Solid state imaging apparatus

• US 4,918,521 A
• Filed: 01/14/1988
• Issued: 04/17/1990
• Est. Priority Date: 01/20/1987
• Status: Expired due to Term

• Current Assignee: Olympus Optical Corporation Limited (Olympus Corporation)
• Original Assignee: Olympus Optical Corporation Limited (Olympus Corporation)
• Inventors: Sato, Tomoaki, Uchikubo, Akinobu, Takara, Toshiyuki, Yabe, Hisao, Nakazawa, Masaaki, Ishikawa, Akibumi, Ogiu, Hisao, Miyazaki, Atsushi, Nakamura, Takeaki, Takamura, Koji
• Primary Examiner(s): Peng, John K.
• Application Number:
  US07/143,995
• Time in Patent Office: 824 Days
• Field of Search: 358/98, 358/93, 358/213.11, 358/229, 128/4, 128/6, 128/776
• US Class Current: 348/76
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/00177 for 90 degrees side-viewing
• CPC Class Codes: A61B 1/00179 for off-axis viewing
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

This solid state imaging apparatus is provided within the tip part of an insertable part of an endoscope and is provided with an image forming optical system for forming images. This image forming optical system forms an optical image on the imaging surface of a solid state imaging chip provided in the rear of this image forming optical system. This solid state imaging chip is affixed to a circuit substrate extending substantially at right angles with the imaging surface and electrically connected with the solid state imaging chip. This circuit substrate is connected with a signal cable transmitting input and output signals of the solid state imaging chip.

Claims

1. A solid state imaging apparatus comprising:

an image forming optical system fitted within a lens frame;

a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system;

a circuit substrate to which said solid state imaging chip is directly mechanically affixed substantially at right angles, and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and

a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.

2. A solid state imaging apparatus according to claim 1 wherein said sealing member seals the peripheries of said lens frame, solid state imaging chip and circuit substrate and the tip of said signal cable and is formed to be columnar.

3. A solid state imaging apparatus comprising:

an image forming optical system fitted within a lens frame;

a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system;

a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and

a sealing member sealing at least a part of the periphery of said solid state imaging chip;

said solid state imaging chip being die-bonded to a die-bonding pad member made of a metal.

4. A solid state imaging apparatus comprising:

an image forming optical system fitted within a lens frame;

a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system;

a circuit substrate to which said solid state imaging chip is directly mechanically affixed substantially at right angle, and to which said solid state imaging chip and a signal cable at the tip are electrically connected;

a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip; and

an electronic part as a peripheral circuit arranged on said circuit substrate.

5. A solid state imaging apparatus according to claim 4 wherein said solid state imaging chip is connected with said circuit substrate by a bonding wire.

6. A solid state imaging apparatus according to claim 4 wherein said sealing member seals the peripheries of said lens frame, image forming optical system, solid state imaging chip, electronic part and circuit substrate and the tip part of said signal cable and is formed to be columnar.

7. A solid state imaging apparatus according to claim 4 wherein said electronic part is at least one of an amplifying circuit, solid state imaging chip driving circuit, matching circuit and cooling element.

8. A solid state imaging apparatus comprising:

an image forming optical system fitted within a lens frame;

a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system;

a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and

a sealing member sealing at least a part of the periphery of said solid state imaging chip;

said solid state imaging chip being die-bonded to a die-bonding pad member made of a metal.

9. A solid state imaging apparatus comprising:

an image forming optical system fitted within a lens frame;

a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system;

a circuit substrate to which said solid state imaging chip is directly mechanically affixed and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and

a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.

10. An endoscope insertable part comprising:

an image forming optical system fitted within a lens frame;

a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system;

a circuit substrate to which said solid state imaging chip is directly mechanically affixed, and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and

a sealing member in sealing contact with at least a part of the periphery of said solid state imaging chip.

11. A solid state imaging apparatus comprising:

an image forming optical system fitted within a lens frame;

a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system;

a circuit substrate to which said solid state imaging chip is mechanically fitted substantially at right angles and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and

a sealing member sealing at least a part of the periphery of said solid state imaging chip;

said sealing member being a filling member filling said solid state imaging chip and forming the outside diameter of the endoscope insertable part.

12. A solid state imaging apparatus comprising:

an image forming optical system fitted within a lens frame;

a solid state imaging chip arranged to have its imaging surface positioned in the focal plane of said image forming optical system;

a circuit substrate to which said solid state imaging chip is mechanically fitted and to which said solid state imaging chip and a signal cable at the tip are electrically connected; and

a sealing member sealing at least a part of the periphery of said solid state imaging chip;

said sealing member being a filling member filling said solid state imaging chip and forming the outside diameter of the endoscope insertable part;

said solid state imaging chip being die-bonded on at least a part of the surface to a conductive die-bonding pad member.