Process for soldering aluminum containing workpieces

• US 4,905,887 A
• Filed: 10/16/1984
• Issued: 03/06/1990
• Est. Priority Date: 12/15/1969
• Status: Expired due to Fees

• Current Assignee: Vereinigte Aluminium Werke AG (Norsk Hydro)
• Original Assignee: Vereinigte Aluminium Werke AG (Norsk Hydro)
• Inventors: Schoer, Heinz, Schultze, Werner
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US06/661,281
• Time in Patent Office: 1,967 Days
• Field of Search: 228/263.17, 228/217, 228/219, 228/221
• US Class Current: 228/217
• CPC Class Codes: B23K 35/282 Zn as the principal constituent
• CPC Class Codes: B23K 35/286 Al as the principal constituent
• CPC Class Codes: B23K 35/288 with Sn or Zn

Abstract

Processes and composition for soldering aluminum-containing workpieces wherein the solder contains components which lower the surface tension and the viscosity of the molten solder, and which lower the interfacial tension between the solder and the aluminum-containing workpieces. Useful components are bismuth, strotium, barium and antimony. The solder may be used with or without flux.

Claims

1. A method of joining aluminum workpieces bearing an aluminum oxide surface layer which comprises:

interposing between said workpieces an aluminum silicon filler metal comprising aluminum, from 6-20% by weight of silicon and from 0.01 to 10% by weight of bismuth; and

heating said workpieces in contact with said filler material until said filler material has reached a molten condition wherein the resulting viscosity and surface tension of said filler material in said molten condition is less than the viscosity and surface tension of said filler material in the absence of bismuth, said heating step being performed in a substantially nonoxidizing atmosphere and in the absence of a flux.

2. A method as defined in claim 1 wherein said filler material comprises from about 0.5 to about 2% by weight bismuth.

3. A method as defined in claim 1 wherein said substantially non-oxidizing atmosphere comprises an inert solder blanketing gas.

4. A method as defined in claim 3 wherein said filler metal contains about 0.05 to 2% by weight of bismuth.

5. The method as defined in claim 3 wherein said inert gas is nitrogen.

17. The method as defined in claim 1 wherein said substance is bismuth.

18. The method as defined in claim 1 wherein said inert gas is nitrogen.

6. In the method of joining aluminum workpieces which comprises heating in contact with said workpieces an aluminum silicon filler metal of a normal viscosity and wettability in the molten condition, the improvement which comprises:

heating in contact with said aluminum workpieces a filler metal comprising aluminum, 6-20% by weight of said filler metal of silicon and at least about 0.01% by weight of bismuth to make the normal viscosity of said filler metal in the molten condition lower than the viscosity of said molten filler metal in the absence of bismuth and to improve the wettability of said filler metal, and

raising the temperature of said filler metal in a substantially non-oxidizing atmosphere including at least one solder blanketing inert gas until said filler metal has reached the molten state, said temperature raising step being performed in the absence of a flux and said temperature being raised to a maximum temperature substantially below the melting point of said aluminum workpieces.

7. The method of claim 6 wherein said inert gas is nitrogen.

8. The method of joining aluminum workpieces bearing an oxide surface layer which comprises:

interposing between said workpieces a filler metal comprising aluminum, from 6-20% by weight of silicon and from about 0.01 to 10% by weight bismuth, and

heating said workpieces in contact with said filler metal to a temperature at which said filler metal is molten, said temperature being substantially below the melting point of aluminum, said heating step being performed in a substantially non-oxidizing atmosphere and in the absence of a flux.

9. A method as defined in claim 8 wherein said filler metal contains about 0.05 to 2% by weight of bismuth.

10. A method of joining aluminum workpieces which comprises:

interposing between said workpieces and in contact therewith an aluminum silicon base filler metal containing at least about 0.01% bismuth to improve the wettability of said molten filler metal,

maintaining said workpieces and said filler metal in a substantially non-oxidizing atmosphere, and

raising the temperature of said filler metal in said substantially non-oxidizing atmosphere until said filler metal has reached a molten state, said temperature being raised in the absence of a flux and at a temperature substantially below the melting point of aluminum.

11. The method as defined in claim 10 which comprises raising the temperature of said filler metal to between about 590°

C. and about 605°

C.

12. The method according to claim 10 wherein said substantially non-oxidizing atmosphere is a vacuum having an absolute pressure between about 10^-1 tor and 10 tor.

13. The method as defined in claim 12 wherein said filler metal contains from about 6 to about 20% by weight of silicon.

14. In the method of soldering two aluminum containing workpieces together in a vacuum without a flux, using a brazing composition comprising aluminum and from about 6 to about 20% by weight of silicon, the improvement which comprises adding to said brazing composition a sufficient quantity of bismuth to reduce substantially the vacuum required to join said work-pieces by brazing in a substantially non-oxidizing atmosphere.

15. The method defined in claim 14 wherein said quantity comprises between about 0.05 and about 2% bismuth.

16. In a process of soldering aluminum containing workpieces, the improvement which comprises the steps of soldering said workpieces with a solder consisting essentially of aluminum, from 6-20% by weight of said solder of silicon and from about 0.01 to 10% by weight of said solder of at least one substance selected from the group consisting of Bi, Sr, Ba and Sb, said substance lowering the viscosity and surface tension of said solder in its molten state and substantially decreasing the interfacial tension between the molten solder and said workpieces and conducting said soldering operation in the absence of a flux and under an inert solder blanketing gas or a low vacuum.