Wafer prober

• US 4,929,893 A
• Filed: 10/04/1988
• Issued: 05/29/1990
• Est. Priority Date: 10/06/1987
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Ukaji, Takao, Yamaguchi, Nobuhito, Sato, Mitsuya, Murakami, Eiichi, Ohmori, Taro
• Primary Examiner(s): Eisenzopf, Reinhard J.
• Assistant Examiner(s): Nguyen, Vinh P.
• Application Number:
  US07/252,997
• Time in Patent Office: 602 Days
• Field of Search: 324/158 F, 324/158 P, 324/73 PC, 324/158 R, 324/73 R, 33/533, 33/557, 364/552, 364/559, 358/101, 358/106, 382/8, 356/401, 356/400
• US Class Current: 324/750.19
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

A wafer prober usable with a probe card for examination of chips formed on a wafer is disclosed. The wafer prober has a function for automatically aligning bonding pads of each chip with probe needles of the probe card. The prober includes a contact plate movable in X and Y directions with a wafer chuck. The contact blade is pressed against at least one of the tips of the probe needles, and the thus contacted needle tip is observed by a TV camera from the underneath of the contact plate. The video signal obtained thereby is used for the alignment between the bonding pads and the probe needles. Also, the TV camera is moved in the X and Y directions with the wafer chuck to allow that one and the same reference mark is observed by this TV camera and by another TV camera provided for image-taking the bonding pads. With the proposed structure, the bonding pads and the probe needles can be aligned automatically and accurately.

Claims

1. A wafer prober, comprising:

a wafer chuck for holding a wafer;

an X-Y stage for moving said wafer chuck in X and Y directions;

a contact plate;

a driving mechanism for moving said contact plate in a Z direction relatively to said X-Y stage;

detecting means for detecting information which can be used to press contact said contact plate against at least one of tips of probe needles of a probe card with use of said X-Y stage and said driving mechanism;

image pickup means for observing said at least one needle tip press contacted to said contact plate, from a side of said contact plate opposite to the side thereof engaged by said at least one needle tip; and

processing means for processing a signal from said image pickup means to obtain information to be used for alignment of the probe needles with the wafer.

2. A wafer prober according to claim 1, wherein said detecting means includes a light source for projecting a light beam along a wafer holding surface of said wafer chuck and a photoelectric detector for photoelectrically detecting the light beam.

3. A wafer prober according to claim 2, wherein said detecting means detects the position of at least one of the tips of the probe needles with respect to the X and Y directions, on the basis of a photoelectric output of said photoelectric detector obtained when the light beam is scanned by said X-Y stage relatively to the probe needles.

4. A wafer prober according to claim 3, wherein said detecting means detects the position of at least one of the tips of the probe needles in the Z direction, on the basis of an output of said photoelectric detector obtained when the scan of the light beam by said X-Y stage is repeated while moving the light beam in the Z direction relative to the holding surface of said wafer chuck.

5. A wafer prober according to claim 3, wherein said detecting means includes a touch plate, a deformable member for supporting said touch plate and a semiconductor strain gauge fixed to said deformable member and wherein said detecting means detects the position of at least one of the tips of the probe needles in the Z direction, on the basis of an output of said semiconductor strain gauge as obtained when said touch plate is pressed in the Z direction against said at least one needle tip.

6. A wafer prober according to claim 1, wherein means are provided for rotating the probe card in a θ

direction to thereby correct an error in the θ

direction between the wafer and the probe needles and wherein means are provided for moving said wafer chuck through said X-Y stage in at least one of the X and Y directions for sequential examination of plural chips on the wafer by use of the probe needles.

7. A wafer prober according to claim 1, wherein means are provided for rotating said wafer chuck in a θ

direction to thereby correct an error in the θ

direction between the wafer and the probe needles and wherein means are provided for moving said wafer chuck, through said X-Y stage, with an inclination of an angle corrected with respect to one of the X and Y directions, for sequential examination of plural chips on the wafer by use of the probe needles.

8. A wafer prober according to claim 1, wherein means are provided for detecting a relative positional relationship among the probe needles on the basis of an imagewise signal from said image pickup means and also to provide an alarm when the detected positional relationship is out of a predetermined tolerable state.

9. A wafer prober, comprising:

a wafer chuck for holding a wafer;

a stage for moving said wafer chuck so that grouped probe needles of a probe card are contacted in a sequence to bonding pads of chips of the wafer;

first image pickup means for observing at least one bonding pad and for producing a first imagewise signal;

second image pickup means for observing at least one of tips of the probe needles and for producing a second imagewise signal;

reference providing means for providing a reference for coordination of said first and second signals;

wherein said reference can be observed through at least one of said first and second image pickup means; and

signal processing means for detecting information for use in alignment of the probe needles with the bonding pads of each chip, on the basis of the first and second signals and the reference.

10. A wafer prober according to claim 9, wherein said reference providing means forms a light spot at a position between objective lenses of said first and second image pickup means.

11. A wafer prober according to claim 9, wherein said reference providing means includes a reference member which is in a predetermined positional relationship with an objective lens of one of said first and second image pickup means.

12. A wafer prober according to claim 11, wherein said reference member comprises a pattern provided on a barrel of said objective lens.

13. A wafer prober comprising:

a wafer chuck for holding a wafer for movement in X and Y directions;

a contact plate;

a driving mechanism for moving said contact plate in a Z direction relatively to said X-Y stage;

image pickup means having higher and lower magnifications in respect to the image pickup, for observing at least one of tips of probe needles of a probe card, from a side of said contact plate opposite to a side thereof facing the probe needles; and

magnification changing means operable to set the lower magnification of said image pickup means when said image pickup means is to be used to detect information which can be used to press contact said contact plate against said at least one needle tip with use of said X-Y stage and said driving mechanism, said magnification changing means being operable also to set the higher magnification when said image pickup means is to be used to observe said at least one needle tip press contacted to said contact plate, for detection of information for alignment of the probe needles with the wafer.

14. A wafer prober, comprising:

an X-Y stage for supportingly moving a wafer in X and Y directions;

a contact plate;

a driving mechanism for moving said contact plate in a Z direction relatively to said X-Y stage;

detecting means for detecting information which can be used to press contact said contact plate against at least one of tips of probe needles of a probe card with use of said X-Y stage and said driving mechanism;

first image pickup means for observing said at least one needle tip press contacted to said contact plate, from a side of said contact plate opposite from a side thereof engaged by said at least one needle tip;

second image pickup means for observing the wafer; and

processing means for processing a signal from said first image pickup means to obtain information on the basis of which said X-Y stage can be actuated so that a bonding pad of the wafer is positioned in a range of observation of said second image pickup means.