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Bonding method employing thermally stable hot melt moisture-cure polyurethane adhesive composition

  • US 4,891,269 A
  • Filed: 03/07/1988
  • Issued: 01/02/1990
  • Est. Priority Date: 01/29/1986
  • Status: Expired due to Term
First Claim
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1. A method of joining at least two substrates, which comprises:

  • (a) forming an assembly comprising at least two substrates having therebetween a sufficient bonding amount of an adhesive having both hot melt and thermosetting urethane properties; and

    (b) curing the adhesive;

    wherein the adhesive comprises;

    (i) an effective film-forming amount of thermoplastic ethylene-vinyl monomer copolymer base wherein the vinyl monomer comprises an acrylate monomer or a vinyl ester of a carboxylic acid compound;

    (ii) an effective bonding amount of a liquid polyurethane prepolymer composition having a viscosity of less than 25,000 cP at 25°

    C. comprising the reaction product of a polyfunctional hydroxy compound having a number of average molecular weight of at least 1,000 and a polyfunctional isocyanate compound having an isocyanate functionality of about two or more, at a ratio of hydroxyl to isocyanate of 0.1 to 0.7;

    1, sufficient to form a rigid moisture cure bond;

    (iii) a phenol-free polymeric tackifier composition comprising the polymerization product of aromatic monomers, aliphatic monomers, or mixtures thereof, said aromatic monomers being selected from the group consisting of an indene monomer, a styrene monomer, or a dicyclopentadiene monomer, said aliphatic monomer comprising a C5 diene; and

    (iv) about 0 to 5 wt-% of an antioxidant.

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