Aluminum-ceramic complex material

• US 4,882,237 A
• Filed: 03/14/1988
• Issued: 11/21/1989
• Est. Priority Date: 03/18/1987
• Status: Expired due to Fees

• Current Assignee: Tokyo Metro Company Limited (Government of Japan)
• Original Assignee: Tokyo Metro Company Limited (Government of Japan)
• Inventors: Koyama, Mamoru
• Primary Examiner(s): Dixon, Jr., William R.
• Assistant Examiner(s): Brunsman, David M.
• Application Number:
  US07/167,571
• Time in Patent Office: 617 Days
• Field of Search: 501/127, 501/153, 428/471.2, 428/469, 428/697, 428/699, 428/701, 428/702
• US Class Current: 428/699
• CPC Class Codes: C04B 35/111 Fine ceramics
• CPC Class Codes: C23C 26/00 Coating not provided for in groups C23C2/00 - C23C24/00
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer

Abstract

This invention relates to an aluminum-ceramic complex material wherein a ceramic layer is formed by allowing a copper compound to react with an aluminum oxide on an aluminum surface. The resulting complex material exhibits a high harndess together with excellent adhesive strength, bendability and heat and wear resistance.

Claims

1. A layered aluminum-ceramic complex material comprising

a substrate layer containing aluminum,

an anodically induced aluminum oxidation layer covering said substrate layer,, and

a unified copper ceramic surface layer integrally bonded to and covering said aluminum oxidation layer,

said copper ceramic surface layer being formed by contacting said aluminum oxidation layer with an applied transition layer containing copper at a temperature sufficient to convert said applied transition layer to said ceramic surface layer.

2. An aluminum-ceramic complex material according to claim 1, wherein said copper ceramic surface layer is formed by diffusion between said aluminum oxide layer and said applied transition layer.

3. An aluminum-ceramic complex material according to claim 1, wherein said applied transition layer containing copper includes at least one of the group consisting of a copper halide, copper sulfate and copper alkoxide.

4. An aluminum-ceramic complex material according to claim 3, wherein said copper halide is at least one of copper chloride and copper fluoride.

5. An aluminum-ceramic complex according to claim 3, wherein said applied transition layer containing copper includes a copper halide and a copper alkoxide.

6. An aluminum-ceramic complex according to claim 1, wherein said applied transition layer containing copper additionally comprises an organic solvent.

7. An aluminum-ceramic complex according to claim 1, wherein said applied transition layer containing copper comprises a copper halide, a copper alkoxide, and an organic solvent.

8. An aluminum-ceramic complex according to claim 1, wherein said copper ceramic surface layer comprises a spinel ceramic.

9. An aluminum-ceramic complex according to claim 1, wherein said applied transition layer containing copper comprises a copper alkoxide, a copper chloride, and at least one of glycerine and paraffin.

10. A layered aluminum-ceramic complex material comprising

a substrate layer containing aluminum,

an anodically induced aluminum oxidation layer covering said substrate layer, and

a unified spinel ceramic surface layer containing copper and integrally bonded to and covering said aluminum oxidation layer,

said spinel ceramic surface layer being formed at a temperature sufficient to convert said applied transition layer to said ceramic surface layer and in the presence of an organic solvent as the diffusion product of said aluminum oxidation layer and an applied transition layer containing copper.

11. A layered aluminum-ceramic complex material as in claim 10, wherein said applied transition layer containing copper includes at least one of the group consisting of a copper halide, copper sulfate and copper alkoxide, and said organic solvent includes at least one of glycerine and paraffin.