Surface inspection method and apparatus therefor

• US 4,902,131 A
• Filed: 03/27/1986
• Issued: 02/20/1990
• Est. Priority Date: 03/28/1985
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yamazaki, Yuichiro, Ogawa, Shigeru, Okumura, Katsuya, Miyoshi, Motosuke
• Primary Examiner(s): Rosenberger, Richard A.
• Application Number:
  US06/844,601
• Time in Patent Office: 1,426 Days
• Field of Search: 356/336, 356/337, 356/338, 356/446, 356/237, 357/336, 357/337, 357/338, 357/446
• US Class Current: 356/336
• CPC Class Codes: G01N 21/4738 Diffuse reflection precedence is given to G01N21/55 - G01N21/57 if specular component is taken into consideration, e.g. also for testing fluids, fibrous materials
• CPC Class Codes: G01N 21/94 Investigating contamination, e.g. dust G01N21/85 takes precedence

Abstract

A novel technique suitable for inspection or examination of the surface condition of a substrate such as a semiconductor wafer. First is one irradiates a light e.g. a laser beam on a substrate surface to focus a scattered light therefrom. Next detects the scattered light focused e.g. with a photomultiplier tube, thus to inspect the substrate surface. When the detection of the scattered light is thus carried out, correction means e.g. a circuit for controlling a voltage applied to the photomultiplier tube, a filter having a variable light-screening factor, a movable iris or an amplification factor adjustment circuit etc. is used to correct the detection sensitivity in accordance with the reflectivity of the substrate surface. Practically, such a corrective operation is carried out on the basis of the intensity of a scattered light or a regularly reflected light from the substrate surface. Further, it may be possible to obtain a signal for control of the corrective operation by averaging signals detected when the substrate surface is subject to scanning of an irradiating light. Thus, this surface inspection technique can detect particles attached on the substrate surface always utilizing the same slice level and the same sensitivity even when substrates having different indices of reflection are employed.

Claims

1. A method of inspecting a substrate surface having a known reflectivity to detect the diameters of particles on the substrate surface, comprising the steps of:

irradiating light on said substrate surface,

collecting scattered light from said particles,

detecting said scattered light collected, and

compensating for detection sensitivity of said scattered light in accordance with a compensation control signal on the basis of intensity of said scattered light from said particles corresponding to reflectivity of said substrate surface so that the particle diameters on the substrates can be detected correctly even when the reflectivities of the substrate surface differ from a standard.

2. A method according to claim 1, wherein said correction control signal is obtained by averaging signals detected when said substrate surface is subject to scanning of said irradiating light.

3. A method of inspecting a substrate surface having a known reflectivity to detect the diameters of particles on the substrate surface, comprising the steps of:

irradiating light on said substrate surface;

collecting scattered light from said substrate surface,

detecting said scattered light collected, and

compensating for detection sensitivity of said scattered light in accordance with a compensation control signal on the basis of intensity of regularly reflected light from said substrate surface corresponding to reflectivity of said substrate surface so that the particle diameters on the substrates can be detected correctly even when the reflectivities of the substrate surface differ from each other.

4. A method according to claim 3, wherein said compensation control signal is obtained by averaging signals detected when said substrate surface is subject to scanning of said irradiating light.

5. An apparatus for inspecting a substrate surface, having a known reflectivity to detect the diameters of particles on the substrate surface, comprising:

a light source irradiating light on said substrate surface,

means for collecting scattered light from said particles,

a photomultiplier tube for detecting said scattered light collected by said collecting means,

a detector circuit for detecting an amplitude of said scattered light,

means for outputting a compensation control signal corresponding to said reflectivity of said substrate surface on the basis of intensity of said scattered light from said substrate surface, and

means for compensating for detection sensitivity of said photomultiplier tube in accordance with reflectivity of said substrate surface, so that the particle diameters on the substrates can be detected correctly even when the reflectivities of the substrate surfaces differ from each other.

6. An apparatus according to claim 5, wherein said compensation control signal outputting means is operative to output the compensation control signal obtained by averaging detection signals from said detector circuit.

7. An apparatus according to claim 5, wherein said compensating means is operative to compensate said detection sensitivity by adjusting an applied voltage to said photomultiplier tube.

8. An apparatus according to claim 5, wherein said compensating means is comprised of a filter having a variable light-screening factor provided in front of said photomultiplier tube.

9. An apparatus according to claim 5, wherein said compensating means is comprised of a movable iris provided in front of said photomultiplier.

10. An apparatus according to claim 5, wherein said compensating means is comprised of means for adjusting amplification factor of said detector circuit.

11. An apparatus for inspecting a substrate surface having a known reflectivity to detect the diameters of particles on the substrate surface, comprising:

a light source irradiating light on said substrate surface,

means for collecting scattered light from said substrate surface,

a photomultiplier tube for detecting said scattered light collected by said collecting means, and

a detector circuit for detecting amplitude of said scattered light,

means for outputting a compensation control signal corresponding to said reflectivity of said substrate surface on the basis of intensity of a regularly reflected light from said substrate surface,

a detector circuit for detecting amplitude of said scattered light,

means for compensating a detection sensitivity of said photomultiplier tube in accordance with a reflectivity of said substrate surface, so that the particle diameters on the substrates can be detected correctly even when the reflectivities of the substrate surfaces differ from each other.

12. An apparatus according to claim 11, wherein said means for outputting a compensation control signal is provided with a second detector means for detecting a regularly reflected light from said substrate surface, said compensation control signal means being operative to output the compensation control signal obtained by averaging detection signals from said second detector means.

13. An apparatus according to claim 11, wherein said apparatus further comprises a second photomultiplier tube for detecting said regularly reflected light.

14. An apparatus according to claim 11, wherein said compensating means is operative to compensate said detection sensitivity by adjusting an applied voltage to said photomultiplier tube.

15. An apparatus according to claim 11, wherein said compensating means is comprised of a filter having a variable light-screening factor provided in front of said photomultiplier tube.

16. An apparatus according to claim 11, wherein said compensating means is comprised of a movable iris provided in front of said photomultiplier tube.

17. An apparatus according to claim 11, wherein said compensating means is comprised of means for adjusting the amplification factor of said detector circuit.