IC card and method of manufacturing the same

• US 4,931,853 A
• Filed: 09/06/1989
• Issued: 06/05/1990
• Est. Priority Date: 05/20/1986
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yoshida, Kenichi, Oodaira, Hirosi, Ohuchi, Masayuki
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): PRENTY, MARK V
• Application Number:
  US07/403,772
• Time in Patent Office: 272 Days
• Field of Search: 357/80, 357/74, 357/67, 357/68
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/96 the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01051 Antimony [Sb]
• CPC Class Codes: H01L 2924/01052 Tellurium [Te]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01076 : Osmium [Os]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.

Claims

1. An IC card, comprising an insulating core sheet formed of an insulating material and having a main surface, a bottom surface, and at least one through-hole, at least one semiconductor IC chip received within said hole, and having a main surface and a bottom surface, and at least one electrode, and at least one conductive layer pattern deposited on said core sheet, said conductive layer being connected to said electrode;

and said semiconductor IC chip being thinner than said core sheet and including at least one conductive projection which is formed on said electrode and has top and side surfaces, said semiconductor IC chip being embedded in said core sheet by the insulating material so that the top surface of said conductive projection and the bottom surface of said IC chip are flush with the main surface and bottom surface of the core sheet, respectively;

said conductive layer pattern being deposited on the main surface of said core sheet; and

the side surface of said conductive projection and only the peripheral portion of the main surface of said IC chip being covered with the material of said core sheet and said conductive layer pattern being connected with said conductive projection at said top surface.

2. The IC card according to claim 1, wherein said conductive projection is prepared from a softer material than said semiconductor IC chip.

3. The IC card according to claim 2, wherein said conductive projection is prepared from at least one metal selected from the group consisting of Au, Cu, Ag, Al, Zn, Pd, Sn, Os, Pt and Ir.

4. The IC card according to claim 2, wherein said conductive projection is made of an alloy prepared from at least two metals selected from the group consisting of Pd, Sn, In, Ag, Ga, Au, Bi, Te, Ge and Sb.

5. The IC card according to claim 2, wherein said conductive projection is prepared from a mass composed of a metal and a resin.

6. The IC card according to claim 1, wherein said core sheet comprises a thermoplastic core sheet, and said conductive projection is formed in such a manner that a distance from the top surface of said conductive projection to that of said semiconductor IC chip is defined to be equal to or longer than a measurement arrived at by subtracting the thickness of said semiconductor IC chip from that of said thermoplastic core sheet.

7. The IC card according to claim 1, wherein said thermoplastic core sheet is prepared from at least one resin selected from the group consisting of polycarbonate, polyvinyl chloride, polyvinyl chloride-acetate copolymer, polysulfone, polyethylene terephthalate, polyetherketone, polymethylpenten, polyallylate, polyether-sulfone, polyether-imide, polyphenylene-sulfide and ABS.

8. The IC card according to claim 1, wherein said core sheet comprises a thermoplastic core sheet, and said conductive layer pattern is printed on the surface of the thermoplastic resin core sheet by means of conductive paste formed by kneading at least one of the groups consisting of metal powder, metal alloy powder and metal oxide powder with a resin, said metal powder being prepared from at least one metal selected from the group consisting of Au, Ag, Cu, Pt, Ni, Sn, W, Mo, Pd, SiC, C and RuO₂ and said metal alloy powder being formed of a metal alloy composed of at least two of metal group.

9. The IC card according to claim 1, wherein said conductive layer pattern is prepared by depositing at least one metal selected from the group consisting of Au, Ag, Cu, Pt, Ni, Sn, W and Mo on the main surface of said core sheet by one of the following processes:

vacuum depositing, sputtering, and electroless plating, and then patterning said deposited metal layer by means of photolithography.