Ultraminiature pressure sensor and method of making same

• US 4,881,410 A
• Filed: 05/04/1988
• Issued: 11/21/1989
• Est. Priority Date: 06/01/1987
• Status: Expired due to Term

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Wise, Kensall D., Chau, Hin-Leung
• Primary Examiner(s): Woodiel, Donald O.
• Application Number:
  US07/190,310
• Time in Patent Office: 566 Days
• Field of Search: 73/724, 73/DIG. 4, 73/718, 73/756, 361/283, 29/59.3, 29/24.41
• US Class Current: 73/724
• CPC Class Codes: A61B 5/02158 provided with two or more sensor elements
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm

Abstract

A capacitive pressure sensor suitable for making highly sensitive, low pressure measurements is disclosed. The sensor may be mounted into a 0.5 mm OD catheter suitable for multipoint pressure measurements from within the coronary artery of the heart. The sensor employs a transducer which consists of a rectangular bulk silicon micro-diaphragm several hundred microns on a side by two microns thick, surrounded by a supporting bulk silicon rim about 12 microns thick. Both the diaphragm and the rim are defined by a double diffusion etch-stop technique. The transducer fabrication process features a batch wafer-to-glass electrostatic seal followed by a silicon etch, which eliminates handling of individual small diaphragm structures until die separation and final packaging. An addressable read-out interface circuit may be used with the sensor to provide a high-level output signal, and allows the sensor to be compatible for use on a multisite catheter having only two electrical leads.

Claims

1. An ultraminiature solid-state capacitive pressure transducer which includes a parallel plate capacitor, comprising:

an integrally formed structure made from single-crystal material and having a diaphragm and a rim extending about a substantial portion of the periphery of the diaphragm, the structure having at least two dimensions orthogonal to one another of less than one millimeter, and the diaphragm constituting a plane supporting one plate of the parallel plate capacitor.

2. A transducers as in claim 1, further comprising:

a glass plate electrostatically bonded to at least part of the rim of the structure.

3. A transducer as in claim 1, wherein:

the single-crystal material is silicon, and

the rim and diaphragm are heavily impregnated with at least first material alters an etching characteristic thereof in comparison to single-crystal material which contains substantially less of such first material.

4. A transducer as in claim 3, wherein:

the first material is an impurity dopant selected from the group of dopants including n-type materials and p-type materials.

5. A transducer as in claim 3, wherein the first material is boron.

6. A transducer as in claim 1, wherein the rim and diaphragm are made from a common wafer of single-crystal material and the nominal width of the rim is at least three times smaller than the nominal thickness of the wafer from which it is made.

7. A transducer as in claim 6 wherein the nominal thickness of the rim is no more than about 80 microns, and the nominal height of the rim is no more than about 12 microns.

8. A transducer as in claim 1, wherein the nominal thickness of the single-crystal material of the diaphragm is no more than about two microns.

9. A transducer as in claim 1 having first and second electrically conductive parallel plates which form the parallel plate capacitor, whose capacitance is adjustable by a change in pressure upon at least one of the plates, further comprising an insulating nonflexible support substrate having an electrically conductive plate formed on a first side thereof, which constitutes the first parallel plate, and wherein:

the diaphragm of the integrally formed structure constitutes the second parallel plate,

the rim of the integrally formed structure is bonded to the first side of the support substrate and at least substantially surrounds the perimeter of the first parallel plate,

the nominal thickness of the rim is no more than about 80 microns and the nominal height of the rim is no more than about 12 microns, and

the nominal gap between the first and second parallel plates is less than five microns.

10. A transducer as in claim 9, wherein the overall size of the diaphragm measured in two orthogonal directions along the plane of the diaphragm is no more than about five hundred microns in each such direction.

11. A transducer as in claim 1, having first and second electrically conductive parallel plates which form the capacitor whose capacitance is adjustable by a change in pressure upon at least one of the plates, further comprising:

a thin composite dielectric layer formed on one side of the diaphragm; and

an insulating nonflexible support substrate having an electrically conductive plate formed on a first side thereof, which constitutes the first parallel plate, and wherein

the diaphragm of the integrally formed structure constitutes the second parallel plate,

the rim of the integrally formed structure is bonded to the first side of the support substrate and at least substantially surrounds the perimeter of the first parallel plate,

the composite dielectric layer is on the side of the diaphragm facing the first parallel plate, and is formed of at least first and second sublayers, the first sublayer including a thermally grown oxide and the second sublayer including a deposited silicon nitride.

12. A transducer as in claim 1, wherein the diaphragm of the integrally formed structure is rectangularly shaped, is centrally located in and surrounded by the rim, and has an average thickness which is at least a few times thinner than the average thickness of the rim.

13. A solid-state capacitive pressure transducer including a parallel plate capacitor therein, comprising:

an integrally formed structure made from single-crystal silicon semiconductor material and having a diaphragm and a rim that extends at least around a substantial portion of the periphery of the diaphragm, the diaphragm and rim being heavily impregnated with at least a first material which alters an etching characteristic thereof in comparison to single-crystal material which is identical to the heavily impregnated material of the diaphragm and rim except for containing substantially less of such first material, and wherein the diaphragm constitutes a supporting plane of one plate of the parallel plate capacitor.

14. A transducer as in claim 13, further comprising:

a glass plate electrostatically bonded to a generally flat surface of the rim, such that the diaphragm is generally parallel to and spaced closely to but remains apart from the glass plate.

15. A transducer as in claim 13, wherein the first material is an impurity dopant selected from the group of dopants including n-type materials and p-type materials.

16. A transducer as in claim 13, in which the transducer is part of a pressure sensor, further comprising:

an insulating plate bonded on one side thereof to at least part of the rim of the integrally formed structure, a thin electrically conductive pad located on the side of the insulating plate bonded to at least part of the rim, the conductive pad being spaced apart from and generally parallel to the diaphragm and forming a stationary plate of the capacitor of the transducer, with the diaphragm forming a flexible second plate of the capacitor.

17. A transducer including a pressure-adjustable parallel plate capacitor, comprising:

a first electrically conductive plate; and

an integrally formed structure made from single-crystal silicon semiconductor material and having a diaphragm and a rim that extend entirely around the periphery of the diaphragm and mechanically supports the diaphragm in a nominal position parallel to and at a predetermined nominal distance from the first plate,

the diaphragm and rim being electrically conductive and heavily impregnated with at least a first material which alters an etching characteristic thereof in comparison to single-crystal material which is identical to the heavily impregnated material of the diaphragm and rim except for containing substantially less of such first material,

the diaphragm constituting a second electrically conductive plate, and

being sufficiently thin relative to its overall size to allow it to respond to a mechanical force applied which is thereto in the form of changing pressure in a range designed to be measured by said transducer, thereby changing the capacitance of the parallel place capacitor.

18. A transducer as in claim 17, wherein the rim and diaphragm are formed from a single wafer of single-crystal material and the nominal width of the rim is at least three times smaller than the nominal thickness of the wafer from which it is made.

19. A transducer as in claim 18 wherein the nominal thickness of the rim is no more than about 80 microns, and the nominal height of the rim is no more than about 12 microns.

20. A transducer as in claim 18, wherein the nominal thickness of the single-crystal material of the diaphragm is no more than about two microns.

21. A transducer as in claim 18, wherein the nominal predetermined distance between the first and second parallel plates is less than five microns.

22. A transducer as in claim 18, further comprising:

a support substrate having least one substantially flat surface on a first side thereof, with the first electrically conductive plate formed on the first side of the substrate, and a conductive trace formed on the first side of the substrate adjacent to and electrically isolated from the first conductive plate, and wherein

the rim extends at least around a substantial portion of the periphery of the diaphragm and the rim is in electrical contact with the conductive trace.

23. A transducer as in claim 22, wherein the support substrate:

(1) is configured as an elongated rectangular slab,

(2) is no more than about one millimeter long, and

(3) is no more than about one-half millimeter wide.

24. A transducer as in claim 22, wherein the support substrate is a glass material having a coefficient of thermal expansion closely matched to that of single-crystal semiconductor material.