Broadband printed spiral

• US 4,926,292 A
• Filed: 08/09/1989
• Issued: 05/15/1990
• Est. Priority Date: 08/09/1989
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Company (HP Inc.), Kathy Y. Henn, Linda A. Blume
• Original Assignee: Avantek Inc. (HP Inc.)
• Inventors: Maple, Marshall
• Primary Examiner(s): Kozma, Thomas J.
• Application Number:
  US07/391,459
• Time in Patent Office: 279 Days
• Field of Search: 333/172, 333/185, 323/355, 361/402, 336/200, 336/232, 336/222, 29/592.1, 29/602.1, 29/610.1
• US Class Current: 361/765
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01L 27/016 Thin-film circuits
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A thin film printed circuit inductive element exhibiting low Q wherein a conductive spiral is deposited on an insulating substrate and resistive links are connected between adjacent turns of the spiral. Inherent resonance is thereby damped out.

Claims

1. A thin film printed circuit inductive element comprising:

(a) a substrate of insulating material having a principal planar surface;

(b) a layer of conducting material deposited on the planar surface in a spiral path;

(c) a plurality of resistive links which connect adjacent turns of the spiral path.

2. A thin film printed circuit inductive element according to claim 1, wherein the resistive links are deposited on the planar surface.

3. A thin film printed circuit inductive element according to claim 1, wherein the turns of the spiral path are rectangular in shape.

4. A thin film printed circuit inductive element according to claim 1, wherein the turns of the spiral path are circular in shape.

5. A thin film printed circuit inductive element according to claim 1, wherein the resistive links are approximately evenly spaced along the spiral path.

6. A thin film printed circuit inductive element according to claim 1, wherein the conductive material is comprised of a layer of titanium, a layer of platinum and a layer of electroplated gold.

8. A thin film printed circuit inductive element according to claim 2, wherein the resistive links are comprised of a layer of tantalum nitride.

9. A thin film printed circuit inductive element according to claim 1, wherein the resistive links have a turn-to-turn resistance of less than ten ohms.

7. A thin film printed circuit inductive element according to claim I, wherein the conductive material is comprised of a layer of titanium/platinum alloy and a layer of electroplated gold.

10. A thin film printed circuit inductive element according to claim 7, wherein the resistive links have a resistivity of approximately 60 Ω

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