Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston

• US 4,928,207 A
• Filed: 06/15/1989
• Issued: 05/22/1990
• Est. Priority Date: 06/15/1989
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Chrysler, Gregory, Simons, Robert E., Chu, Richard C.
• Primary Examiner(s): Envall, Jr., Roy N.
• Application Number:
  US07/366,945
• Time in Patent Office: 341 Days
• Field of Search: 361/385, 361/382, 361/384
• US Class Current: 361/700
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/4336 in combination with jet impingement
• CPC Class Codes: H01L 23/4338 Pistons, e.g. spring-loaded members

Abstract

In an improved circuit module with a flat chip-carrying substrate and cylindrical pistons that contact the chips for cooling, each piston has an axial bore that carries a dielectric liquid to the chip and the lower face of the piston (facing the chip) is spaced away from the chip to establish radial channels that carry the liquid across the surface of the chip. The face of the piston, as seen in a section through the axis, is shaped to provide a selected flow pattern across the surface of the chip. The piston face reduces the channel height in the direction of flow where the liquid is non-boiling and thereby offsets the tendency for the flow rate to decrease as the circumferential width of the channel widens. The piston face increases the channel height in the direction of flow where the liquid is boiling to handle the increase in volume caused by the vapor. In one embodiment, the piston carries a shroud around the chip which causes the coolant to flow across the edge of the chip to provide additional chip cooling and to impinge on the nearby region of the substrate that supports the chips to remove heat that flows from the chip to the substrate.

Claims

1. A circuit module, comprising:

a substrate having a chip carrying surface;

an array of chips located at chip sites on the chip carrying surface of the substrate;

a hat cooperating with the substrate to form an enclosed space for the chips, the hat comprising supply means for supplying a liquid coolant;

pistons located in the hat above the chip sites, each of the pistons having a bore, therethrough, connected to carry a liquid coolant from the supply means to one of the chips, and each of the pistons further having a lower face, the lower face having a radially symmetrical shape; and

spacer means located on the lower face, for contacting an upper surface of the one of the chips and for forming a gap between the lower face and the upper surface.

2. The circuit module of claim 1, wherein the lower face is shaped such that the gap between the lower face and the upper surface increases as a function of radial distance from the bore.

3. The circuit module of claim 1, wherein the lower face is shaped such that the gap between the lower face and the upper surface decreases as a function of radial distance from the bore.

4. The circuit module of claim 1, wherein the lower face is shaped such that a first portion of the gap between the lower face and the upper surface decreases as a function of radial distance from the bore and a second portion of the gap between the lower face and the upper surface increases as a function of radial distance from the bore.

5. The circuit module of claim 1, wherein the upper surface comprises an area within which coolant boiling begins, the area having a predetermined radius and wherein the lower face slopes downward inside the radius and slopes upward outside the radius.

6. The circuit module of claim 1 wherein the spacer means comprises bumps on the lower face.

7. The circuit module of claim 1 wherein the spacer means comprises radial fins disposed to form pie shaped channels on the upper surface.

8. The circuit module of claim 1 wherein the spacer means comprises vane fins disposed to form non-radial channels on the upper surface.

9. The circuit module of claim 1 wherein the pistons further comprise a shroud, the shroud being disposed around the one of the chips and forming a coolant flow path across an edge of the one of the chips and radially across the substrate.

10. A circuit module, comprising:

a substrate having a chip carrying surface;

an array of chips located at chip sites on the chip carrying surface of the substate;

a hat cooperating with the substrate to form an enclosed space for the chips, said hat comprising supply means for supplying a liquid coolant;

pistons located in the hat above the chip sites, each of the pistons having a bore, therethrough, connected to carry a liquid coolant from the supply means to one of the chips, and each of the pistons further having lower face, the lower face having a radially symmetrical shape; and

a spacer comprising a plurality annularly disposed fins, the spacer being disposed on the lower face so that said fins contact an upper surface of the one of the chips and form a plurality of channels thereon.

11. A circuit module, comprising:

a substrate having a chip carrying surface;

an array of chips located at chip sites on the chip carrying surface of the substrate;

a hat cooperating with the substrate to form an enclosed space for the chips, said hat comprising supply means for supplying a liquid coolant;

pistons located in the hat above the chip sites, each of the pistons having a bore, therethrough, connected to carry a liquid coolant from the supply means to one of the chips, and each of the pistons further having lower face, the lower face having a radially symmetrical shape; and

spacer means located on the lower face, for contacting an upper surface of the one of the chips for spacing the lower face from the upper surface, the lower face and the upper surface being disposed to have a gap therebetween that varies as a function of radial distance from the bore.