Belt plating method and apparatus

• US 4,921,583 A
• Filed: 01/27/1989
• Issued: 05/01/1990
• Est. Priority Date: 02/11/1988
• Status: Expired due to Term

• Current Assignee: Twickenham Plating & Enamelling Company Limited
• Original Assignee: Twickenham Plating & Enamelling Company Limited
• Inventors: Hill, David J., Martin, Edgar C., Sewell, Beverley
• Primary Examiner(s): Valentine, Donald R.
• Application Number:
  US07/303,616
• Time in Patent Office: 459 Days
• Field of Search: 204/15, 204/224 R, 204/206, 204/279, 204/194
• US Class Current: 205/129
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/026 using locally applied jets of electrolyte

Abstract

A thin plastic elongate mask is disclosed for use in continuously electroplating an elongate substrate. Apparatus is disclosed wherein the mask is mated with the substrate, is passed through an electroplating zone, supported by support belts, such that only those areas of elongate substrate covered by plating cavities in the mask are plated. The mask may be located on the substrate by means of corresponding location features positioned on the elongate substrate and the mask. A method of continuously electroplating an elongate substrate using a thin plastic elongate mask is further disclosed.

Claims

1. A thin plastic elongate mask for use in continuously electroplating an elongate substrate comprising location features including dimples, moulded inserts of plastic, stamped-in metal studs, pins or rivets, or apertures all adapted to engage with corresponding features on an elongate substrate to be plated, said location features further including pin holes spaced at regular intervals, such that each adjacent pin hole is engageable with an adjacent spoke of a pin wheel.

2. A mask according to claim 1 wherein the thickness of the mask is no greater than 1 mm.

3. A mask according to claim 1 wherein the thickness of the mask is no less 0.0125 mm.

4. A mask according to claim 1, wherein the thickness of the mask is between 0.125 mm and 0.5 mm.

5. A mask according to claim 4 wherein the mask is 0.127 mm thick.

6. A mask according to claim 1 comprising a plastics material.

7. A mask according to claim 6 wherein the plastic material is polyester, polycarbonate, polyacetate, Kaptan, polyimide or epoxide.

8. An apparatus for continuously electroplating an elongate substrate, the apparatus comprising an electroplating zone, at least one plastic elongate mask, mating means for releasably mating the mask with an elongate substrate, feeding means for feeding the mated mask and substrate through the electroplating zone so that, in use, only given areas of the substrate are plated, and a pin wheel having spokes extending radially therefrom, the mask comprising pin holes spaced along the mask so that, in use, adjacent pin holes of the mask are engageable with adjacent spokes of the pin wheel, and the spoke of the pin wheel being engageable with corresponding pin holes in an elongate substrate, said mating means comprising complementary location features positioned on the substrate and mask, respectively, said location features comprising corresponding projections and recesses, the projections being located on one of a substrate and the mask and the recesses being located on the other of the substrate and the mask.

9. An apparatus according to claim 8 wherein the thickness of the mask is no greater than 1 mm.

10. An apparatus according to claim 8 wherein the apparatus further comprises at least one support belt, which support belt, in use, supports a mated mask and substrate within the electroplating zone.

11. An apparatus according to claim 10 wherein the support belt is an endless belt, moveable in the same direction and the same speed, in use, as the mated mask and substrate, in the electroplating zone.

12. An apparatus according to claim 10 wherein the apparatus comprises two support belts which, in use, support the mask and substrate in the electroplating zone and are locatable between the mask and the electroplating zone, one support belt being locatable above the area of the substrate to be plated and one support being locatable below the area to be plated, both support belts, in use, extending longitudinally with respect to the mated mask and substrate.

13. An apparatus according to claim 12 further comprising a front support belt, locatable, in use, behind a substrate in the electroplating zone.

14. Apparatus according to claim 12 further comprising a second mask, adapted to be mated with an elongate substrate on another side of the elongate substrate from the first mask, and two further support belts, which, in use, support the second mask and substrate and which, in use, are locatable between the second mask and the electroplating zone, one belt locatable above the area to be plated and one belt locatable below the area to be plated, the electroplating zone being adapted to simultaneously plate areas on two sides of the elongate substrate.

15. Apparatus according to claim 12 wherein the gap between two support belts located on a single side of the substrate is adjustable.

16. Apparatus according to claim 10 wherein at least one support belt is 3-10 mm thick.

17. Apparatus according to claim 10 wherein at least one support belt comprises reinforced rubber.

18. Apparatus according to claim 17 wherein the reinforced rubber is a chloroprene, silastomer, or polyurethane.

19. Apparatus according to any one of claim 8 wherein the feeding means comprises rollers.

20. Apparatus according to claim 19, wherein the rollers are operable to feed at least one support belt through the electroplating zone.

21. Apparatus according to claim 8 wherein the feeding means further comprises a pin wheel.

22. Apparatus according to claim 8 wherein the electroplating zone comprises a jet plating apparatus.

23. Apparatus according to claim 8 wherein the mask is an endless band.

24. A method of continuously electroplating an elongate substrate, the method comprising providing a thin plastic elongate mask having location features including dimples, moulded inserts of plastic, stamped-in metal studs, pins or rivets, apertures all adapted to engage with corresponding features on an elongate substrate to be plated, or pin holes spaced at regular intervals such that each adjacent pin hole is engageable with an adjacent spoke of a pin wheel, mating an elongate substrate with the mask so that only given areas of the substrate are exposed by the mask, feeding the mated substrate mask through an electroplating zone so that the given areas are electroplated, and releasing the electroplated substrate from the mask.