Method and apparatus for die bonding
First Claim
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1. A method of die bonding comprising:
- orienting a semiconductor wafer in a first plane, the wafer including a multiplicity of mutually separated chips, near a lead frame which is conveyed in a second plane orthogonal to said first plane;
determining whether each of the semiconductor chips is defective or non-defective at a first position of said wafer;
moving the wafer to a second position in the first plane along a direction lying in the second plane; and
picking up each of the non-defective semiconductor chips from the wafer and bonding each of the non-defective chips onto a respective lead frame.
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Abstract
Disclosed is a method for die bonding, comprising the steps of arranging a wafer having a multiplicity of mutually separated semiconductor chips vertically and near a lead frame which is conveyed horizontally, and picking up each of the semiconductor chips from the wafer and bonding the same onto the lead frame.
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Citations
15 Claims
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1. A method of die bonding comprising:
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orienting a semiconductor wafer in a first plane, the wafer including a multiplicity of mutually separated chips, near a lead frame which is conveyed in a second plane orthogonal to said first plane; determining whether each of the semiconductor chips is defective or non-defective at a first position of said wafer; moving the wafer to a second position in the first plane along a direction lying in the second plane; and picking up each of the non-defective semiconductor chips from the wafer and bonding each of the non-defective chips onto a respective lead frame. - View Dependent Claims (2)
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3. A die bonding apparatus comprising:
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conveying means for conveying lead frames in a second plane; holding means for holding a semiconductor wafer in a first plane orthogonal to the second plane near the lead frames, the wafer including a multiplicity of mutually separated chips; moving means for moving said holding means between first and second positions along a direction lying in the second plane; a sensor for optically detecting the semiconductor chips when said holding means is in the first position and for generating a sensor signal in response to the detection of each chip; pattern recognition means for determining, in response to the sensor signal, whether each of the chips is non-defective or defective; and semiconductor chip moving means for picking up each of the non-defective semiconductor chips from the wafer held by said holding means in the second position and for bonding each of the non-defective chips onto a respective lead frame. - View Dependent Claims (4, 5, 6, 7, 8)
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9. A die bonding apparatus comprising:
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conveying means for conveying lead frames in a second plane; first and second holding devices disposed serially along a direction lying in the second plane near the lead frames, said first and second holding devices for holding a semiconductor wafer in a first plane orthogonal to the second plane, the wafer including a multiplicity of mutually separated chips; a sensor for optically detecting the semiconductor chips when the wafer is held by said first holding device and for generating a sensor signal in response to the detection of each chip; pattern recognition means for determining, in response to the sensor signal, whether each of the chips is non-defective or defective; and semiconductor chip moving means, in the vicinity of said second holding device, for picking up each of the non-defective semiconductor chips from the wafer held by said second holding device and for bonding each of the non-defective chips onto a respective lead frame. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification