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Integrated circuit packaging and cooling

  • US 4,912,600 A
  • Filed: 09/07/1988
  • Issued: 03/27/1990
  • Est. Priority Date: 09/07/1988
  • Status: Expired due to Term
First Claim
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1. An integrated circuit assembly comprising:

  • A housing defining at least one chamber therein;

    Means within said housing to support a base member within the central region of said chamber;

    One or more integrated circuit chips carried on said base member and in heat conducting contact therewith;

    Orifices positioned within said housing in regions adjacent to said one or more integrated circuit chips;

    Means to deliver a cooling fluid through said orifices under pressure so that it is directed as a jet of fluid against said base member in the region of said one or more integrated circuit chips;

    Means to return said cooling fluid to a cooling system to extract heat carried by said fluid from said chamber;

    Said cooling fluid being directed against said one or more integrated circuit chips resulting in the boiling of at least some of said fluid;

    Said orifices being positioned in pairs on opposite sides of said base member;

    Said support means are non-rigid; and

    Said base member is substantially flat and extends beyond said chamber to enable electrical connections to be made to the ends thereof.

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