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Semiconductor wafer array

  • US 4,897,708 A
  • Filed: 07/17/1986
  • Issued: 01/30/1990
  • Est. Priority Date: 07/17/1986
  • Status: Expired due to Fees
First Claim
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1. A wafer array comprising:

  • a plurality of wafers of material which are disposed in a stack one on top of another;

    a through-hole in each of said wafers in said stack, said through-hole having an apex at one surface of said wafer and a base at the opposite surface of said wafer with an outwardly sloping sidewall extending from said apex to said base.first retaining means for retaining said through-hole in one of said wafers in said stack in registration with said through-hole in an adjacent wafer in said stack;

    an electrically conductive pad located adjacent to said apex of said through-hole in each of said wafers, said base of said through-hole being large enough to extend over the electrically conductive pad located adjacent to said apex of a through-hole in registration therewith on an adjacent wafer;

    an electrically conductive liquid which extends through said through-hole in each of said wafers for electrically connecting said electrically conductive pad on one of said wafers with said electrically conductive pad on said adjacent wafer;

    means for electrically isolating said electrically conductive liquid from exposed surfaces of said wafer material; and

    second and third retaining means located on the top and bottom of said stack, respectively for retaining said electrically conductive liquid in said through-holes, said third retaining means including means for electrically connecting said electrically conductive liquid to an external device.

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