Method of making a hermetically sealed electronic component
First Claim
Patent Images
1. A method of making a hermetically sealed device comprising the steps of:
- (a) disposing an electronic circuit on a substrate;
(b) covering the electronic circuit and substrate with a vitreous sealing glass in granular form in a binder and liquefier;
(c) firing the electronic circuit, substrate and vitreous sealing glass to decompose the binder and liquefier;
(d) fusing the vitreous sealing glass at a temperature below about 380°
C. at a pressure above about 100 psi for a predetermined time interval.
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Abstract
A cermic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.
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Citations
26 Claims
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1. A method of making a hermetically sealed device comprising the steps of:
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(a) disposing an electronic circuit on a substrate; (b) covering the electronic circuit and substrate with a vitreous sealing glass in granular form in a binder and liquefier; (c) firing the electronic circuit, substrate and vitreous sealing glass to decompose the binder and liquefier; (d) fusing the vitreous sealing glass at a temperature below about 380°
C. at a pressure above about 100 psi for a predetermined time interval. - View Dependent Claims (2, 3, 4)
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5. A method of making a hermetically sealed device comprising steps of:
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(a) disposing an electronic circuit on a substrate; (b) mixing a vitreous sealing glass in granular form with a binder and liquefier to form a sealing glass mixture; (c) covering an annular portion of a covering with the sealing glass mixture, said annular portion sized to be larger than said electronic circuit; (d) firing the vitreous glass covering to decompose the liquefier and binder of the glass sealing mixture to leave the vitreous sealing glass; (e) placing the covering on said substrate with said vitreous sealing glass surrounding said electronic circuit and abutting said substrate; and (f) fusing said vitreous sealing glass at a temperature below about 380°
C. at a pressure above about 100 psi to form a hermetic seal of vitreous sealing glass fused to said covering and said substrate. - View Dependent Claims (6, 7, 8)
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9. A method of making a hermetically sealed device comprising the steps of:
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(a) disposing an electronic circuit on an alumina substrate; (b) mixing a uniformly dispersed mixture of silica, soda ash, and lime combined with the oxide of boron with a binder of hydroxypropyl cellulose and liquifier pine oil to form a vitreous sealing glass mixture; (c) screening an annular portion of a vitreous glass covering with the vitreous sealing glass mixture through a mesh screen, said annular portion sized to be larger than said electronic circuit; (d) firing the vitreous glass covering for at least one hour at a temperature of not more than 420°
C. to decompose the liquifier and binder of the glass sealing mixture to leave the vitreous sealing glass on said vitreous glass covering;(e) placing the vitreous glass covering on said substrate with said vitreous sealing glass surrounding said electronic circuit and abutting said substrate; and (f) fusing said vitreous sealing glass for at least 1/2 hour at a temperature between 370°
C. and 375°
C. at 200 psi pressure to form a hermetic seal of vitreous glass fused to said vitreous glass covering and to said substrate. - View Dependent Claims (10, 11, 12)
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13. A method of making a hermetically sealed device comprising the steps of:
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(a) disposing an electronic circuit on a substrate; (b) mixing a uniformly dispersed mixture of silica, soda ash, and lime combined with metal oxides from the group consisting of boron, calcium, lead, lithium, and cerium with a binder of hydroxyalkyl cellulose, wherein the alkyl group contains from one to three carbon atoms, and liquifier from the group consisting of pine oil and dihydric alchol to form a sealing glass mixture; (c) covering an annular portion of a vitreous glass covering with the sealing glass mixture, said annular portion sized to be larger than said electronic circuit; (d) firing the vitreous glass covering for at least one hour at a temperature of not more than 420°
C. to decompose the liquifier and binder of the glass sealing mixture to leave the vitreous sealing glass on said vitreous glass covering;(e) placing the vitreous glass covering on said substrate with said vitreous glass surrounding said electronic circuit and abutting said substrate; and (f) fusing said vitreous sealing glass below 380°
C. at above 100 psi for at least 5 minutes to form a hermetic seal of vitreous glass fused to said vitreous glass covering and to said substrate. - View Dependent Claims (14, 15, 16)
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17. A method of making a hermetically sealed device comprising the steps of:
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providing a substrate; disposing electronic circuitry on said substrate; fusing a covering to said substrate with a vitreous sealing glass at a sealing temperature below about 380°
C. to establish a hermetic seal about said electronic circuitry, wherein said fusing step occurs at an applied pressure above about 100 psi. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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24. A method of making a hermetically sealed device comprising the steps of:
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providing a substrate; disposing a thin film resistive electronic circuitry element on said substrate; and fusing a covering to said substrate with a vitreous sealing glass at a sealing temperature below about 380°
C. at a pressure above about 100 psi to establish a hermetic seal about said thin film resistive element. - View Dependent Claims (25, 26)
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Specification