Metal-core printed wiring board and a process for manufacture thereof

• US 4,894,271 A
• Filed: 05/06/1988
• Issued: 01/16/1990
• Est. Priority Date: 05/06/1987
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Nishimoto, Yoshio, Kimura, Minoru, Hani, Kiyoshi, Nakai, Tatsushi, Hayama, Mutsuko, Hishiki, Hiroshi
• Primary Examiner(s): Dees, Jose G.
• Assistant Examiner(s): Ryan, P. J.
• Application Number:
  US07/190,986
• Time in Patent Office: 620 Days
• Field of Search: 428/137, 428/209, 428/210, 428/211, 428/901, 428/457, 428/469, 156/89, 174/68.5, 361/397
• US Class Current: 428/137
• CPC Class Codes: B32B 15/14 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2260/046 Synthetic resin
• CPC Class Codes: B32B 2262/105 Ceramic fibres
• CPC Class Codes: B32B 2305/076 Prepregs
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2311/24 Aluminium
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0251 Non-conductive microfibers relatively short elongated particles H05K2201/0248
• CPC Class Codes: H05K 2201/0284 Paper, e.g. as reinforcement paper sheet substrates H05K1/0386
• CPC Class Codes: H05K 2201/0293 Non-woven fibrous reinforcement
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 3/427 initial plating of through-holes in metal-clad substrates
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24322 Composite web or sheet
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer
• CPC Class Codes: Y10T 428/24934 : including paper layer
• CPC Class Codes: Y10T 428/31678 : Of metal

Abstract

Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.

Claims

1. A metal-core printed wiring board, comprising:

(a) a metal core having a core wall defining a through hole extending between two major surfaces of said metal core;

(b) a pair of insulating layers, one of said insulating layers being formed on a respective one of said surfaces of said core, said insulating layers containing ceramic paper, wherein said ceramic paper consists essentially of short ceramic fibers having a maximum diameter of five microns and a length of 5 to 500 microns and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for said ceramic fibers, said microfibrillated cellulose fibers having a diameter of no more than one micron;

(c) two wiring patterns, each of said wiring patterns being formed on respective ones of said insulating layers; and

(d) a through hole conductor extending through said through hole of said core for connecting said wiring patterns electrically to each other, an insulator being formed between said through hole conductor and said core wall, said insulator comprising a material which is substantially identical in composition to said ceramic paper.

2. A printed wiring board as set forth in claim 1, wherein said ceramic fibers comprise fibers selected from the group consisting of alumina, alumina silicate, mullite, spinel, beryllia, boron, boron nitride, silicon nitride, aluminum nitride, and glass fibers.

3. A printed wiring board as set forth in claim 1, wherein said ceramic paper is impregnated with a synthetic resin selected from the group consisting of phenol, diallyl phthalate, epoxy, polyester, and polyimide resin.

4. A printed wiring board as set forth in claim 1, wherein said core is aluminum.

5. A process for manufacturing a metal-core printed wiring board, said process comprising the following steps:

(a) laying a plurality of prepreg sheets composed of ceramic paper impregnated with a resin on each of two major surfaces of a metal core having a core wall defining a through hole, wherein said ceramic paper consists essentially of short ceramic fibers having a maximum diameter of five microns and a length of 5 to 500 microns and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for said ceramic fibers, said microfibrillated cellulose fibers having a diameter of no more than one micron;

(b) laying a wiring pattern forming conductor over said prepreg sheet on each side of said metal core to form an assembly;

(c) pressing said assembly under heat, such that said through hole is filled with an insulating material, while an insulating layer is formed on each of said major surfaces of said core; and

(d) forming a through hole conductor extending through said through hole in said insulating material and a wiring pattern from said conductor on said insulating layer, while an insulator of a material which is substantially identical in composition to said prepreg sheets is formed between said through hole conductor and a core wall defining said through hole of said core.

6. A process as set forth in claim 5, wherein said plurality of prepreg sheets comprise at least two prepreg sheets, one of said prepreg sheets containing a larger quantity of said resin than the other, said one of said prepreg sheets being laid between said core and said other prepreg sheet.

7. A process as set forth in claim 5, wherein said ceramic fibers comprise fibers selected from the group consisting of alumina, alumina silicate, mullite, spinel, beryllia, boron, boron nitride, silicon nitride, aluminum nitride, and glass fibers.

8. A process as set forth in claim 5, wherein said ceramic paper is impregnated with a synthetic resin selected from the group consisting of phenol, diallyl phthalate, epoxy, polyester, and polyimide resin.

9. A process as set forth in claim 5 wherein said core comprises aluminum.

10. A process as set forth in claim 6 wherein said core comprises aluminum.

11. A process as set forth in claim 5 wherein said core comprises aluminum.

12. A process as set forth in claim 7 wherein said core comprises aluminum.

13. A process as set forth in claim 8 wherein said core comprises aluminum.