Processing apparatus and method

• US 4,911,103 A
• Filed: 11/22/1988
• Issued: 03/27/1990
• Est. Priority Date: 07/17/1987
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Davis, Cecil J., Matthews, Robert T., Jucha, Rhett B., Tomlin, Joel T., Freeman, Dean W.
• Primary Examiner(s): Bueker, Richard
• Application Number:
  US07/274,611
• Time in Patent Office: 490 Days
• Field of Search: 118/725, 118/729, 118/728, 118/715, 156/345
• US Class Current: 118/725
• CPC Class Codes: C23C 16/54 Apparatus specially adapted for continuous coating
• CPC Class Codes: C30B 31/103 Mechanisms for moving either the charge or heater
• CPC Class Codes: C30B 35/005 Transport systems
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence

Abstract

A process module which is compatible with a system using primarily vacuum wafer transport, but which permits processing multiple slices in parallel in a single module. This is accomplished by using notched quartz arms in the module, so that the transfer arm can place each of several wafers into one set of notches in the quartz arms. Optionally, a vertical degree of movement in the arm may be used to accomplish this, and the quartz arms may be immovable. This means that the port from the multi-wafer module into the wafer transfer system must be high enough to accommodate the necessary vertical movement of the transfer arm. After the transfer arm has placed the wafer on the quartz arms, the process module can be elevated to close around the set of wafers and made a seal. If the wafer transport arm is already configured to access wafers directly out of a multi-wafer vacuum wafer carrier, the necessary degree of freedom will necessarily already be present in the transfer arm, and at least one port of the necessary vertical dimensions will necessarily also be already present (between the loadlock and the transfer chamber). This is particularly useful in combination with relatively slow processes, such as thick field oxidation, long anneals, or long furnace heating steps used to drive in diffusions.

Claims

1. An apparatus for processing wafers, comprising:

(a) a vacuum processing chamber;

(b) at least two wafer support members within said process chamber, each of said wafer support members having a plurality of horizontal slots therein arranged at different levels to form slot pairs, each pair of said slots being capable of supporting a single wafer, so that a plurality of wafers, one over another, is supported with each wafer having its face to be processed facing downward, and with substantially no damage to structures on the face of said wafer; and

(c) a wafer transfer mechanism positioned to controllably transfer wafers through an openable port into selected pairs of said slots within said process chamber, said wafer transfer mechanism being capable of operation under high vacuum.

2. The apparatus of claim 1 wherein wafer transfer mechanism has sufficient controllable vertical movement to selectably place and/or remove wafers from selectable positions in said wafer support members.

3. The apparatus of claim 1 wherein said apparatus is capable of performing chemical vapor deposition.

4. The apparatus of claim 1 wherein said apparatus is capable of performing slow low pressure processes.

5. The apparatus of claim 4 wherein said apparatus is capable of performing gaseous oxide deposition.

7. The apparatus of claim 1 wherein the wafer transfer mechanism is capable of controllably transferring wafers one at a time.

6. An apparatus for processing of wafers, comprising:

(a) a vacuum processing chamber;

(b) at least two wafer support members within said process process chamber, each of said wafer support members having a plurality of horizontal slots therein arranged at different levels to form slot pairs, each pair of said slots being capable of supporting a single wafer, so that a plurality of wafers, one over another, is supported with each wafer having its face to be processed facing downward, and with substantially no damage to structures on the face of said wafer; and

(c) a wafer transfer mechanism positioned to controllably transfer through a port with an open and closed positions into selected pairs of said slots within said process chamber, said wafer transfer mechanism being capable of operation at low pressure.

8. The apparatus of claim 6 wherein the wafer transfer mechanism is capable of controllably transferring wafers one at a time.

9. An apparatus for processing of wafers, comprising:

(a) a processing chamber; and

(b) at least two wafer support members within said process process chamber, each of said wafer support members having a plurality of horizontal slots therein arranged at different levels to form slot pairs, each pair of said slots being capable of supporting a single wafer, so that a plurality of wafers, one over another, is supported with each wafer having its face to be processed facing downward, and with substantially no damage to structures on the face of said wafer.

10. The apparatus of claim 9 wherein said apparatus is capable of performing chemical vapor deposition.

11. The apparatus of claim 9 wherein said apparatus is capable of performing slow low pressure processes.

12. The apparatus of claim 11 wherein said apparatus is capable of performing gaseous oxide deposition.