Aligner bonder
First Claim
1. An aligning and bonding tool for use in aligning and bonding locations on facing surfaces of parts of a miniaturized electronic component, comprising a first support means for supporting a first of said parts, second support means for supporting a second of said parts with the surface thereof facing the surface of the first part, means for controlling relative positioning of the first and second support means, an optical probe for movement into a position between the facing surfaces of the parts, illumination means for lighting each of the facing surfaces, optical means for directing an optical image of each of the facing surfaces away from the probe, and video means responsive to the optical images for combining the optical images of the facing surfaces into a single video image, whereby the means for controlling relative positioning of the first and second support means effects relative positioning of the video representation of the facing surface locations to be aligned to enable visual alignment of locations of the facing surfaces.
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Accused Products
Abstract
An aligner bonder for joining parts of a miniature semiconductor component, for example, comprises supports for holding the parts with surfaces facing, positioning provisions for adjusting relative positions and inclinations of the parts and for bringing the facing surfaces together for bonding. A first inclined two-sided mirror directs light from a pair of illuminators to the surfaces. Images of the surfaces are diverted from the inclined reflective mirror faces to optical paths and then to video cameras. Individual video circuitry and illuminator adjustments permit adjustment of each video image. The images are combined in a single video image displayed on a monitor. The supports for the parts are positionally adjusted to bring the video images into alignment. To adjust parallelism, autocollimators and associated reference image cross hairs project reference images via another inclined two-sided mirror to the surfaces of the parts or parallel reference surfaces. The reference image projected to the surfaces are reflected back to the video cameras via the reflective faces of the second two-sided mirror and associated optical paths. The positional relationship of the two reference images, as they appear in a combined video display are indicative of the relative inclination of the surfaces and can be adjusted to bring the surfaces parallel before retracting the probe from between the surfaces, bringing together the surfaces and bonding the parts.
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Citations
24 Claims
- 1. An aligning and bonding tool for use in aligning and bonding locations on facing surfaces of parts of a miniaturized electronic component, comprising a first support means for supporting a first of said parts, second support means for supporting a second of said parts with the surface thereof facing the surface of the first part, means for controlling relative positioning of the first and second support means, an optical probe for movement into a position between the facing surfaces of the parts, illumination means for lighting each of the facing surfaces, optical means for directing an optical image of each of the facing surfaces away from the probe, and video means responsive to the optical images for combining the optical images of the facing surfaces into a single video image, whereby the means for controlling relative positioning of the first and second support means effects relative positioning of the video representation of the facing surface locations to be aligned to enable visual alignment of locations of the facing surfaces.
- 13. An aligner bonder for aligning and bonding regions of facing surfaces of parts of a semiconductor component such as an integrated circuit or the like comprising first and second video cameras, first and second individual video image adjusting circuitry means operatively connected to each of the first and second video cameras, respectively, for adjusting a video image produced by each camera, mixing means for combining image signals from the first and second video cameras, a monitor for displaying the combined video signals, first support means for supporting a first part of a semiconductor component having a first surface with regions thereon to be aligned and bonded, second support means for supporting a second part of a semiconductor component having a second surface with regions thereon to be aligned and bonded with the regions on the first part, the first and second support means supporting the first and second parts with the first and second surfaces facing each other and spaced a relatively short distance apart, optical means for transmitting first and second images from the first and second surfaces to the first and second video cameras, said optical means including a probe movable to and from a position between the first and second surfaces, and means for controlling the positioning of the first and second support means to align the regions of the first and second surfaces and to move the regions into engagement for bonding upon retraction of the probe.
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19. A video-optical assembly for an aligner bonder comprising a probe, first and second two-sided mirror means located on the probe and each having two reflective faces inclined to reflect light directed thereto from opposite sides thereof in opposite directions therefrom, first and second pairs of mirrors located to direct light to the opposite reflective faces of the first and second two-sided mirror means and to receive images from the opposite reflective faces of the first and second two-sided mirror means, a pair of autocollimators, first and second reference image forming means in the paths of collimated light from the autocollimators, lenses in the paths of the collimated light from the autocollimators to the first pair of mirrors to provide the first and second reference images to the opposite reflective faces of the first of the two sided mirror means via the first pair of mirrors, first and second illumination means, and first and second means defining an optical path between the first and second illumination means and the second pair of mirrors to illuminate the reflective faces of the second two-sided mirror, first and second video cameras, and means for directing images to the first and second video cameras from the opposite reflective surfaces of the first and second two-sided mirror means.
- 20. The method of aligning for bonding the facing surfaces of first and second parts of a miniature semiconductor device comprising supporting the first and second parts with the facing surfaces thereof spaced apart, providing an optical probe having a two-sided mirror secured thereon diagonally with respect to the facing surfaces, introducing the probe between the facing surfaces, providing first and second video cameras, directing images of the surfaces from opposite reflective faces of the two-sided mirror along optical paths to the video cameras, combining outputs of the video camera, displaying a combined image of the facing surfaces on a video monitor, adjusting the relative positions of the facing surfaces until locations to be brought together are aligned in the video image, withdrawing the optical probe, moving the first and second parts together until the facing surface locations to be brought together contact, and bonding the contacting locations.
Specification