Method for photopatterning metallization via UV-laser ablation of the activator

• US 4,882,200 A
• Filed: 08/23/1988
• Issued: 11/21/1989
• Est. Priority Date: 05/21/1987
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Liu, Yung S., Grubb, Willard T.
• Primary Examiner(s): Silverberg, Sam
• Assistant Examiner(s): Padgett, Marianne L.
• Application Number:
  US07/237,638
• Time in Patent Office: 455 Days
• Field of Search: 427/53.1, 427/54.1, 427/98, 427/306, 156/632, 156/643, 156/654
• US Class Current: 427/555
• CPC Class Codes: B05D 3/06 by exposure to radiation B05D3/02 takes precedence ; plasma treatment B05D3/141
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/1612 through irradiation means
• CPC Class Codes: C23C 18/204 Radiation, e.g. UV, laser
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: G03F 7/0047 characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
• CPC Class Codes: G03F 7/2006 using coherent light; using polarised light
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 3/185 by making a catalytic pattern by photo-imaging

Abstract

A laser, such as an excimer laser, is employed to ablate electroless plating activator material from polymer and other substrates. The treated substrates are then immersed in electroless plating baths for plating of conductive material over remaining activator material. The method is particularly effective for depositing conductive patterns on non-flat substrates and on substrates needing plated-through connections. High resolution patterns are created on any compatible polymer substrate with any compatible electroless plating activator material.

Claims

1. A method for patterning electroless plating activator material disposed on a polymer substrate, said method comprising the step of:

selectively exposing said polymer substrate and said electroless plating activator material disposed thereon to an ultraviolet laser beam which is sufficiently powerful to ablate said activator material.

2. The method of claim 1 wherein:

said polymer is a polyimide.

3. The method of claim 2 wherein:

said polyimide is a polyetherimide.

4. The method of claim 1 in which said exposure occurs through a mask.

5. The method of claim 1 in which said exposure is performed with a scanned and focused laser beam.

6. The method of claim 1 in which said laser is an excimer laser.

7. The method of claim 1 in which said laser is selected from the group consisting of ArF, KrF, XeCl and XeF lasers.

8. The method of claim 1 in which said laser is a pulsed laser.

9. The method of claim 8 in which said pulse duration is approximately 15 nanoseconds.

10. The method of claim 1 in which said laser is a continuous laser.

11. The method of claim 1 in which said laser is operated to produce a fluence level of at least approximately 20 millijoules per square centimeter.

12. The method of claim 1 in which said activator material is selected from the group consisting of palladium, palladium complexes and precious metal activators.

13. The method of claim 1 in which said substrate is a polymer and said polymer is selected from the group consisting of epoxy polymers and aromatic polymers.

14. The method of claim 1 in which said substrate includes apertures.

15. The method of claim 1 in which said substrate exhibits at least two surfaces disposed at non-zero angles with respect to one another.

16. The method of claim 1 in which said laser is operated to produce a fluence level of at least approximately 20 millijoules per square centimeter at a power level of at least about 1 megawatt per square centimeter.

17. The method for forming conductive patterns on a polymer substrate, said method comprising the steps of:

coating said substrate with an electroless plating activator material;

selectively exposing said substrate and said electroless plating activator material thereon to an ultraviolet laser beam which is sufficiently powerful to ablate said activator material; and

then immersing said substrate in an electroless plating bath for a time sufficient to deposit conductive material on the activator material which was not ablated.

18. The method of claim 17 wherein:

said polymer is a polyetherimide.

19. The method of claim 17 in which said exposure occurs through a mask.

20. The method of claim 17 in which said exposure is performed with a driven and focused laser beam.

21. The method of claim 17 in which said laser is an excimer laser.

22. The method of claim 17 in which said laser is selected from the group consisting of ArF, KrF, XeCl and XeF lasers.

23. The method of claim 17 in which said laser is a pulsed laser.

24. The method of claim 23 in which said pulse duration is approximately 15 nanoseconds.

25. The method of claim 17 in which said laser is a continuous laser.

26. The method of claim 17 in which said laser is operated to produce a fluence level of at least approximately 20 millijoules per square centimeter.

27. The method of claim 17 in which said activator is selected from the group consisting of palladium, palladium complexes and precious metal activators.

28. The method of claim 17 wherein:

said polymer is selected from the group consisting of epoxy polymers and aromatic polymers.

29. The method of claim 17 in which said substrate includes apertures.

30. The method of claim 17 in which said substrate exhibits at least two surfaces disposed at non-zero angles with respect to one another.

31. The method of claim 17 in which said laser is operated to produce a fluence level of at least approximately 20 millijoules per square centimeter at a power level of at least about 1 megawatt per square centimeter.

32. The method of claim 17 wherein:

said polymer is a polyimide.

33. The method for patterning electroless plating activator material disposed on a polymer substrate, said method comprising the steps of:

selectively exposing said polymer substrate and said electroless plating activator material thereon to an ultraviolet laser beam with a power level which is above an ablation threshold level to ablate said activator material.

34. A method of forming conductive patterns on a polymer substrate, said method comprising the steps of:

coating said substrate with an electroless plating activator material;

selectively exposing said substrate and said electroless plating activator material thereon to an ultraviolet laser beam having a power level which is above an ablation threshold to ablate said activator material; and

then immersing said substrate in an electroless plating bath for a time sufficient to deposit conductive material on the activator material which was not ablated.