Method for applying coatings to objects by means of magnetic field supported reactive cathode sputtering

• US 4,883,574 A
• Filed: 08/01/1988
• Issued: 11/28/1989
• Est. Priority Date: 08/11/1987
• Status: Expired due to Fees

• Current Assignee: Hartec Gesellschaft Fur Hartstoffe und Dunnschichttechnik mbH & Company KG
• Original Assignee: Hartec Gesellschaft Fur Hartstoffe und Dunnschichttechnik mbH & Company KG
• Inventors: dos Santos Pereina Ribeiro, Carlos A. S. P.
• Primary Examiner(s): Weisstuch, Aaron
• Application Number:
  US07/226,731
• Time in Patent Office: 484 Days
• Field of Search: 204/192.12, 204/192.15-192.17
• US Class Current: 204/192.15
• CPC Class Codes: C23C 14/0063 characterised by means for introducing or removing gases
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence

Abstract

A method is described for applying coatings to objects by means of magneticield supported cathode sputtering in a vacuum, wherein, in order to achieve an improved coating rate, the total reactive gas quantity fed into a coating chamber is so measured that the reactive gas portion in the metal-reactive gas compound of the coating on the workpiece, is present in sub-stoichiometric relationship, and wherein the reactive gas flow in the chamber is conducted directly into the area of the workpieces to be coated, by-passing the sputtering cathode.

Claims

1. Method for applying coatings to objects by means of magnetic field supported cathode sputtering in a vacuum, wherein in order to maintain the glow discharge necessary for the sputtering of the target material, the method includes the steps wherein an inert gas is continuously fed into the coating chamber and, with the aid of a vacuum pump, is continuously pumped out of the coating chamber in such a way that a constant inert gas partial pressure is maintained in the coating chamber, and the step wherein at least one reactive gas is fed into the coating chamber, which forms a compound with the sputtered metallic target material, with which the workpieces are coated, characterized in that the total quantity of reactive gas continuously fed into the coating chamber is so chosen that the reactive gas component of the metal-reactive gas compound of the coating is in sub-stoichiometric relationship and there is no build up of reactive gas partial pressure, and that the step of feeding reactive gas into the coating chamber conducts the reactive gas flow directly into the space between the sputtering cathode and the workpieces to be coated, by-passing the sputtering cathode.

2. Method according to claim 1, characterized in that the sputtering of the target material of the sputtering cathode is commenced prior to the introduction of reactive gas and that the quantity of reactive gas fed into the coating chamber is slowly increased to the desired final value.

3. Method according to claim 1, characterized in that the reactive gas is fed into the coating chamber via a gas distributing system, directly onto the workpiece surfaces.

4. Method according to claim 1 characterized in that the reactive gas is introduced in ionized state into the coating chamber.

5. Method according to claim 1, characterized in that the output of the sputtering cathode target erosion zone is at least 10 Watt/cm².

6. Method according to claim 5, characterized in that the inert gas partial pressure forming the total pressure in the coating chamber is between 1 and 10×

10^-3 mbar.

7. Method according to claim 5, characterized in that a bias voltage is applied to the workpieces.

8. Method according to claim 7, characterized in that the bias voltage is a negative voltage with an amount of at least 50 Volts.

9. Method according to claim 7, characterized in that the bias voltage is an alternating voltage of high frequency.

10. Method according to claim 7, characterized in that the bias voltage is a negative voltage with an amount within the range of 100 to 150 volts.

11. Method according to claim 1, characterized in that the target material is a pure metal, chosen from zirconium, hafnium, molybdenum, tungsten, titanium, or an alloy of pure metals, chosen from a titanium-aluminum, titanium-tungsten, tungsten-molybdenum or a chrome-nickel alloy, and that the reactive gas is a mixture of gases containing at least one of nitrogen, carbon, oxygen, boron, and silicon.

12. Method according to claim 1, characterized in that subsequently, on top of the application of a coating with a sub-stoichiometric reactive gas compound, a further coating with a super-stoichiometric reactive gas compound is applied to the first coating.

13. Method according to claim 1, characterized in that the sputtering of the target material of the sputtering cathode is commenced simultaneously with the introduction of reactive gas and that the quantity of reactive gas fed into the coating chamber is slowly increased to the desired final value.

14. Method according to claim 1, characterized in that the output of the sputtering cathode target erosion zone is preferably 30 Watt/cm² or greater.