Forced air heat sink apparatus

• US 4,884,631 A
• Filed: 03/17/1988
• Issued: 12/05/1989
• Est. Priority Date: 03/17/1988
• Status: Expired due to Term

• Current Assignee: Intellectual Capital Holdings Limited
• Original Assignee: California Institute of Technology
• Inventors: Rippel, Wally E.
• Primary Examiner(s): Schwadron, Martin P.
• Assistant Examiner(s): Flanigan, Allen J.
• Application Number:
  US07/170,378
• Time in Patent Office: 628 Days
• Field of Search: 165/80.3, 165/185, 174/16.3, 357/82, 361/384
• US Class Current: 165/185
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10T 428/24149 Honeycomb-like

Abstract

A high efficiency forced air heat sink assembly employs a split feed transverse flow configuration to minimize the length of the air flow path through at least two separated fin structures. Different embodiments use different fin structure material configurations including honeycomb, corrugated and serpentine. Each such embodiment uses a thermally conductive plate having opposed exterior surfaces; one for receiving a component to be cooled and one for receiving the fin structures. The serpentine structured fin embodiment employs a plurality of fin supports extending from the plate and forming a plurality of channels for receiving the fin structures. A high thermal conductivity bondant, such as metal-filled epoxy, may be used to bond the fin structures to either the plate or the fin supports. Dip brazing and soldering may also be employed depending upon the materials selected.

Claims

1. A heat sink assembly of the type receiving an electrical component in intimate engagement for dissipating heat generated by such component, such heat dissipation being promoted by forced air flow through the assembly;

the assembly comprising;

a top plate having a first surface for receiving said component and a second surface for receiving fin structures;

a plurality of fin structures each bonded to said second surface of said top plate and extending therefrom;

at least two of said fin structures being in relative spaced relation to form an air inlet path therebetween whereby an air flow into said inlet between said two fin structures is divided, with a respective portion of said air flow being directed through each of said two fin structures; and

a cover plate partially enclosing said fin structures and having an opening adjacent said air inlet;

wherein said fin structures are formed of a serpentine structured material.

2. A heat sink assembly of the type receiving an electrical component in in intimate engagement for dissipating heat generated by such component, such heat dissipation being promoted by forced air flow through the assembly;

the assembly comprising;

a top plate having a first surface for receiving said component and a second surface for receiving fin structures;

a plurality of fin structures each bonded to said second surface of said top plate and extending therefrom;

at least two of said fin structures being in relative spaced relation to form an air inlet path therebetween whereby an air flow into said inlet between said two fin structures is divided, with a respective portion of said air flow being directed through each of said two fin structures; and

a cover plate partially enclosing said fin structures and having an opening adjacent said air inlet;

wherein said top plate is of a rectangular shape and each of said fin structures is of an elongated rectangular shape.

3. A forced air heat sink assembly comprising a thermally conductive planar member having a first surface for receiving a component to be cooled thereby and having a second surface;

and

at least two fin structures in intimate contact with said second surface and separated from each other to form a gap therebetween, said gap extending from said second surface and configured for receiving air flowing toward said second surface, dividing said air into two portions and directing each such portion through a separate fin structure for removing heat therefrom.

4. The assembly recited in claim 3 wherein said fin structures are formed of a honeycomb formed material.

5. The assembly recited in claim 3 wherein said fin structures are formed of a corrugated formed material.

6. The assembly recited in claim 3 wherein said fin structures are formed of a serpentine formed material.

7. The assembly recited in claim 3 wherein said planar member is an integral portion of said electrical component.

8. The assembly recited in claim 3 further comprising an enclosure having an inlet and an outlet, said gap between said fin structures being positioned adjacent said enclosure inlet.

9. The assembly recited in claim 3 further comprising a plurality of fin supports extending from said second surface of said planar member and forming a plurality of channels therebetween for receiving said fin structures.

10. The assembly recited in claim 6 further comprising a plurality of fin supports extending from said planar member and forming a plurality of channels for receiving said serpentine structured fin structures.

11. The assembly recited in claim 10 wherein each of said fin supports is recessed between said fin structures to promote air flow from said gap to each of said fin structures.

12. The assembly recited in claim 10 wherein each of said serpentine structured fin structures is bonded to said fin supports.