Heat sink

• US 4,899,210 A
• Filed: 01/20/1988
• Issued: 02/06/1990
• Est. Priority Date: 01/20/1988
• Status: Expired due to Fees

• Current Assignee: Wakefield Thermal Solutions, Inc. (The Heico Cos. LLC)
• Original Assignee: Wakefield Engineering, Inc.
• Inventors: Pontes, Manuel, Lorenzetti, Victor
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US07/146,213
• Time in Patent Office: 748 Days
• Field of Search: 357/81, 357/82, 361/382, 361/385, 165/80.4
• US Class Current: 257/712
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat sink adapted for use with VLSI and other integrated circuit elements which includes a base adapted to be in thermal contact with the element to be cooled, there preferably being at least one projection from the side of the base adapted to be adjacent to the element, and a plurality of pins extending from the other side of the base in a direction substantially perpendicular thereto. The projection from the base may either be in the form of a center pedestal which is secured to the element to be cooled by a suitable adhesive, limiting the thermal stress area, or may be a plurality of projections formed in a predetermined pattern which are adapted to be in physical contact with the element and to provide a controlled standoff therefrom which defines a uniform adhesive bond line. The heat sink also preferably provides a means for reducing the temperature gradient between the center pins and peripheral pins which results from the center of the integrated circuit typically being hotter than the outer areas. For a preferred embodiment, this is acomplished by having a dish-shaped base which provides improved heat transfer to the outer pins.

Claims

1. A heat sink for an element to be cooled comprising:

a base;

a plurality of pins extending substantially perpendicular to the base, said pins being arranged in a predetermined pattern; and

at least one projection integral with said base, extending from the side thereof adjacent the element to be cooled and having an area for the projection surface parallel to the side from which it extends and adapted to make thermal contact with the element to be cooled which is sufficient to provide good thermal transfer between the heat sink and the element while maintaining the area of contact to a fraction of the base area sufficiently small to assure that uneven thermal expansion between the heat sink and element does not cause damage to the element.

2. A heat sink as claimed in claim 1 wherein said pin pattern is symmetrical, whereby the heat sink is omnidirectional.

3. A heat sink as claimed in claim 1 wherein said pin pattern is staggered.

4. A heat sink as claimed in claim 1 wherein said projection is a center pedestal, said pedestal being adapted to be bonded to the element.

5. A heat sink as claimed in claim 1 wherein said projections form a predetermined pattern and are adapted to be in contact with the element.

6. A heat sink as claimed in claim 5 wherein said heat sink is bonded to the element by an adhesive bond, there being a desired thickness for said bond;

and

wherein said projections are of a height substantially equal to the desired adhesive bond thickness, providing a controlled space standoff for the adhesive.

7. A heat sink as claimed in claim 1 wherein said base, at least one projection and pins are formed as a single, substantially homogeneous piece of material.

8. A heat sink as claimed in claim 7 wherein said material is a metal.

9. A heat sink as claimed in claim 8 wherein said heat sink is formed by being cast.

10. A heat sink as claimed in claim 9 wherein the metal selected as the material is a metal which is particularly adapted to be cast.

11. A heat sink as claimed in claim 1 wherein said heat sink has a center portion and outer portions, the center portion being adapted to be in contact with a portion of the element which is normally hotter than the portions in contact with the outer areas of the heat sink;

and

wherein said heat sink includes means for reducing the resulting temperature gradient between the pins in said center and outer portions.

12. A heat sink as claimed in claim 11 wherein said gradient reducing means includes said base being shaped to provide an improved heat conduction path to the pins extending from the outer portions of the base.

13. A heat sink as claimed in claim 12 wherein the thickness of the base increases in a predetermined way from the center to the periphery of the base.

14. A heat sink as claimed in claim 13 wherein said base is dish-shaped.

15. A heat sink as claimed in claim 14 wherein the height of the pins is greatest in said center portion where said base is of least thickness and decreases for pins toward the periphery which project from portions of the base of increasing thickness, permitting the tops of the pins to be in a common plane parallel to the plane of the base bottom.

16. A heat sink as claimed in claim 1 wherein the center pin is a post, the diameter of the post being greater than that of the pins.

17. A heat sink as claimed in claim 1 wherein the heat sink is particularly adapted for use with integrated circuit elements.

18. A heat sink for an element to be cooled which element has at least one portion which is hotter than other portions of the element comprising:

a base having a central portion and peripheral portions, the base being adapted to be in thermal contact with the element to be cooled with the center portion of the base thermally contacting the hotter portion of said element, the thickness of said base being least in said center portion and increasing in a predetermined way from the center portion to the periphery of the base;

a plurality of pins extending substantially perpendicular to the base, said pins being arranged in a predetermined pattern; and

the varying thickness of the base being operative to reduce the temperature gradient between pins over said center portion and pins over said peripheral portions.

19. A heat sink as claimed in claim 18 wherein said base is dish-shaped.

20. A heat sink as claimed in claim 19 wherein the height of the pins is greatest for pins extending from the center of the base where the base is of least thickness and decreases for pins extending from peripheral portions of the base of increasing thickness, permitting the tops of the pins to be in a common plane parallel to the plane of the base bottom.

21. A heat sink as claimed in claim 18 wherein said base and pins are formed as a single substantially homogeneous piece of material.