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Enhancement of ultraviolet laser ablation and etching organic solids

  • US 4,925,523 A
  • Filed: 07/17/1989
  • Issued: 05/15/1990
  • Est. Priority Date: 10/28/1988
  • Status: Expired due to Term
First Claim
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1. A method of ablating a portion of a substrate, comprising the steps of:

  • exposing said substrate to a first radiation pulse at a first ultraviolet wavelength; and

    exposing said substrate to a second radiation pulse at a second, longer ultraviolet wavelength, at least one of said first or second radiation pulses being of sufficient energy fluence to exceed the threshold for ablative photodecomposition of said substrate.

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