Apparatus for treating wafers with process fluids

• US 4,917,123 A
• Filed: 10/03/1988
• Issued: 04/17/1990
• Est. Priority Date: 05/21/1984
• Status: Expired due to Term

• Current Assignee: CFMT Inc.
• Original Assignee: CFM Technoligies Limited Partnership
• Inventors: McConnell, Christopher F., Walter, Alan E.
• Primary Examiner(s): Stinson, Frankie L.
• Application Number:
  US07/252,823
• Time in Patent Office: 561 Days
• Field of Search: 134/95, 134/96, 134/98, 134/100, 134/101, 134/103, 252/106
• US Class Current: 134/95.2
• CPC Class Codes: B05C 3/109 Passing liquids or other fluent materials into or through chambers containing stationary articles
• CPC Class Codes: B08B 2203/002 the liquid being a degassed liquid
• CPC Class Codes: B08B 3/04 Cleaning involving contact with liquid
• CPC Class Codes: B08B 7/0092 by cooling
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

Contamination of wafers is reduced by an enclosed full-flow method and apparatus for the cleaning and other wet processing of semiconductor wafers. Process fluids flow sequentially and continuously past the wafers such that the processing does not require movement or operator handling of the wafers between processing steps. The vessel containing the wafers is hydraulically full during each process step. Wafers may be cleaned using a hot corrosive fluid, such as sulfuric acid; rinsed using high purity water at high flow rates; and dried using a drying fluid such as isopropanol. In addition, chemical reagents such as dilute hydrofluoric acid or hydrogen peroxide may be precisely mixed in situ and applied to the wafer surface for a precisely controlled period, by injecting concentrated reagent into rinse water purified by multipass filtration.

Claims

1. Apparatus for wet processing of semiconductor wafers comprising:

(a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers, said vessel being hydraulically full with process fluid when said process fluids flow past said wafers;

(b) means for supplying at least one cleaning fluid to said process stream for removing contaminants from said wafers, and means for withdrawing said cleaning fluid from said process stream;

(c) means for supplying a rinsing fluid to said process stream for removing other fluids from said wafers, means for minimizing gas/liquid interfaces in said rinsing fluid and means for withdrawing said rinsing fluid from said process stream; and

(d) means for supplying a drying fluid to said process stream for removing other fluids from said wafers and means for withdrawing said drying fluid from said process stream.

2. The apparatus of claim 1 additionally comprising means for recirculating said process fluids.

3. Apparatus according to claim 2 including backwash means for rejuvenating said filter means with process fluid.

4. Apparatus according to claim 1 additionally comprising means for supplying at least one chemical reagent to said process stream for reacting with portions of said wafers and means for withdrawing said reagent from said process stream.

5. Apparatus according to claim 4 wherein said means for supply and withdrawal of chemical reagent to said process stream comprises reagent supply means, and means for delivering metered amounts of reagent to said process stream.

6. Apparatus according to claim 5 including means for supplying rinsing fluid and reagent simultaneously to said process stream and static mixing means for mixing said chemical reagent and rinsing fluid prior to passing said components in said vessel means.

7. Apparatus according to claim 1 wherein said cleaning fluid supply and withdrawal means comprise first and second fluids reservoir means, differential pressure pumping means, and means for circulating said cleaning fluid from a first fluid reservoir means into said process stream and through said vessel means, and into a second fluid reservoir means, and means for circulating said cleaning fluid from said second fluid reservoir means into said process stream and through said vessel means, and into said first fluid reservoir.

8. Apparatus according to claim 7 wherein said cleaning fluid supply means also include an ozonator for oxidizing organic contaminants and reduced acid.

9. Apparatus according to claim 7 additionally comprising means for agitating cleaning fluid within at least one of said fluid resevoirs.

10. Apparatus according to claim 1 further including particle filter means which effectively removes particles from said cleaning fluid, said filter means being located between said cleaning fluid supply means and said vessel means.

11. Apparatus according to claim 10 including means for continuously recycling said process fluid through said particle filter means.

12. Apparatus according to claim 1 wherein said cleaning fluid supply and withdrawal means comprise a high temperature, concentrated acid circulation and filtration means including a source of gas under pressure to drive said acid from a first reservoir through said filtration means and vessel means and into a second acid reservoir, and back from said second reservoir through said filtration means and vessel means into said first acid reservoir.

13. Apparatus according to claim 1 wherein said vessel means comprises at least one carrier for supporting at least one semiconductor wafer, said wafers being arranged with their major surfaces parallel to said process stream.

14. Apparatus according to claim 1 wherein said means for supplying and withdrawing drying fluid comprise means for generating alcohol fluid vapor and means for drawing said drying fluid vapor into said process stream.

15. Apparatus according to claim 11 wherein said drying fluid withdrawal means comprise means for evaporating drying fluid from said wafers after said drying fluid has substantially replaced said rinsing fluid.

16. Apparatus according to claim 15 wherein said evaporation means comprise a source of gas for injection into said process stream.

17. Apparatus according to claim 15 additionally comprising means for condensing said evaporated drying fluid and means for collecting the condensate of said evaporated drying fluid and residual rinsing fluid as an effluent from the vessel.

18. Apparatus according to claim 1 wherein said means for supplying a drying fluid to said process stream directly displaces said other fluids from said wafers.

19. Apparatus for wet processing of semiconductor wafers comprising:

(a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers, said vessel means being hydraulically full with process fluid when said process fluids flow past said wafers and

(b) means for supplying at least one cleaning fluid to said process stream for removing contaminants from said wafers, whereby said at least one cleaning fluid flows past said wafers without moving or handling said wafers.

20. Apparatus for wet processing of semiconductor wafers comprising:

(a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers and

(b) means for supplying at least one chemical reagent to said process stream for reacting with portions of said wafers, said process stream being positioned within said vessel means such that said vessel means is hydraulically full with process fluid.

21. Apparatus according to claim 20 additionally comprising means for supplying a rinsing fluid to said process stream for removing said chemical reagent.

22. Apparatus for wet processing of semiconductor wafers comprising:

(a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers and

(b) means for supplying at least one rinsing fluid to said process stream for removing other fluids from said wafers, means for minimizing gas/liquid interfaces in said rinsing fluid, said process stream being positioned within said vessel means such that said vessel means is hydraulically full with process fluid, whereby said at least one rinsing fluid flows past said wafers without moving or handling said wafers.

23. Apparatus for wet processing of semiconductor wafers comprising:

(a) vessel means for supporting said wafers in a closed circulation process stream wherein process fluids may sequentially flow past said wafers;

(b) means for supplying at least one rinsing fluid to said process stream, means for minimizing gas/liquid interfaces in said rinsing fluid; and

(c) means for supplying a drying fluid to said process stream for removing said rinsing fluid, said process stream being positioned within said vessel means such that said vessel means is hydraulically full with process fluid, whereby said fluids flow past said wafers without moving or handling said wafers.

24. Apparatus according to claim 23 wherein said means for supplying a drying fluid to said process stream directly displaces said rinsing fluid.