Process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces
First Claim
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1. A process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces comprising treating the same with an activator formulation containing a binder, without pickling, wherein the formulation comprises(a) 0.03-4.00% by weight of an organometallic noble-metal compound as an activator,(b) 3-40% by weight of a polyimide binder,(c) 1-30% by weight of a filler and(d) 45-90% by weight of a solvent.
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Abstract
To improve the adhesive strength of electrolessly deposited metal deposits on surfaces of polyimide moulded bodies, the latter are treated with an activator formulation which, in addition to solvents, fillers and organometallic activators, preferably contains 5-25% of a polyimide as binder.
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8 Claims
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1. A process for improving the adhesive strength of electrolessly deposited metal layers on polyimide surfaces comprising treating the same with an activator formulation containing a binder, without pickling, wherein the formulation comprises
(a) 0.03-4.00% by weight of an organometallic noble-metal compound as an activator, (b) 3-40% by weight of a polyimide binder, (c) 1-30% by weight of a filler and (d) 45-90% by weight of a solvent.
Specification