Light emitting diode array chip and method of fabricating same
First Claim
1. An LED array chip, comprising:
- a first semiconductor layer having a first type of conduction;
a second semiconductor layer having a second type of conduction opposite to the first type, and possessing a forbidden band width smaller than that of the first layer, the second layer being disposed on the first layerthe second layer being divided into first and second separated regions, the first region being divided to define a plurality of individual LEDs of predetermined configuration, and the second region including a common region;
individual electrodes respectively provided at the surfaces of the LEDs; and
a common electrode provided in the common region,parts of the exposed surface of the first layer respectively registered with the LEDs serving as light emitting surfaces.
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Abstract
An LED array chip comprising; a first semiconductor layer having p-type conduction; a second semiconductor layer having a n-type conduction, possessing forbidden band width smaller than the first layer and provided on the first layer, so as to form a semiconductor chip having a pn junction at the interface with the first layer; the second layer being divided into a first region and a second region by etching the second layer through to the pn junction, the first region thereof being divided to form individual plural LEDs of predetermined configuration, and the n-type layer in the second region being converted to the p-type layer as so to serve as a common region; individual electrodes respectively provided to the surfaces of the LEDs; and a common electrode provided to the common region, parts of the exposed surface of the p-type layer corresponding to the LEDs serving as light emitting surfaces. The LED array chip is mounted on a printed circuit board by directly bonding the individual electrodes and the common electrode to the corresponding electrode pads of the printed circuit.
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Citations
20 Claims
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1. An LED array chip, comprising:
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a first semiconductor layer having a first type of conduction; a second semiconductor layer having a second type of conduction opposite to the first type, and possessing a forbidden band width smaller than that of the first layer, the second layer being disposed on the first layer the second layer being divided into first and second separated regions, the first region being divided to define a plurality of individual LEDs of predetermined configuration, and the second region including a common region; individual electrodes respectively provided at the surfaces of the LEDs; and a common electrode provided in the common region, parts of the exposed surface of the first layer respectively registered with the LEDs serving as light emitting surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of fabricating an LED array chip, comprising the steps of:
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(A) fabricating a p-type substrate; (B) forming on the p-type substrate an n-type layer processing a ratio of mixed crystal smaller than that of the substrate, and defining of pn junction at the interface with the substrate; (C) etching the n-type layer through to the pn junction so as to divide the n-type layer into a first region and a second region; (D) dividing the first region of the n-type layer so as to form a plurality of individual LEDs; (E) forming a common region in the second region of the n-type layer; (F) forming a common electrode in the second region; and (G) forming individual electrodes on the LEDs respectively. - View Dependent Claims (18, 19, 20)
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Specification