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Apparatus for treating wafers with process fluids

DC
  • US 4,917,123 A
  • Filed: 10/03/1988
  • Issued: 04/17/1990
  • Est. Priority Date: 05/21/1984
  • Status: Expired due to Term
First Claim
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1. Apparatus for wet processing of semiconductor wafers comprising:

  • (a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers, said vessel being hydraulically full with process fluid when said process fluids flow past said wafers;

    (b) means for supplying at least one cleaning fluid to said process stream for removing contaminants from said wafers, and means for withdrawing said cleaning fluid from said process stream;

    (c) means for supplying a rinsing fluid to said process stream for removing other fluids from said wafers, means for minimizing gas/liquid interfaces in said rinsing fluid and means for withdrawing said rinsing fluid from said process stream; and

    (d) means for supplying a drying fluid to said process stream for removing other fluids from said wafers and means for withdrawing said drying fluid from said process stream.

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