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Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston

  • US 4,928,207 A
  • Filed: 06/15/1989
  • Issued: 05/22/1990
  • Est. Priority Date: 06/15/1989
  • Status: Expired due to Fees
First Claim
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1. A circuit module, comprising:

  • a substrate having a chip carrying surface;

    an array of chips located at chip sites on the chip carrying surface of the substrate;

    a hat cooperating with the substrate to form an enclosed space for the chips, the hat comprising supply means for supplying a liquid coolant;

    pistons located in the hat above the chip sites, each of the pistons having a bore, therethrough, connected to carry a liquid coolant from the supply means to one of the chips, and each of the pistons further having a lower face, the lower face having a radially symmetrical shape; and

    spacer means located on the lower face, for contacting an upper surface of the one of the chips and for forming a gap between the lower face and the upper surface.

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