Inc.)
• Original Assignee: Thermalloy, Inc. (Ansys Incorporated)
• Inventors: Hinshaw, Howard G.
• Primary Examiner(s): Moon, Charlie T.
• Application Number:
  US07/361,484
• Time in Patent Office: 162 Days
• Field of Search: 72/254, 29/557, 29/558, 29/163.6, 29/157.3 R, 83/875, 83/876, 83/878, 83/303, 83/508.3, 165/80.3, 165/80.4, 165/185, 310/64, 310/89, 361/383
• US Class Current: 72/254
• CPC Class Codes: H01L 21/4878 Mechanical treatment, e.g. deforming
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making
• CPC Class Codes: Y10T 29/49996 Successive distinct removal operations
• CPC Class Codes: Y10T 83/4705 Plural separately mounted flying cutters

Abstract

Unitary heat sink apparatus for use in removal of heat from a heat generating component is disclosed which includes a heat sink body formed by extrusion. Parallel fins extend outwardly a first predetermined distance from the heat sink body and are separated by a first predetermined number of grooves of a first predetermined depth and width. The ratio of the height of the fins to the width of the grooves is approximately four to one. The first predetermined number of parallel grooves are gang sawed to a second predetermined depth to provide a second and greater predetermined height to the parallel fins such that the new ratio of the second predetermined height of the fins to the width of the parallel grooves is increased to at least six to one. In another embodiment, the heat sink is then rotated ninety degrees and a second predetermined number of grooves are gang sawed at right angles across and through the parallel fins to provide a predetermined number of pins extending outwardly from the heat sink body.

Claims

1. The method of forming a unitary heat sink metal body for use in removal of heat from a heat generating electronic device package comprising the steps of:

(a) extruding a unitary metal body of heat conducting material having a base surface on a first side thereof adapted to be positioned in thermally conductive contact with a heat generating electronic device package, said body including a predetermined number of parallel fins extending outwardly a first predetermined height from a side opposite said base surface, said predetermined number of parallel fins separated by a first predetermined number of parallel grooves of a first predetermined width and a first predetermined depth with the ratio of said first predetermined height to said first predetermined width being at least four to one; and

(b) sawing the first predetermined number of parallel grooves to a second predetermined depth to provide a second predetermined height to said parallel fins, whereby the ratio of the second predetermined height of said predetermined number of parallel fins to the first predetermined width of said first predetermined number of parallel grooves is at least six to one.

2. The method set forth in claim 1 further including the step of sawing a second predetermined number of parallel grooves across and through said predetermined number of parallel fins to form a second predetermined number of parallel grooves having a third predetermined depth and a third predetermined width to form pins.

3. The method set forth in claim 2 wherein said third predetermined depth is substantially equal to said second predetermined depth.

4. The method set forth in claim 1 further including the step of surface treating the exterior surfaces of said unitary heat sink body.

5. The method set forth in claim 2 further including the step of surface treating the exterior surfaces of said unitary heat sink body.