Method for applying a moistureproof insulative coating to printed circuit boards using triangular or dovetail shaped liquid films emitted from a flat-pattern nozzle

• US 4,880,663 A
• Filed: 06/13/1988
• Issued: 11/14/1989
• Est. Priority Date: 12/27/1985
• Status: Expired due to Term

• Current Assignee: Nordson Corporation
• Original Assignee: Nordson Corporation
• Inventors: Shimada, Takaji
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): DANG, VI
• Application Number:
  US07/206,199
• Time in Patent Office: 519 Days
• Field of Search: 427/96, 427/420, 427/421, 427/207.1
• US Class Current: 427/96.4
• CPC Class Codes: B05B 1/04 in flat form, e.g. fan-like, sheet-like
• CPC Class Codes: B05B 13/04 the spray heads being moved during spraying operation
• CPC Class Codes: B05D 1/26 performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
• CPC Class Codes: B05D 1/30 performed by gravity only, i.e. flow coating
• CPC Class Codes: H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2203/1366 Spraying coating apparatus for coating printed circuit boards using liquid non-metallic coating compositions H05K3/0091
• CPC Class Codes: H05K 2203/1509 Horizontally held PCB
• CPC Class Codes: H05K 3/0091 Apparatus for coating printed circuits using liquid non-metallic coating compositions
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A method of applying coating material to only selected areas of a packaged printed circuit board wherein the coating material is supplied to a flat-pattern nozzle at a pressure sufficient to produce a liquid film emission in a flat triangular or dovetail shaped pattern which portion of the nozzle emission is substantially free of atomized particles. The circuit board is positioned relative the nozzle to place the board in the path of the film pattern and relative movement between the nozzle and board is effect in conjunction with controlling the supply of coating to the nozzle to coat only desired regions of the board while avoiding deposit of coating material on areas to be left uncoated.

Claims

1. A mask-free method of applying insulative coating to selected areas of a circuit board without applying insulative coating to regions to be left uncoated, comprising the steps of:

supplying insulative liquid coating material to a flat-pattern nozzle means at a supply pressure to produce a liquid film emission from the nozzle means in a flat pattern having a generally triangular shape with a lower horizontal base edge and an upper apex, which has a maximum width W at its lower base edge below which discrete liquid droplets of coating begin to form, and which decreases in width to an approximately zero width at a distance L above said lower base edge, said triangular shaped liquid film being substantially free of atomized particles of coating,

positioning the nozzle means and circuit board at a specified distance apart relative to each other to position the circuit board in the path of the flat triangular shape liquid film pattern,

producing relative movement between the nozzle means and circuit board in a direction generally transverse to the plane of the flat pattern, and

controlling the liquid coating supply during relative movement between the nozzle means and circuit board to (a) supply liquid to the nozzle means when the flat pattern is directed toward the selected areas to be coated to impinge a flat liquid film thereon and thereby coat the areas to be coated, and (b) interrupt the supply of liquid to the nozzle means when the flat pattern is directed toward the regions to be left uncoated to terminate emission of the flat liquid film and prevent deposit thereof on the regions to be left uncoated.

2. The method of claim 1 wherein the insulative liquid coating material is supplied at a pressure below the equivalent of approximately 8 Kg/cm² for a coating viscosity of approximately 125-155 cps at 20°

C.

3. The method of claim 2 wherein the nozzle means and circuit board are spaced apart at a distance of approximately 20 mm or less.

4. The method of claim 3 wherein the nozzle means and circuit board are spaced apart a distance of approximately 15 mm or less and the insulative coating material is supplied at a pressure below the equivalent of approximately 5 Kg/cm² for a coating viscosity of approximately 125-155 cps at 20°

C.

5. The method of claim 4 wherein the nozzle means and circuit board are spaced apart a distance of approximately 12.5 mm or less and the insulative coating material is supplied at a pressure below the equivalent of approximately 6 Kg/cm² for a coating viscosity of 125-155 cps at 20°

C.

6. The method of claim 5 wherein the nozzle means and circuit board are spaced apart a distance of approximately 10 mm or less and the insulative coating material is supplied at a pressure below the equivalent of approximately 8 Kg/cm² for a coating viscosity of approximately 125-155 cps at 20°

C.

7. The method of claim 1 wherein the distance between the nozzle means and the circuit board does not exceed a distance of approximately 2/3 L.