Nickel-based solder for high-temperature soldered joints

• US 4,913,752 A
• Filed: 09/22/1988
• Issued: 04/03/1990
• Est. Priority Date: 09/29/1987
• Status: Expired due to Fees

• Current Assignee: Vacuumschmelze GmbH Hanau
• Original Assignee: Vacuumschmelze GmbH & Company KG (Vectra Corp.)
• Inventors: Falk, Joachim
• Primary Examiner(s): DEAN, RICHARD
• Application Number:
  US07/247,661
• Time in Patent Office: 558 Days
• Field of Search: 148/426, 148/427, 148/424, 148/423, 148/442, 148/336
• US Class Current: 148/336
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent

Abstract

A nickel-based solder for high-temperatured soldered joints contains up to 15 percent by weight silicon with necessary additives of titanium, zirconium, niobium, arsenic, phosphorus, copper, zinc, indium, germanium, scandium or carbon, and is manufactured in the form or a band or ribbon by rapid quenching from a melt. The resulting rapidly quenched solder ribbon is ductile, and has a crystalline structure.

Claims

1. A rapidly quenched, ductile, crystalline solder ribbon for high-temperature soldering of steels and nickel-based alloy consisting essentially of 2 through 15 percent by weight silicon, 0.1 through 10 percent by weight of at least one of the elements selected from the group consisting of titanium, zirconium, niobium, arsenic, phosphorus, copper, zinc, indium, germanium, scandium and carbon, and the remainder nickel.

2. A solder ribbon as claimed in claim 1 having 6 through 12 percent by weight silicon.

3. A solder ribbon as claimed in claim 1 having 9 through 11.5 percent by weight silicon, 0.5 through 2 percent by weight titanium, and the remainder nickel.

4. A solder ribbon as claimed in claim 1 further having 2 through 80 percent by weight manganese.

5. A solder ribbon as claimed in claim 4 having 7 through 9 percent by weight silicon, 5 through 15 percent by weight manganese, 4 through 6 percent by weight copper, and the remainder nickel.

6. A solder ribbon as claimed in claim 1 having 2 through 40 percent by weight chromium.

7. A solder ribbon as claimed in claim 1 having a thickness between 10 μ

m and 60 μ

m.

8. A rapidly quenched, ductile crystalline solder ribbon for high-temperature soldering of steels and nickel-based alloys, said solder ribbon consisting essentially of 2 through 8.3 percent by weight silicon, 4 through 50 percent chromium, and the remainder nickel.

9. A solder ribbon as claimed in claim 8, having 6 through 8.3 percent by weight silicon, 12 through 20 percent by weight chromium, and the remainder nickel.

10. A solder ribbon as claimed in claim 8 having a thickness of 10 μ

m through 60 μ

m.

11. A rapidly quenched ductile crystalline solder ribbon for high-temperature soldering of steels and nickel-based alloys, said solder ribbon consisting essentially of 5 through 60 percent by weight iron and the remainder nickel.

12. A solder ribbon as claimed in claim 11 having up to 15 percent by weight silicon.

13. A solder ribbon as claimed in claim 12 having 6 through 12 percent by weight silicon.

14. A solder ribbon as claimed in claim 13 having 30 through 40 percent by weight iron, 8 through 11 percent by weight silicon, and the remainder nickel.

15. A solder ribbon as claimed in claim 11 having at least one element selected from the group consisting of titanium, zirconium, niobium, arsenic, phosphorus, chromium, manganese, copper, zinc, indium, germanium, scandium and carbon in a total content of 0.1 through 10 percent by weight.

16. A solder ribbon as claimed in claim 11 having a thickness of 10 μ

m through 60 μ

m.