Integrated circuit packaging and cooling

• US 4,912,600 A
• Filed: 09/07/1988
• Issued: 03/27/1990
• Est. Priority Date: 09/07/1988
• Status: Expired due to Term

• Current Assignee: Auburn University of The State of Alabama
• Original Assignee: Auburn University of The State of Alabama
• Inventors: Goodling, John S., Williamson, Norman V., Jaeger, Richard C.
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US07/241,184
• Time in Patent Office: 566 Days
• Field of Search: 165/804, 165/86.5, 165/104.33, 165/104.34, 174/15.1, 174/15.2, 174/16.1, 174/16.3, 357/79, 357/82, 361/381, 361/382, 361/385-389
• US Class Current: 361/700
• CPC Class Codes: H01L 23/4735 Jet impingement H01L23/4336 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20345 Sprayers; Atomizers
• CPC Class Codes: Y10S 165/908 Fluid jets

Abstract

A packaging and cooling structure for integrated circuit chips in electronic equipment is provided in which the chips are resiliently mounted on wafers which are centrally located in chambers within a housing. A liquid coolant is forced through orifices to spray the coolant on the wafers behind the chips and on the chips themselves providing both high velocity convective cooling and phase change boiling heat transfer. A temperature sensor and control are provided to sense and control the temperature within the electronic equipment.

Claims

1. An integrated circuit assembly comprising:

A housing defining at least one chamber therein;

Means within said housing to support a base member within the central region of said chamber;

One or more integrated circuit chips carried on said base member and in heat conducting contact therewith;

Orifices positioned within said housing in regions adjacent to said one or more integrated circuit chips;

Means to deliver a cooling fluid through said orifices under pressure so that it is directed as a jet of fluid against said base member in the region of said one or more integrated circuit chips;

Means to return said cooling fluid to a cooling system to extract heat carried by said fluid from said chamber;

Said cooling fluid being directed against said one or more integrated circuit chips resulting in the boiling of at least some of said fluid;

Said orifices being positioned in pairs on opposite sides of said base member;

Said support means are non-rigid; and

Said base member is substantially flat and extends beyond said chamber to enable electrical connections to be made to the ends thereof.

2. The integrated circuit assembly of claim 1 wherein said housing defines multiple chambers and said means to deliver a cooling fluid and means to return said cooling fluid from said multiple chambers includes manifolds attached to said housing.

3. The integrated circuit assembly of claim 1 wherein the means to deliver a cooling fluid is a manifold connected to multiple chambers in the housing and to multiple chambers in an adjacent housing.

4. The integrated circuit assembly of claim 1 wherein said base member is silicon.

5. An integrated circuit assembly of claim 4 wherein portions of the base member are etched anistropically to increase the surface area thereof.

6. An integrated circuit assembly of claim 5 wherein said etching forms pyramids in cavities of said silicon base member.

7. An integrated circuit assembly of claim 5 wherein at least one temperature sensor is positioned within said chamber to monitor the temperature.

8. An integrated circuit assembly of claim 7 wherein said temperature sensor provides a signal to control the cooling fluid.

9. An integrated circuit assembly of claim 7 wherein said temperature sensor is mounted on said base member.

10. An integrated circuit assembly of claim 8 wherein said temperature sensor is connected to a switch to disconnect the power to said one or more integrated circuit chips in the event the temperature sensed by said temperature sensor exceeds a predetermined value.

11. An integrated circuit assembly of claim 4 wherein at least one temperature sensor is mounted on said base member to provide a signal to control the cooling fluid in accordance with said temperature sensor and to activate a switch to disconnect the power to said one or more integrated circuit chips in the event the temperature sensed by said temperature sensor exceeds a predetermined amount.

12. The integrated circuit assembly of claim 11 wherein said at least one temperature sensor is deposited on said base member.

13. The integrated circuit assembly of claim 12 wherein said base member is silicon.

14. The integrated circuit assembly of claim 13 wherein said at least one temperature sensor is a thin film of metal.

15. The integrated circuit assembly of claim 1 wherein said base member divides said chamber into two substantially equal smaller chambers, and a breather passage through said base member equalizes the pressure in said substantially equal smaller chambers.

16. The integrated circuit assembly of claim 1 wherein said support means includes at least two separable support members cooperating with an O-ring to provide said non-rigid support means to said base member within said housing, and fastening means to secure said support members into engagement with said O-ring, thereby facilitating the assembly and disassembly of said integrated circuit assembly.