Process for preparing integrated circuit dies for mounting
First Claim
1. A process for preparing integrated circuit dies for mounting on a substrate comprising,making holes through a wafer having a plurality of integrated circuit dies in which the dies include pads thereon connected to integrated circuits in the dies, said holes being placed between the dies and adjacent the pads,placing a layer of insulating material over the wafer and in the outer periphery of the holes,adding an electrically conductive connection between the top of each pad and the inside of the insulating material in an adjacent hole, andseparating the plurality of dies from each other along lines extending through the holes between the dies.
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Accused Products
Abstract
Integrated circuit dies, while still in wafer form, are prepared for surface mounting direct to a substrate without requiring packaging. Holes are made through a wafer having a plurality of integrated circuit dies and are placed between the dies and adjacent the die pads. A layer of insulating material is placed on the wafer and in the outer periphery of the holes. An electrically conductive connection is made between the top of each pad and the inside of the insulating material in an adjacent hole. The dies are separated from each other and may be surface mounted to a substrate by soldering.
81 Citations
8 Claims
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1. A process for preparing integrated circuit dies for mounting on a substrate comprising,
making holes through a wafer having a plurality of integrated circuit dies in which the dies include pads thereon connected to integrated circuits in the dies, said holes being placed between the dies and adjacent the pads, placing a layer of insulating material over the wafer and in the outer periphery of the holes, adding an electrically conductive connection between the top of each pad and the inside of the insulating material in an adjacent hole, and separating the plurality of dies from each other along lines extending through the holes between the dies.
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5. A process for preparing integrated circuit dies for mounting on a substrate comprising,
making holes through a wafer having a plurality of integrated circuit dies in which the dies include pads thereon connected to integrated circuits in the dies, said holes being placed between the dies and adjacent the pads, placing a layer of insulating material over the wafer and in the outer periphery of the holes, removing the insulating material from the top of the pads, adding a metal connection between the top of each pad and the inside of the insulating material in said adjacent hole, and separating the plurality of dies from each other along lines passing through holes between the dies.
Specification