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Recessed thermally conductive packaged semiconductor devices

  • US 4,924,351 A
  • Filed: 04/10/1989
  • Issued: 05/08/1990
  • Est. Priority Date: 06/20/1985
  • Status: Expired due to Term
First Claim
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1. A packaged semiconductor device comprising:

  • a bed part having front surface and back surface;

    a semiconductor chip mounted on said front surface of said bed part;

    a first molded layer which seals said front surface of said bed part and said semiconductor chip to expose said back surface of said bed part;

    a heat sink having first and second main surfaces, and facing said back surface of said bed part on said first main surface thereof with a gap of a prescribed distance from said back surface of said bed part;

    a second molded layer formed to cover an outside of said heat sink and said first molded layer and fill said gap from one direction; and

    leads which pass through said second molded layer, of which ends are disposed inside said first molded layer, and which are connected to internal terminals of said semiconductor chip;

    wherein at least one of the back surface of said bed part and the first main surface of said heat sink is provided with a plurality of roughened recessed parts.

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