Semiconductor integrated circuit device
First Claim
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1. A semiconductor integrated circuit device comprising:
- an electronic circuit which includes an output section having at least a pair of output stage circuits, each one being separately supplied with a predetermined operation voltage from a voltage supply connection pad, said predetermined operation voltage being substantially of the same amplitude for each one of said at least a pair of output stage circuits; and
wiring layer means formed on the main surface of a semiconductor substrate of said semiconductor integrated circuit device to separately supply said predetermined operation voltage to each one of said at least a pair of output stage circuits of said electronic circuit;
wherein said wiring layer means is comprised of at least a first path and a second path respectively connected along opposite sides near the periphery of said substrate from said voltage supply connection pad which is located near one end on said substrate to individual ones of said at least a pair of output stage circuits of said electronic circuit output section which is located near an opposite end on said semiconductor substrate.
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Abstract
A semiconductor integrated circuit device in which a wiring layer which supplies a predetermined operation voltage to an electronic circuit has a decreased parasitic impedance. The wiring layer is constituted by a first path and a second path that are connected in parallel between a connection pad and the electronic circuit, or a second wiring layer that constitutes an AC loop is formed close to the first wiring layer which supplies the operation voltage, or the above-mentioned two structures are employed in combination.
14 Citations
32 Claims
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1. A semiconductor integrated circuit device comprising:
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an electronic circuit which includes an output section having at least a pair of output stage circuits, each one being separately supplied with a predetermined operation voltage from a voltage supply connection pad, said predetermined operation voltage being substantially of the same amplitude for each one of said at least a pair of output stage circuits; and wiring layer means formed on the main surface of a semiconductor substrate of said semiconductor integrated circuit device to separately supply said predetermined operation voltage to each one of said at least a pair of output stage circuits of said electronic circuit; wherein said wiring layer means is comprised of at least a first path and a second path respectively connected along opposite sides near the periphery of said substrate from said voltage supply connection pad which is located near one end on said substrate to individual ones of said at least a pair of output stage circuits of said electronic circuit output section which is located near an opposite end on said semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 18, 19, 28, 30)
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9. A semiconductor integrated circuit device comprising:
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an electronic circuit which includes an output section having at least a pair of output stage circuits, each one being separately supplied with a first predetermined operation voltage from a voltage supply connection pad; a first wiring layer formed on the main surface of a semiconductor substrate of said semiconductor integrated circuit device to separately supply said first predetermined operation voltage to each one of said at least a pair of output stage circuits of said electronic circuit, wherein said first wiring layer is comprised of at least a first path and a second path respectively connected along opposite sides near the periphery of said substrate from said voltage supply connection pad which is located near the periphery of one side of a four-sided semiconductor substrate to said output section of said electronic circuit which is located near the periphery of an opposite side thereof; and a second wiring layer formed on the main surface of said semiconductor substrate which includes wirings respectively disposed in close proximity with respect to the individual wiring paths which supply said first predetermined operation voltage close to said first wiring layer; wherein said second wiring layer forms an AC loop. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 20, 21, 29, 31)
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22. A wiring arrangement for a semiconductor integrated circuit device formed on a main surface of a rectangular-shaped semiconductor substrate including an electronic circuit disposed near the periphery of one side of said semiconductor substrate and which includes an output section having at least a pair of output stage circuits for providing at least a pair of external output signals at corresponding external output pads, wherein each output stage circuit is separately supplied with a first predetermined operation voltage from a voltage supply connection pad, comprising:
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a voltage supply pad disposed near the periphery on an opposite side of said semiconductor substrate from where said electronic circuit is disposed for providing said predetermined operation voltage; and at least one wiring layer for separately providing said first predetermined operation voltage to each one of said output stage circuits when power is applied to said voltage supply pad, said wiring layer being divided into at least a pair of separated current paths extending along opposite regions and near the peripheries of the remaining two sides of said rectangular-shaped semiconductor substrate between said voltage supply pad and respective supply terminals of said output stage circuits thereby preventing any adverse changes in the predetermined operation voltage by effectively reducing the parasitic self-inductance of the conductor pairs and avoiding mutual inductance thereat. - View Dependent Claims (23, 24, 25, 26, 27, 32)
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Specification