Multiple stage heat shielding for transducer support arm
First Claim
1. In a magnetic transducing apparatus including a substantially rigid transducer support arm movable with respect to a magnetic data recording surface, a magnetic transducing head mounted to the arm for movement with the arm and positioned for interaction with the recording surface, an integrated circuit mounted with respect to the arm, a flexible electrical circuit electrically connected to the transducing head and to the integrated circuit, said flexible circuit mounted with respect to the arm between the arm and the integrated circuit, a means for mounting the integrated circuit to thermally isolate the integrated circuit from the arm and dissipate heat generated in the integrated circuit, said mounting means including:
- a plurality of mounting stages cooperating to support the integrated circuit in longitudinally spaced apart relation to the transducer support arm, each of said stages disposed with its major dimensions substantially in a lateral plane, said stages comprising;
first and second thermally conductive foil stages between said integrated circuit and said flexible circuit;
an electrically insulative and thermally conductive first adhesive stage between said integrated circuit and said first foil stage for bonding the integrated circuit with respect to the first foil stage;
a thermally insulative second adhesive stage between said first and second foil stages for bonding the first and second foil stages with respect to one another;
a thermally and electrically insulative third adhesive stage between the second foil stage and the flexible circuit for bonding the second foil stage with respect to the flexible circuit; and
a thermally insulative fourth adhesive stage between the flexible circuit and the transducer support arm for bonding the flexible circuit with respect to the arm.
8 Assignments
0 Petitions
Accused Products
Abstract
A support means is disclosed for mounting an integrated circuit chip preamplifier with respect to an aluminum transducing head support arm in a magnetic disc drive. The support means includes two heat shields, each with an aluminum foil layer facing the preamplifier and a thermally insulative adhesive layer facing the rigid arm. The preamplifier is secured to the foil layer of the most adjacent heat shield with an electrically insulative but thermally conductive adhesive. The alternating thermally conductive and thermally insulative layers interfere with longitudinal heat transfer but allow lateral heat transfer to promote heat dissipation laterally outwardly of the support means, and thus substantially reduce thermal expansion of the support arm.
25 Citations
11 Claims
-
1. In a magnetic transducing apparatus including a substantially rigid transducer support arm movable with respect to a magnetic data recording surface, a magnetic transducing head mounted to the arm for movement with the arm and positioned for interaction with the recording surface, an integrated circuit mounted with respect to the arm, a flexible electrical circuit electrically connected to the transducing head and to the integrated circuit, said flexible circuit mounted with respect to the arm between the arm and the integrated circuit, a means for mounting the integrated circuit to thermally isolate the integrated circuit from the arm and dissipate heat generated in the integrated circuit, said mounting means including:
a plurality of mounting stages cooperating to support the integrated circuit in longitudinally spaced apart relation to the transducer support arm, each of said stages disposed with its major dimensions substantially in a lateral plane, said stages comprising; first and second thermally conductive foil stages between said integrated circuit and said flexible circuit; an electrically insulative and thermally conductive first adhesive stage between said integrated circuit and said first foil stage for bonding the integrated circuit with respect to the first foil stage; a thermally insulative second adhesive stage between said first and second foil stages for bonding the first and second foil stages with respect to one another; a thermally and electrically insulative third adhesive stage between the second foil stage and the flexible circuit for bonding the second foil stage with respect to the flexible circuit; and a thermally insulative fourth adhesive stage between the flexible circuit and the transducer support arm for bonding the flexible circuit with respect to the arm. - View Dependent Claims (2, 3, 4, 5, 6)
-
7. In a magnetic transducing apparatus including a transducer support arm movable with respect to a magnetic data recording surface, a magnetic transducing head mounted to the arm for movement with the arm and positioned to interact with the recording surface, a flexible electrical circuit means mounted to the arm and electrically connected to the transducing head, and an integrated circuit mounted with respect to the arm and flexible circuit and electrically connected to the flexible circuit, wherein the improvement comprises:
-
a plurality of heat shield members in stacked relation between said integrated circuit and flexible circuit means for supporting the integrated circuit in longitudinally spaced relation to the flexible circuit means and said support arm, each of said shields disposed with its major dimensions substantially in a lateral plane and being substantially uniform in longitudinal section; each of said shielding members consisting essentially of a laterally extended thermally conductive layer forming a side of the shield facing the integrated circuit, and a laterally extended thermally insulative layer adjacent the thermally conductive layer and forming a side of the shield facing the flexible circuit; and an adhesive means for securing the integrated circuit with respect to the thermally conductive layer of the shielding member disposed adjacent the integrated circuit. - View Dependent Claims (8, 9, 10, 11)
-
Specification