High thermal resistance bonding material and semiconductor structures using same

• US 4,888,634 A
• Filed: 02/03/1989
• Issued: 12/19/1989
• Est. Priority Date: 07/24/1987
• Status: Expired due to Term

• Current Assignee: Linear Technology Corporation (Analog Devices, Inc.)
• Original Assignee: Linear Technology Corporation (Analog Devices, Inc.)
• Inventors: Lai, Chong K., Dobkin, Robert C.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): Limanek, Robert P.
• Application Number:
  US07/307,234
• Time in Patent Office: 319 Days
• Field of Search: 357/72, 357/80
• US Class Current: 257/783
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/29388 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/295 : containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49513 : having bonding material between chip and die pad
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A high thermal resistance bonding material for semiconductor chips includes a binder such as epoxy or polyimide and high thermal resistance material dispersed therein such as glass micropheres, glass beads, ceramic microspheres and ceramic beads. The particles of high thermal resistance material are sieved to obtain particles of generally uniform size. In plastic-encapsulated semiconductor chips, each chip is enveloped by the bonding material.

Claims

1. A semiconductor structure combination in which a uniform temperature is provided throughout a semiconductor chip, said combination comprising a supporting substrate for said chip, and a bonding material between and in direct contact with said chip and said substrate, said bonding material including a binder and high thermal resistance material in the form of sieved particles of generally uniform size with diameters of at least two mils, said particles being dispersed throughout said binder and providing uniform spacing and uniform thermal insulation between said chip and said substrate.

2. The combination as defined by claim 1 wherein said bonding material envelopes said chip.

3. The combination as defined by claim 1 wherein said binder is selected from the group consisting of silicone, epoxy and polyimide.

4. The combination as defined by claim 3 wherein said high thermal resistance material is selected from the group consisting of glass microspheres, glass beads, ceramic microspheres, and ceramic beads.

5. The combination as defined by claim 1 wherein said high thermal resistance material is selected from the group consisting of glass microspheres, glass beads, ceramic microspheres, and ceramic beads.