Photon counting structure and system
First Claim
1. A structure for counting low levels of photons comprisinga plurality of thin wafers of solid state material stacked in parallel,said wafers having a width of 0.1 mm to 2.0 mm perpendicular to the direction of travel of the photons to be detected,electrodes disposed on opposed sides of each said wafers and with thin layers of insulation overlying said electrodes,said wafers producing a change in an electrical parameter when impinged upon by a photon,each said wafer having a depletion region of a depth in line with incident photons to be detected, sufficient to provide depletion of the maximum energy level of photons to be detected,a further region of each wafer lying beyond said depletion region providing sufficient volume for an integrated circuit that interfaces with external equipment to provide to such equipment an indication of the number of photons detected by the wafer over a specified period of time, andan integrated circuit formed on said further region.
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Accused Products
Abstract
A detector for counting low levels of photons comprises a plurality of thin solid state wafers of a photons sensitive material such as gallium arsenide; the wafers being of the order of one-tenth to two millimeter thick depending upon use, and providing a depletion layer of 2 to 20 millimeters deep depending upon the energy of the photons to be detected. The electrical length of the wafer depends upon the use for which the panel is designed and may be one-tenth to two millimeters if two dimensional analysis is desired. Some of the wafers depending upon their materials have a region beyond the 2 to 20 millimeter depth in which is formed an integrated circuit including a detector, preamplifier, discriminator, scaler and read out buffer, each responsive to a different multiplexed, digitized address word. The wafers are connected as PIN diodes and are properly biased for such function. Those wafers using materials on which IC cannot be formed are connected to ICs by leads.
19 Citations
12 Claims
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1. A structure for counting low levels of photons comprising
a plurality of thin wafers of solid state material stacked in parallel, said wafers having a width of 0.1 mm to 2.0 mm perpendicular to the direction of travel of the photons to be detected, electrodes disposed on opposed sides of each said wafers and with thin layers of insulation overlying said electrodes, said wafers producing a change in an electrical parameter when impinged upon by a photon, each said wafer having a depletion region of a depth in line with incident photons to be detected, sufficient to provide depletion of the maximum energy level of photons to be detected, a further region of each wafer lying beyond said depletion region providing sufficient volume for an integrated circuit that interfaces with external equipment to provide to such equipment an indication of the number of photons detected by the wafer over a specified period of time, and an integrated circuit formed on said further region.
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3. A structure for counting low levels of photon emission comprising
a plurality of thin wafers of solid state material stacked in parallel, said wafers having a width of 0.1 mm to 2.0 mm perpendicular to the direction of travel of the photons to be detected, electrodes disposed on opposed surfaces of each said wafer with thin layers of insulation overlying said electrodes, means biasing each said wafer to operate as a PIN diode, each said wafer having a depletion region generally parallel to the direction of travel of photons to be detected sufficient to capture photons having an energy range of interest, said depletion regions being of a maximum depth such that cross-talk between wafers is maintained at a level below a level that effects the accuracy of photon counts.
Specification
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- Resources
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Current AssigneeMichael Danos
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Original AssigneeMichael Danos
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InventorsDanos, Michael
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Primary Examiner(s)NOT, DEFINED
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Assistant Examiner(s)NOT, DEFINED
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Application NumberUS07/110,444Time in Patent Office805 DaysField of Search250/370 R, 250/370 E, 250/370 H, 250/370 G, 250/370 K, 250/338 A, 357/30 F, 357/30 G, 357/30 H, 357/30 R, 357/58US Class Current250/370.09CPC Class CodesH01L 27/14649 Infrared imagers
