Method for producing a multilayer system

• US 4,915,759 A
• Filed: 01/29/1987
• Issued: 04/10/1990
• Est. Priority Date: 01/30/1986
• Status: Expired due to Fees

• Current Assignee: Peter L. Moran
• Original Assignee: Peter L. Moran
• Inventors: Moran, Peter L.
• Primary Examiner(s): Weston, Caleb
• Application Number:
  US07/008,498
• Time in Patent Office: 1,167 Days
• Field of Search: 156/89, 427/96, 427/98, 427/99, 427/117, 427/118, 427/124, 427/125, 427/126.2
• US Class Current: 156/89.15
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/38 Improvement of the adhesion between the insulating substrate and the metal
• CPC Class Codes: H05K 3/4667 characterized by using an inorganic intermediate insulating layer
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/239 Complete cover or casing
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A method of producing a multilayer system comprising the steps of:

1. adhering a continuous cohesive pattern of electrically conductive oxidisable material (e.g. copper) to an electrically insulating surface of a substrate,

2. coating the pattern and the parts of the substrate surface not adhering to the pattern with a firable dielectric which is fusable at 500°-600° C.,

3. firing the dielectric to 500°-600° C. to cause fusion of the dielectric, whereby an oxide-fused dielectric bond is formed. Also multilayers having the features of the products of this method.

Claims

1. A method of producing a multilayer system characterised by:

a. coating an electrically insulating substrate with a seed layer of an electrically conductive oxidisable material which on oxidation is non-conductive and glass-forming,

b. depositing a pattern of solid conductor on the seed layer,

c. oxidising the parts of the seed layer not in contact with the pattern to their full depth, and

d. coating the whole with a firable dielectric which is fusable at 500°

to 600°

C., and then

e. firing the system to 500°

to 600°

C. to fuse the dielectric.

2. A method as in claim 1, wherein step (d) immediately precedes step (c).

3. A method of producing a multilayer system comprising the steps of:

a. forming a seed layer of an electrically conductive material on an electrically insulating surface of a substrate by electroless deposition, forming a resist layer corresponding to a negative of a desired pattern of copper onto the seed layer, electroplating said pattern of copper onto the exposed seed layer, removing the resist, and removing the seed layer selectively from areas not covered by the pattern; and

subsequently

b. oxidising part of the pattern; and

c. screen printing an air firing dielectric comprising particles of dielectric held together with a binder onto the pattern and any seed layer not covered by the pattern; and

d. subsequently firing the dielectric to a temperature sufficient to cause fusion of the dielectric, whereby a bond is formed between the fused dielectric and the oxidised part of the pattern, characterised in that the pattern is solid and bonded to the substrate in step (a), the dielectric is fusable at 500°

to 600°

C., the dielectric is fired, in air, to 500°

to 600°

C., and only an outer layer of the pattern is oxidised, such that the conductive properties of the pattern are not appreciably effected.

4. A method as in claim 3, wherein step (c) immediately precedes step (b).

5. A method of producing a multilayer system comprising the steps of:

a. forming a pattern of electrically conductive oxidisable material to an electrically insulating surface of a substrate;

b. oxidising part of the pattern; and

c. burying the pattern in a firable dielectric; and

then

d. firing the dielectric to intimately bond the fired dielectric to the oxidised part of the pattern, characterised in that the pattern is solid, the dielectric is fusable at 500°

to 600°

C., the dielectric is fired to 500°

to 600°

C., and only an outer layer of the pattern is oxidised such that the conductive properties of the pattern are not appreciably effected.

6. A method as in claim 5, wherein step (c) immediately precedes step (b).

7. A method as in claim 5, wherein the pattern is formed by sputtering or evaporation through a mask.

8. A method as in claim 5, wherein the pattern is formed by plating, sputtering or evaporation and the conductive material is subsequently selectively removed.

9. A method as in claim 5, wherein the pattern is formed by resist-guided electroless plating.

10. A method as in claim 5, wherein the pattern is formed by directly chemically bonding a sheet of conductive material to a substrate at high temperature with subsequent selective removal of the material.