On chip heater element and temperature sensor

• US 4,899,180 A
• Filed: 04/29/1988
• Issued: 02/06/1990
• Est. Priority Date: 04/29/1988
• Status: Expired due to Fees

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Buhler, Steven A., Elhatem, Abdul M.
• Primary Examiner(s): Hartary, Joseph W.
• Application Number:
  US07/187,779
• Time in Patent Office: 648 Days
• Field of Search: 346/140, 374/152, 374/141, 374/147
• US Class Current: 347/59
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/0458 controlling heads based on heating elements forming bubbles
• CPC Class Codes: B41J 2002/14379 Edge shooter

Abstract

This bubblejet device has integrated into it a number of heater resistors and a temperature sensor which operate in conjunction with a temperature regulating circuit to heat the chip to its optimum operating temperature within seconds of turn-on, and thereafter maintain that temperature regardless of local temperature variations. The precise temperature regulation of the array improves print quality.

Claims

1. A thermal ink jet array device formed on a silicon substrate comprising:

an array of ink jet channels,

an ink inlet,

connecting means for allowing ink to flow from said inlet to said ink jet channels,

a sensor means for sensing the temperature of said device and for outputting a signal which is a function of the device temperature, said sensor means comprising a temperature sensing element, and a differential amplifier for outputting said signal which is a function of the temperature sensed by said sensing element, and

means for heating coupled to said signal for heating said device,

said channels, inlet and connecting means being cavities etched into said silicon substrate, and said sensor means and means for heating being integrated on said silicon substrate.

2. A thermal ink jet array device formed on a silicon substrate comprising:

an array of ink jet channels,

an ink inlet,

connecting means for allowing ink to flow from said inlet to said ink jet channels,

a sensor for sensing the temperature of said substrate and for outputting a signal which is a function of the device temperature,

active electronic components integrated on said silicon device, and

means for heating coupled to said signal for heating said device,

said channels, inlet and connecting means being cavities etched into said silicon substrate, and said sensor, active components and means for heating being integrated on said silicon substrate.