Electroplating of fine particles with metal

• US 4,908,106 A
• Filed: 04/20/1989
• Issued: 03/13/1990
• Est. Priority Date: 04/25/1988
• Status: Expired due to Fees

• Current Assignee: Nisshin Steel Company Limited (Nippon Steel Corporation)
• Original Assignee: Nisshin Steel Company Limited (Nippon Steel Corporation)
• Inventors: Fujii, Takahiro, Takatsu, Kiyoshi, Kojima, Youichi, Takeshima, Eiki
• Primary Examiner(s): Tufariello, T. M.
• Application Number:
  US07/340,670
• Time in Patent Office: 327 Days
• Field of Search: 204/23
• US Class Current: 205/148
• CPC Class Codes: C25D 5/08 Electroplating with moving electrolyte e.g. jet electroplating using locally applied jets of electrolyte C25D5/026
• CPC Class Codes: C25D 7/00 Electroplating characterised by the article coated

Abstract

Disclosed herein suspension electroplating of fine particles with metal. An electroplating operatively equipped with a cathode and anode is charged with a metallic ion-containing electrolyte and particles to be electroplated. The particles have a size of from 0.1 to 10 μm. At least a part of the surface of each particle is conductive. Such a stationary circulating flow of a suspension of the particles in the electrolyte is formed in the bath that the particles are maintained in the suspended condition; the suspension is circulated substantially without coming in contact with the anode; the particles may have a chance of colliding with substantially all surface areas of the working surface of the cathode, and are repeatedly brought in collision with the cathode at a velocity with a normal component of from 0.6 to 6.0 m/min.; and a particle concentration of the suspension at the time of collision is from 30 to 55% by volume. When such a stationary flow has been formed, a current for electroplating is caused to pass, whereupon deposition of metal on the particles proceeds without deposition of the particles and metal on the cathode.

Claims

1. A process for electroplating fine particles with metal by suspending electrically conductive fine particles in a metallic ion-containing electrolyte in an electroplating bath equipped with a cathode and anode, and passing a direct electric current between the cathode and anode thereby depositing metallic ions in the electrolyte on surfaces of the fine particles,

wherein said fine particles have a size of from 0.1 to 10 μ

m,

wherein a flow of a suspension of said fine particles in the electrolyte continuously flowing is forcibly formed in said bath while keeping said fine particles in the suspended condition in said electrolyte,

wherein said flow of said suspension is controlled so that its main direction of flow in the bath is such that while said suspension is circulated substantially without coming in collision with said anode, said fine particles in said suspension may have a chance of colliding with substantially all surface areas of said cathode that are exposed to said bath, and

wherein a flow rate and particle concentration of said suspension are controlled so that said fine particles may repeatedly come in collision with said cathode at a velocity with a normal component of ranging from 0.6 to 6.0 m/min., and a particle concentration of said suspension at the time of collision is from 30 to 55% by volume.

2. The process in accordance with claim 1 wherein said electrically conductive fine particles are particulate inorganic or organic fine substance having formed on said surface an electrically conductive film.

3. The process in accordance with claim 1 wherein said electrically conductive fine particles are particulate metal.