Integrated circuit packaging and cooling
First Claim
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1. An integrated circuit assembly comprising:
- A housing defining at least one chamber therein;
Means within said housing to support a base member within the central region of said chamber;
One or more integrated circuit chips carried on said base member and in heat conducting contact therewith;
Orifices positioned within said housing in regions adjacent to said one or more integrated circuit chips;
Means to deliver a cooling fluid through said orifices under pressure so that it is directed as a jet of fluid against said base member in the region of said one or more integrated circuit chips;
Means to return said cooling fluid to a cooling system to extract heat carried by said fluid from said chamber;
Said cooling fluid being directed against said one or more integrated circuit chips resulting in the boiling of at least some of said fluid;
Said orifices being positioned in pairs on opposite sides of said base member;
Said support means are non-rigid; and
Said base member is substantially flat and extends beyond said chamber to enable electrical connections to be made to the ends thereof.
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Abstract
A packaging and cooling structure for integrated circuit chips in electronic equipment is provided in which the chips are resiliently mounted on wafers which are centrally located in chambers within a housing. A liquid coolant is forced through orifices to spray the coolant on the wafers behind the chips and on the chips themselves providing both high velocity convective cooling and phase change boiling heat transfer. A temperature sensor and control are provided to sense and control the temperature within the electronic equipment.
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Citations
16 Claims
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1. An integrated circuit assembly comprising:
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A housing defining at least one chamber therein; Means within said housing to support a base member within the central region of said chamber; One or more integrated circuit chips carried on said base member and in heat conducting contact therewith; Orifices positioned within said housing in regions adjacent to said one or more integrated circuit chips; Means to deliver a cooling fluid through said orifices under pressure so that it is directed as a jet of fluid against said base member in the region of said one or more integrated circuit chips; Means to return said cooling fluid to a cooling system to extract heat carried by said fluid from said chamber; Said cooling fluid being directed against said one or more integrated circuit chips resulting in the boiling of at least some of said fluid; Said orifices being positioned in pairs on opposite sides of said base member; Said support means are non-rigid; and Said base member is substantially flat and extends beyond said chamber to enable electrical connections to be made to the ends thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification