Modular wafer transport and processing system

• US 4,917,556 A
• Filed: 05/26/1989
• Issued: 04/17/1990
• Est. Priority Date: 04/28/1986
• Status: Expired due to Term

• Current Assignee: Varian Semiconductor Equipment Associates Incorporated (Applied Materials Incorporated)
• Original Assignee: Varian Associates, Inc.
• Inventors: Turner, Frederick, Stark, Lawrence R.
• Primary Examiner(s): Bucci, David A.
• Application Number:
  US07/358,461
• Time in Patent Office: 326 Days
• Field of Search: 414/217, 414/221, 414/222, 414/225, 414/226, 414/733, 414/751, 414/757, 901/15, 901/21, 198/345, 198/394, 198/468.2
• US Class Current: 414/217
• CPC Class Codes: B65G 47/915 provided with drive systems with rotary movements only
• CPC Class Codes: C23C 14/568 Transferring the substrates through a series of coating stations C23C14/562 takes precedence
• CPC Class Codes: H01L 21/67766 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: Y10S 414/136 including wafer orienting means
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/138 Wafers positioned vertically within cassette
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

A modular wafer processing machine is provided which is based on interconnected handling units having wafer handling arms. Each unit can pass a wafer to another unit in the same vacuum environment to a processing module.

Claims

1. A wafer transport and processing system comprising:

a transport vacuum chamber having a first plurality of ports and a second plurality of ports, each of said ports of said first and said second pluralities communicating the interior of said chamber to the exterior of said chamber;

valve means for opening and closing each of said ports of said first and said second pluralities;

a wafer processing chamber connected to one of said ports on an exterior side of said valve means for said one port, and a wafer processing chamber connected to another of said ports of said first and said second pluralities on an exterior side of said valve means for said another port; and

transfer means in said transport vacuum chamber comprising;

first transport means in said transport vacuum chamber for transferring a wafer from any first selected one of said ports of said first plurality into said transport vacuum chamber and thence to any selected port in said first plurality of ports; and

second transport means in said transport vacuum chamber for transferring a wafer from any first selected one of said ports of said second plurality into said transport vacuum chamber and thence to any second selected port in said second plurality of ports, said first transport means not being capable of transferring a wafer into said transport vacuum chamber from at least two ports in said second plurality, said second transport means not being capable of transferring a wafer into said transport vacuum chamber from at least two ports in said first plurality;

said transport vacuum chamber not being sectionalizable so as to comprise a vacuum chamber intermediate said first transport means and said second transport means with said first and said second transport means being exterior to said intermediate vacuum chamber, said transfer means being capable of transferring a wafer from said first transport means to said second transport means so that a wafer is transferable from any first selected port in said first plurality of ports to any second selected port in said second plurality of ports.

2. A wafer transport and processing system as in claim 1 wherein said transfer means includes means for positioning a wafer in a desired rotational orientation.

3. A wafer transport and processing system as in claim 1 wherein said first transport means is extendable from the interior of said transport vacuum chamber through any selected one of said ports in said first plurality to the exterior of said transport vacuum chamber.

4. A wafer transport and processing system as in claim 1 wherein said first transport means is located in a first portion of said transport vacuum chamber and said second transport means is located in the second portion of said transport vacuum chamber, said first and said second portions of said transport vacuum chamber being dimensioned relative to said first and said second transport means respectively so that the total volume of said first and second portions of said transport vacuum chamber is minimized.

5. A wafer transport and processing system as in claim 2 wherein said means for positioning is positioned between said first and said second transport means.

6. A wafer transport and processing system as in claim 1 wherein two ports of said first plurality of ports are positioned 90°

apart.

7. A wafer transport and processing system as in claim 1 wherein said first plurality includes at least three ports.

8. A wafer transport system as in claim 1 wherein said transfer means includes means for transferring a wafer from said second transport means to said first transport means so that a wafer is transferable from any first selected port in said second plurality of ports to any selected port in said first plurality of ports.

9. A wafer transport and processing system comprising:

a transport vacuum chamber having a first plurality of ports and a second plurality of ports, each of said ports of said first and second pluralities communicating the interior of said chamber to the exterior of said chamber;

valve means for opening and closing each of said ports of said first and said second pluralities;

a first wafer processing chamber connected to a first port in said first plurality of ports on an exterior side of said valve means for said first port of said first plurality of ports and to a first port in said second plurality of ports on an exterior side of said valve means for said first port of said second plurality of ports;

a second wafer processing chamber connected to a second port of either of said ports of said first and said second pluralities on an exterior side of said valve means for said second port of either of said first and second pluralities; and

transfer means comprising;

first transport means in said transport vacuum chamber for transferring a wafer from any first selected one of said ports of said first plurality into said transport vacuum chamber and thence to any selected port in said first plurality of ports; and

second transport means in said transport vacuum chamber for transferring a wafer from any first selected one of said ports of said second plurality into said transport vacuum chamber and thence to any selected port in said second plurality of ports, said first transport means not being capable of transferring a wafer into said transport chamber from at least two ports in said second plurality, said second transport means not being capable of transferring a wafer into said transport vacuum chamber from at least two ports in said first plurality,

said transfer means being capable of transferring a wafer from said first transport means to said second transport means via a first path contained in said transport vacuum chamber and via a second path passing through said first port of said first plurality of ports, said first wafer processing chamber and said first port of said second plurality of ports.