Insulating arrangement for optical insulation of integrated components and the method of manufacture

• US 4,929,515 A
• Filed: 01/27/1989
• Issued: 05/29/1990
• Est. Priority Date: 02/19/1988
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Matz, Richard, Zirrgiebel, Jutta
• Primary Examiner(s): Zimmerman, John J.
• Application Number:
  US07/302,480
• Time in Patent Office: 487 Days
• Field of Search: 250/578, 250/211 R, 357/16, 357/48, 357/52, 357/84, 357/30, 357/17, 428/596, 428/614, 428/620, 428/642, 428/615
• US Class Current: 428/614
• CPC Class Codes: G02B 6/122 Basic optical elements, e.g. light-guiding paths
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/12528 Semiconductor component
• CPC Class Codes: Y10T 428/12681 Ga-, In-, Tl- or Group VA metal-base component

Abstract

An isolating arrangement for isolating a portion of a substrate from the remaining portions of the substrate, characterized by the arrangement comprising a pair of obliquely extending slots which merge with each other in the interior of the substrate to isolate a portion or region of the substrate from the remaining portion, except at least one end of the portion extending between the slots. The slots are preferably formed by a laser-induced, wet-chemical etching and, subsequent to forming the slots, they can be filled with a material, such as metal or a ternary absorber material, to increase the isolation of the substrate region or portion.

Claims

1. An arrangement for optical insulation of an optical component on a substrate for integrated optical devices, said arrangement comprising insulating means for insulating a substrate region from a remaining portion of the substrate, said insulating means being formed by at least two slots formed in the substrate and extending obliquely in from a substrate surface to intersect each other in the interior of the substrate to form a substrate region therebetween having a monolithic connection to the remaining portion of the substrate at least at one end, said substrate region having a size determined by the spacing of the slots at the surface of the substrate and a length defined by the length of the two slots.

2. An arrangement according to claim 1, wherein the substrate is composed of InP.

3. An arrangement according to claim 2, wherein at least one of the slots is filled with a metal.

4. An arrangement according to claim 2, wherein at least one of the slots is provided with a ternary absorber material.

5. An arrangement according to claim 1, wherein at least one of the slots is filled with a ternary absorber material.

6. An arrangement according to claim 1, wherein at least one of the slots is filled with a metal.